EP2A25F672I6 vs EP2A25F672C8N Karşılaştırma
Ayrıntılı yan yana karşılaştırma EP2A25F672I6 tarafından Intel ve EP2A25F672C8N tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | EP2A25F672I6 | EP2A25F672C8N |
|---|---|---|
| Marka | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | NRND | NRND |
| Family | APEX II | APEX II |
| Logic Elements (typical gates) | 25,000 | — |
| Fabric Architecture | SRAM-based LUT | — |
| Process Technology | 0.18 µm CMOS | — |
| Paket | 672-ball FineLine BGA (FBGA-672) | 672-ball FC-FBGA (FineLine BGA) |
| Core Voltage | 1.5 V | — |
| Configuration Method | External SRAM configuration device (EPC series) | — |
| Temperature Grade | Industrial (-40 °C to +100 °C ambient) | — |
| Speed Grade | 6 | C8 |
| Embedded Memory | Embedded System Blocks (ESB), dual-port RAM / CAM | — |
| DSP Blocks | MultiCore dedicated multipliers | — |
| Boundary Scan | JTAG (IEEE 1149.1) compliant | — |
| Clock Management | Dedicated PLL / clock tree circuitry | — |
| I/O Bank Count | [DATA_NEEDED: number of user I/O banks] | — |
| RoHS Durumu | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| MSL Seviyesi | [DATA_NEEDED: moisture sensitivity level] | — |
| Montaj Türü | Surface Mount (BGA) | Surface Mount |
| Technology Node | — | 0.15 um all-layer copper process |
| System Gates | — | 900,000 |
| Logic Elements / Cells | — | 24,320 |
| Maximum Internal Frequency | — | 333 MHz |
| Propagation Delay | — | 1.69 ns |
| User I/Os | — | 492 |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Core Supply Voltage | — | 1.5 V |
| İşletim Sıcaklığı | — | 0 C to 85 C (commercial) |
| Multi-Gigabit Transceiver Rate | — | Up to 1 Gbps per channel |
| Lead-Free Suffix | — | N (lead-free, Pb-free finish) |