EP2SGX90EF1152C3 vs EP2SGX90EF1152I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX90EF1152C3 sa pamamagitan ng Intel at EP2SGX90EF1152I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2SGX90EF1152C3 | EP2SGX90EF1152I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Series | Stratix II GX | Stratix II GX |
| Logic Elements (LEs) | 90,960 | — |
| Total RAM Bits | 4,520,448 (4.5 Mbit) | 4,520,448 |
| User I/O Count | 558 | — |
| Number of LABs/CLBs | 4548 | — |
| Packhaging | 1152-FBGA (FineLine BGA) | — |
| Number of Transceivers | 12 | — |
| Transceiver Data Rate | 3.125 - 6.375 Gbps | — |
| Number of PLLs | 4 | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Speed Grade | C3 | — |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Logic Elements | — | 90,960 |
| Adaptive Logic Modules (ALMs) | — | 558 |
| Equivalent Logic Cells (CLBs) | — | 90,960 |
| Maximum Operating Frequency | — | 622.08 MHz |
| Core Supply Voltage (VCCINT) | — | 1.2 V nominal (1.15 V to 1.25 V) |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Package Type | — | 1152-ball FC-FBGA (flip-chip) |
| Terminal Form | — | Ball |
| Terminal Pitch | — | [DATA_NEEDED: ball pitch] |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Configuration Architecture | — | Enhanced Configuration (EPC) devices supported |