EP4SGX70HF35C3G vs EP4SGX70DF29I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX70HF35C3G sa pamamagitan ng Intel at EP4SGX70DF29I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4SGX70HF35C3G | EP4SGX70DF29I3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Series | Stratix IV GX | Stratix IV GX |
| Logic Elements | 72,600 | — |
| LABs/CLBs | 2,904 | — |
| Total RAM Bits | 7,564,880 | — |
| User I/O Count | 488 | — |
| Number of Transceivers | 8 | — |
| Transceiver Data Rate (max) | 3.125 Gbps | — |
| Packhaging | 1152-BBGA, FCBGA (35 mm × 35 mm) | — |
| Process Technology | 40 nm | 40 nm |
| Core Supply Voltage | 0.87 V to 0.93 V | 0.87 V to 0.93 V |
| Operating Temperature (Junction) | 0°C to 85°C | — |
| Temperature Grade | Commercial (C3) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Speed Grade | HF35 | -3 |
| Configuration Method | Passive Serial, Fast Passive Parallel, Active Serial, JTAG | — |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL rating] |
| Logic Elements (LE) | — | 72,600 |
| Embedded Memory Bits | — | 7,564,880 (about 7.5 Mbit) |
| Embedded Memory Blocks | — | 72600 |
| Number of Logic Cells / Arrays | — | 372 |
| Number of User I/O Pins | — | 372 |
| Number of Transceiver Channels | — | [DATA_NEEDED: exact channel count for this device] |
| Transceiver Data Rate | — | [DATA_NEEDED: per-channel data rate] |
| Package Type | — | 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) |
| Package Code | — | DF29 |
| Operating Temperature Grade | — | Industrial (I3) |
| Junction Temperature Range | — | -40C to +100C |
| Wala sa Halogen | — | [DATA_NEEDED: halogen-free claim] |