EPF10K200EBI600-2 vs EPF10K200EBC600-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EBI600-2 sa pamamagitan ng Intel at EPF10K200EBC600-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
EPF10K200EBI600-2 ObsoletePagsanggunian na paghahambing
| Parametro | EPF10K200EBI600-2 | EPF10K200EBC600-2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | FLEX 10KE | — |
| System Gates | 200,000 | — |
| Logic Elements (LEs) | 9,984 | 9984 |
| Logic Array Blocks (LABs) | 1,248 | 1248 |
| Embedded RAM | 98,304 bits | — |
| Embedded Array Blocks (EABs) | 12 (typical for this density) | — |
| User I/O Pins | 470 | — |
| Supply Voltage (VCCINT) | 2.5 V | — |
| Propagation Delay | 0.4 ns (per -2 speed grade) | 0.4 ns |
| Temperature na Operasyon | 0 C to 70 C (commercial) | 0°C to +70°C (Commercial) |
| Packhaging | BGA-600, 45 x 45 mm, 1.27 mm pitch | — |
| Logic Family | CMOS, SRAM-based | CMOS (SRAM-based) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Configuration Method | JTAG / ByteBlaster (SRAM configuration) | JTAG (IEEE 1149.1), EPC2 serial PROM |
| Tindminan RoHS | Compliant (lead-free package) | unknown |
| Series | — | FLEX-10KE |
| Process Technology | — | 0.30 µm CMOS |
| Typical Gate Count | — | 200,000 gates |
| Embedded Memory (EAB) | — | 98304 bits (96 Kbits) |
| Maximum User I/O | — | 470 pins |
| Volte ng Pagbibigay | — | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) |
| I/O Standards | — | LVTTL, LVCMOS, PCI, GTL+ |
| Package Type | — | 600-ball BGA (BGA-600) |
| Package Dimensions | — | 45 × 45 mm |
| Ball Pitch | — | 1.27 mm |
| Package Height | — | 1.1 mm max |
| Part Status | — | Obsolete |