EPF10K200EBC600-2 vs EPF10K200EBC600-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EBC600-2 sa pamamagitan ng Intel at EPF10K200EBC600-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
EPF10K200EBC600-3 ObsoletePagsanggunian na paghahambing
| Parametro | EPF10K200EBC600-2 | EPF10K200EBC600-3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | FLEX-10KE | FLEX-10KE |
| Logic Family | CMOS (SRAM-based) | — |
| Process Technology | 0.30 µm CMOS | 0.22 micrometer SRAM |
| Typical Gate Count | 200,000 gates | — |
| Logic Elements (LEs) | 9984 | — |
| Logic Array Blocks (LABs) | 1248 | 1248 |
| Embedded Memory (EAB) | 98304 bits (96 Kbits) | — |
| Maximum User I/O | 470 pins | 470 |
| Propagation Delay | 0.4 ns | — |
| Volte ng Pagbibigay | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) | — |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | — |
| Package Type | 600-ball BGA (BGA-600) | — |
| Package Dimensions | 45 × 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Package Height | 1.1 mm max | — |
| Temperature na Operasyon | 0°C to +70°C (Commercial) | 0C to +70C (commercial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Method | JTAG (IEEE 1149.1), EPC2 serial PROM | — |
| Part Status | Obsolete | — |
| Tindminan RoHS | unknown | [DATA_NEEDED: RoHS compliance status] |
| Family | — | FLEX 10KE |
| System Gates | — | 200,000 |
| Logic Elements / Cells | — | 9,984 |
| Embedded Memory (EABs) | — | 24,576 bits |
| Number of PLLs | — | 4 |
| Core Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| Speed Grade | — | -3 (commercial) |
| Packhaging | — | 600-ball FineLine BGA, 45 x 45 mm |
| JTAG Support | — | Yes (IEEE 1149.1 boundary-scan) |