EP3SE50F484C3N vs EP3SE50F484C3G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F484C3N sa pamamagitan ng Intel at EP3SE50F484C3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE50F484C3N EP3SE50F484C3G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete NRND
Family Stratix III E Stratix III E
Device Logic Elements 47,500 —
Logic Array Blocks (LABs) 1,900 —
Adaptive Logic Modules (ALMs) 18,750 19,000
Embedded Memory (Bits) 5,760,000 —
User I/Os 296 —
Maximum Internal Frequency 717 MHz (typical); 800 MHz per DigChip —
Process Technology TSMC 40 nm low-power CMOS —
Packhaging 484-ball FBGA (FCBGA), 1.0 mm pitch 484-ball FCBGA (F484), 1.0 mm pitch
Volte ng Pagbibigay Core and I/O voltages per Stratix III E datasheet —
Temperature na Operasyon 0C to +85 C (commercial, C suffix) 0C to +85C (commercial, "C")
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Level ng MSL 3 (per JEDEC J-STD-020 for FCBGA packages) —
Tindminan RoHS Lead-free (per DigiKey listing) Compliant (lead-free)
Configuration Mode Passive Serial, Fast Passive Parallel, Fast Active Serial, JTAG —
Design Software Intel Quartus II (Stratix III support) —
Katayuan ng Lifecycle Obsolete (per Worldway listing 2026-04-05) —
Logic Elements — 47,500
Total Embedded Memory — 5,760,000 bits (5.76 Mbit)
M9K Memory Blocks — 320 (2,304 Kbits)
M144K Memory Blocks — 12 (1,728 Kbits)
User I/O Pins — 296
18x18 Multipliers — 384
PLLs — 4
Global Clock Networks — 16
Speed Grade — C3
Process Node — 65 nm TSMC low-power
Core Voltage — 1.1 V

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