EP2SGX30DF780C7 vs EP2SGX30DF780C4 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX30DF780C7 sa pamamagitan ng Intel at EP2SGX30DF780C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP2SGX30DF780C4 EP2SGX30DF780C4 - Stratix II GX FPGA 33.8K LE FBGA-780 | Intel

EP2SGX30DF780C4 - Stratix II GX FPGA 33.8K LE FBGA-780 | Intel

EP2SGX30DF780C4 ✗ Tapus ng Buhay

Pagsanggunian na paghahambing

Parametro EP2SGX30DF780C7 EP2SGX30DF780C4
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Tapus ng Buhay
Family Stratix II GX Stratix II GX
Series Stratix II GX —
Logic Elements (LE) 33,880 —
Embedded Memory (bits) 1,369,728 —
Memory Blocks 482 (M512/M4K/M-RAM) —
DSP Blocks 24 —
18x18 Multipliers 192 —
Maximum User I/O 361 —
Speed Grade -7 —
Packhaging 780-Ball FBGA (DF780), 1.0 mm pitch FBGA-780 (780-FBGA, 29 x 29 mm, 1 mm pitch)
Temperature na Operasyon 0C to +85C (Commercial) —
Process Node 90 nm —
Core Voltage (VCCINT) 1.2 V (typ) —
Configuration PS / FPP / JTAG —
Transceiver Data Rate [DATA_NEEDED: SERDES data rate] —
Tindminan RoHS [DATA_NEEDED: RoHS status] Compliant (per manufacturer product page)
Logic Elements — 33,880
Logic Cells — 33,880
Number of LABs / CLBs — 1,694
Total Number of I/Os — 361
Maximum Operating Frequency — 717 MHz
Number of Transceivers — 20 (embedded multi-gigabit)
Core Voltage — 1.2 V
Uri ng Pagpapasok — Surface Mount
Process Technology — 90 nm CMOS
Operating Temperature Grade — Commercial (C4)
Programmable Terminals — BGA ball grid (780 terminals)
Package Code — BGA
Package Shape — Square
Level ng MSL — [DATA_NEEDED: MSL level]
Lead-Free — Yes

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