EP4CGX110DF31I7 vs EP4CGX110DF31C8N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX110DF31I7 sa pamamagitan ng Intel at EP4CGX110DF31C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP4CGX110DF31I7 EP4CGX110DF31C8N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Series Cyclone IV GX —
Device Logic Elements 109,424 —
Total Memory Bits 5,621,760 —
Number of Logic Array Blocks (LABs) Not specified in provided data [DATA_NEEDED: LAB count] —
Number of I/O 475 user I/O —
Multipliers (18x18) 432 —
PLLs 4 4 general-purpose PLLs
Transceivers 8 (up to 3.125 Gbps) 8 high-speed transceivers up to 3.125 Gbps
M9K Memory Blocks 270 —
Packhaging 896-BGA (FBGA-896), 31 mm 896-ball FineLine BGA (F31), 31 mm
Ball Pitch 0.8 mm —
Speed Grade -7 8
Temperature Grade Industrial (-40C to +100C Tj) —
Core Voltage 1.2 V typical —
Configuration Method SRAM (EPCS or JTAG) —
Uri ng Pagpapasok Surface Mount —
Level ng MSL 3 (per JEDEC J-STD-020) [DATA_NEEDED: floor life days] —
Tindminan RoHS Compliant Compliant
Family — Cyclone IV GX
Logic Elements — 109,424
Logic Array Blocks (LABs) — 6,839
Embedded Memory Bits — 5,621,760 (approximately 702 Kbits)
Embedded Memory Blocks — M9K blocks, 9-bit parity
DSP Blocks (18x18 Multipliers) — 264 multipliers
Maximum User I/Os — 475
I/O Banks — 8
PCI Express Hard IP — PCIe Gen1/Gen2 x1/x2/x4
Core Supply Voltage — 1.2 V
Process Technology — 60 nm low-power CMOS
Operating Temperature (Commercial) — 0C to 85C
Configuration — SRAM-based, supports AS, PS, JTAG, FPP

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