EP3SL50F484C4L vs EP3SL50F484C4LG Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F484C4L sa pamamagitan ng Intel at EP3SL50F484C4LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL50F484C4L EP3SL50F484C4LG
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obs Aktibo
Family Stratix III L FPGA - Field Programmable Gate Array
Logic Elements (LE) 47,500 —
Logic Array Blocks (LABs) 1,900 —
User I/O Count 296 —
Total RAM Bits 2,184,192 —
Core Voltage 0.9 V —
Process Technology 65 nm CMOS —
Hanay ng Temperature na Operasyon 0°C to 85°C (commercial) —
Packhaging 484-ball FBGA (FineLine BGA) 484-FBGA (23x23 mm)
Uri ng Pagpapasok Surface Mount —
Maximum Fabric Frequency [DATA_NEEDED: maximum fabric frequency] —
DSP Blocks [DATA_NEEDED: DSP block count] —
Transceivers [DATA_NEEDED: number of transceivers] —
Level ng MSL 3 (per JEDEC J-STD-020) —
Tindminan RoHS Compliant Compliant
Design Software Quartus II —
Architecture Adaptive Logic Module (ALM) —
Series — Stratix III L
Number of Logic Elements (LE) — 47500
Number of LABs/CLBs — 1900
Adaptive Logic Modules (ALM) — 19000 ALM
Total Embedded Memory — 2184192 bit (2.08 Mbit)
Number of I/O — 296
Volte ng Pagbibigay — 0.86 V to 1.15 V (1.1 V typical)
Temperature na Operasyon — 0 C to +85 C (TJ)
Style ng Pagpapasok — SMD/SMT
Packhaging / Kaso — 484-BBGA, FCBGA
Packaging — Tray
Supplier Device Package — 484-FBGA
Speed Grade — C4 (commercial, slowest)
Process Node — 40 nm

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