EP3SL200H780I4N vs EP3SL200H780I4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200H780I4N sa pamamagitan ng Intel at EP3SL200H780I4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel
EP3SL200H780I4N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SL200H780I4N | EP3SL200H780I4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Series | Stratix III L | Stratix III L |
| Family | Stratix III (Logic-rich variant) | Stratix III |
| Logic Elements | 200,000 | — |
| Logic Array Blocks (LABs) | 8,000 | 8000 |
| Embedded Memory (bits) | 10,901,504 | — |
| User I/Os | 488 | — |
| Core Voltage | 1.1 V (0.86 V to 1.15 V range) | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Fabric Frequency (typical) | 450 MHz | — |
| Speed Grade | I4 | I4 (industrial) |
| Hanay ng Temperature na Operasyon | -40C to +100C (industrial) | — |
| Packhaging | 780-ball FCBGA (Flip-Chip BGA, FineLine) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Lead-Free | Yes (suffix N) | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 200,000 |
| Embedded Memory Bits | — | 10,901,504 |
| User I/O Count | — | 488 |
| DSP Multipliers (18x18) | — | 384 |
| Voltage - Core Supply | — | 1.1 V |
| Package Type | — | 780-BBGA / FCBGA (FC-HFBGA) |
| Package Dimensions | — | 33 mm x 33 mm |
| Temperature ng Junction na Operasyon | — | -40C to +100C (industrial) |
| Configuration Memory | — | SRAM-based, volatile |
| Design Tool | — | Quartus II (legacy) / Quartus Prime |