EP3SE50F780C4L vs EP3SE50F780C4G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F780C4L sa pamamagitan ng Intel at EP3SE50F780C4G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE50F780C4L EP3SE50F780C4G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Aktibo
Series Stratix III E Stratix III
Family Stratix III Stratix III E
Logic Elements (LE) 47,500 —
Embedded Memory 5,760,000 bits 5.76 Mbit (5760000 bit)
User I/Os 488 —
DSP Blocks (18x18 multipliers) 304 (19x16) —
Packhaging 780-ball FCBGA (Flip-Chip BGA) 780-ball FBGA (FCBGA)
Process Node 40 nm —
Core Voltage 1.1 V —
Speed Grade C4 (commercial, speed 4) —
Lead-Free (L suffix) Yes —
Configuration Method Passive Serial / Fast Passive Parallel / JTAG / Enhanced —
Temperature na Operasyon [DATA_NEEDED: full industrial/commercial grade] —
Tindminan RoHS Compliant (lead-free) Compliant
Transceivers [DATA_NEEDED: per Stratix III E variant] —
PLLs [DATA_NEEDED: PLL count] —
Logic Elements — 47,500 LE
Adaptive Logic Modules (ALMs) — 19,000 ALM
Number of I/Os — 488
Number of Logic Array Blocks (LABs) — [DATA_NEEDED: LAB count from datasheet]
Number of Multipliers (18x18) — [DATA_NEEDED: 18x18 multiplier count]
Process Technology — 40 nm TSMC
Core Supply Voltage — 1.1 V
Hanay ng Temperature na Operasyon — 0 C to +85 C (commercial)
Uri ng Pagpapasok — Surface Mount (SMD/SMT)
Lead-Free — Yes
Level ng MSL — MSL3 (per JEDEC J-STD-020)
Configuration Memory — SRAM-based (volatile, requires configuration device)
Design Software — Quartus II

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