EP3SE260H780C4 vs EP3SE260H780C2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C4 sa pamamagitan ng Intel at EP3SE260H780C2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260H780C4 - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel / Altera
EP3SE260H780C4 ObsoleteIntel
EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel
EP3SE260H780C2N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260H780C4 | EP3SE260H780C2N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Family | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| Total Memory Bits | 16,672,640 bits | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| User I/Os | 488 | — |
| Embedded Multipliers (18x18) | 576 | — |
| Distributed Memory | 1,020 Kbits | — |
| Number of PLLs | 8 | — |
| Core Voltage | 0.9 V | 0.9 V |
| Auxiliary Voltage | 1.1 V | — |
| Process Technology | 65 nm | — |
| Speed Grade | C4 | C2 |
| Packhaging | 780-ball FCBGA (H780) | 780-BGA FCBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Series | — | Stratix III E |
| LABs / CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 |
| User I/O Count | — | 488 |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Hanay ng Temperature na Operasyon | — | Commercial (0C to +85C) |
| Level ng MSL | — | 3 (168 hours) |
| Reflow Peak Time Max | — | 40 s |
| Lead-Free | — | [DATA_NEEDED: lead-free] |
| Package Code | — | BGA |
| Terminal Form | — | Ball |
| Number of Terminals | — | 780 |
| Process Node | — | 40 nm |