EPF10K200EBI600-2 vs EPF10K200EBC600-2 比較
詳細並排比較 EPF10K200EBI600-2 由 Intel 與 EPF10K200EBC600-2 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Intel
EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
EPF10K200EBI600-2 Obsolete規格比較
| 參數 | EPF10K200EBI600-2 | EPF10K200EBC600-2 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | Obsolete |
| Family | FLEX 10KE | — |
| System Gates | 200,000 | — |
| Logic Elements (LEs) | 9,984 | 9984 |
| Logic Array Blocks (LABs) | 1,248 | 1248 |
| Embedded RAM | 98,304 bits | — |
| Embedded Array Blocks (EABs) | 12 (typical for this density) | — |
| User I/O Pins | 470 | — |
| Supply Voltage (VCCINT) | 2.5 V | — |
| Propagation Delay | 0.4 ns (per -2 speed grade) | 0.4 ns |
| 工作溫度 | 0 C to 70 C (commercial) | 0°C to +70°C (Commercial) |
| 封裝 | BGA-600, 45 x 45 mm, 1.27 mm pitch | — |
| Logic Family | CMOS, SRAM-based | CMOS (SRAM-based) |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| Configuration Method | JTAG / ByteBlaster (SRAM configuration) | JTAG (IEEE 1149.1), EPC2 serial PROM |
| RoHS 狀態 | Compliant (lead-free package) | unknown |
| Series | — | FLEX-10KE |
| Process Technology | — | 0.30 µm CMOS |
| Typical Gate Count | — | 200,000 gates |
| Embedded Memory (EAB) | — | 98304 bits (96 Kbits) |
| Maximum User I/O | — | 470 pins |
| 供應電壓 | — | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) |
| I/O Standards | — | LVTTL, LVCMOS, PCI, GTL+ |
| Package Type | — | 600-ball BGA (BGA-600) |
| Package Dimensions | — | 45 × 45 mm |
| Ball Pitch | — | 1.27 mm |
| Package Height | — | 1.1 mm max |
| Part Status | — | Obsolete |