EP2SGX30CF780C3 vs EP2SGX30CF780C6 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX30CF780C3 sa pamamagitan ng Intel at EP2SGX30CF780C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2SGX30CF780C3 EP2SGX30CF780C6
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete NRND
Family Stratix II GX Stratix II GX
Logic Elements 33,880 —
Logic Array Blocks (LABs) 1,694 —
Embedded RAM Bits 1,369,728 —
User I/Os 361 —
Packhaging 780-ball FineLine BGA 780-ball FineLine BGA (F780)
Process Node 90 nm —
Speed Grade -3 C6 (commercial, mid-speed)
Temperature na Operasyon 0C to +85C (commercial) 0C to +85C (commercial)
Transceivers Embedded (GX family, up to 3.125 Gbps per channel) —
Memory Interfaces DDR / DDR2 / QDRII PHY —
Uri ng Pagpapasok Surface Mount (BGA) —
Tindminan RoHS Compliant [DATA_NEEDED: RoHS status]
Lead-Free Yes [DATA_NEEDED: lead-free status]
Wala sa Halogen [DATA_NEEDED: halogen-free status] —
Series — EP2SGX
Logic Elements (LE) — 33,880
Adaptive Logic Modules (ALM) — 13,540
Embedded Memory Bits — 1,369,728 bits (171 KBytes)
Embedded Multiplier 18x18 — 64 (estimated, datasheet required for exact count)
User I/O Pins — 361
High-Speed Transceivers — Up to 8 channels (FPGA-dependent configuration)
Transceiver Data Rate — Up to 6.375 Gbps
Core Voltage — 1.2 V (typical)
Configuration Mode — Enhanced passive/active (EPC) supported
Process Technology — 90 nm

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita