EP2SGX30CF780C3 vs EP2SGX30CF780C6 比較

詳細並排比較 EP2SGX30CF780C3 由 Intel 與 EP2SGX30CF780C6 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2SGX30CF780C3 EP2SGX30CF780C6
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete NRND
Family Stratix II GX Stratix II GX
Logic Elements 33,880 —
Logic Array Blocks (LABs) 1,694 —
Embedded RAM Bits 1,369,728 —
User I/Os 361 —
封裝 780-ball FineLine BGA 780-ball FineLine BGA (F780)
Process Node 90 nm —
Speed Grade -3 C6 (commercial, mid-speed)
工作溫度 0C to +85C (commercial) 0C to +85C (commercial)
Transceivers Embedded (GX family, up to 3.125 Gbps per channel) —
Memory Interfaces DDR / DDR2 / QDRII PHY —
安裝類型 Surface Mount (BGA) —
RoHS 狀態 Compliant [DATA_NEEDED: RoHS status]
Lead-Free Yes [DATA_NEEDED: lead-free status]
無鹵素 [DATA_NEEDED: halogen-free status] —
Series — EP2SGX
Logic Elements (LE) — 33,880
Adaptive Logic Modules (ALM) — 13,540
Embedded Memory Bits — 1,369,728 bits (171 KBytes)
Embedded Multiplier 18x18 — 64 (estimated, datasheet required for exact count)
User I/O Pins — 361
High-Speed Transceivers — Up to 8 channels (FPGA-dependent configuration)
Transceiver Data Rate — Up to 6.375 Gbps
Core Voltage — 1.2 V (typical)
Configuration Mode — Enhanced passive/active (EPC) supported
Process Technology — 90 nm

資料表與資源

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