EP3CLS70F780C8 vs EP3CLS70F780I7N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS70F780C8 sa pamamagitan ng Intel at EP3CLS70F780I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3CLS70F780C8 EP3CLS70F780I7N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Cyclone III LS —
Logic Elements (LE) 70,208 —
Logic Array Blocks (LAB) 4,463 —
Embedded Memory Bits 3,068,928 bit —
Embedded Memory (M9K blocks) 305 —
Embedded 18x18 Multipliers 244 —
Maximum User I/O Pins 413 —
Maximum Operating Frequency 402 MHz —
Process Technology 65 nm TSMC low-power CMOS —
Core Supply Voltage 1.2 V —
Packhaging 780-ball FineLine BGA (FBGA-780) —
Temperature ng Junction na Operasyon 0 °C to +85 °C (commercial) —
PLLs 4 general-purpose PLLs —
Global Clock Networks 20 —
Security Features AES bitstream encryption, JTAG tamper protection —
Configuration Scheme Active serial (AS), passive serial (PS), JTAG, Fast Passive Parallel (FPP) —
Tindminan RoHS Compliant unknown
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Device Type — Field Programmable Gate Array (FPGA)
Series — Cyclone III LS
Logic Elements — 70,208
Embedded Memory — 3,068,928 bits
Maximum User I/O — 413 pins
Volte ng Pagbibigay — 1.2 V
Temperature Grade — Industrial
Package Type — BGA
Package Pin Count — 780 balls
Package Shape — Square
Terminal Form — Ball
Configuration Technology — SRAM-based FPGA
Configuration Method — [DATA_NEEDED: configuration method]
Temperature na Operasyon — [DATA_NEEDED: operating temperature]
REACH Status — unknown
AEC-Q100 Qualification — unknown

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