EP3SE50F780C4L vs EP3SE50F780C4G 比較

詳細並排比較 EP3SE50F780C4L 由 Intel 與 EP3SE50F780C4G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE50F780C4L EP3SE50F780C4G
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND 啟用中
Series Stratix III E Stratix III
Family Stratix III Stratix III E
Logic Elements (LE) 47,500 —
Embedded Memory 5,760,000 bits 5.76 Mbit (5760000 bit)
User I/Os 488 —
DSP Blocks (18x18 multipliers) 304 (19x16) —
封裝 780-ball FCBGA (Flip-Chip BGA) 780-ball FBGA (FCBGA)
Process Node 40 nm —
Core Voltage 1.1 V —
Speed Grade C4 (commercial, speed 4) —
Lead-Free (L suffix) Yes —
Configuration Method Passive Serial / Fast Passive Parallel / JTAG / Enhanced —
工作溫度 [DATA_NEEDED: full industrial/commercial grade] —
RoHS 狀態 Compliant (lead-free) Compliant
Transceivers [DATA_NEEDED: per Stratix III E variant] —
PLLs [DATA_NEEDED: PLL count] —
Logic Elements — 47,500 LE
Adaptive Logic Modules (ALMs) — 19,000 ALM
Number of I/Os — 488
Number of Logic Array Blocks (LABs) — [DATA_NEEDED: LAB count from datasheet]
Number of Multipliers (18x18) — [DATA_NEEDED: 18x18 multiplier count]
Process Technology — 40 nm TSMC
Core Supply Voltage — 1.1 V
工作溫度範圍 — 0 C to +85 C (commercial)
安裝類型 — Surface Mount (SMD/SMT)
Lead-Free — Yes
MSL 等級 — MSL3 (per JEDEC J-STD-020)
Configuration Memory — SRAM-based (volatile, requires configuration device)
Design Software — Quartus II

資料表與資源

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