EPM51929C vs EPM5192-1LC Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPM51929C sa pamamagitan ng Intel at EPM5192-1LC sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPM51929C | EPM5192-1LC |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Device Family | MAX 5000 | — |
| Device Type | EPLD (Erasable Programmable Logic Device) | CPLD (Complex Programmable Logic Device) |
| Architecture | Multi-array matrix (PAL-based macrocells) | — |
| Logic Density | [DATA_NEEDED: usable gates] | — |
| Number of Macrocells | [DATA_NEEDED: macrocell count] | — |
| Bilang ng Pins | [DATA_NEEDED: pin count] | — |
| Package Type | [DATA_NEEDED: package suffix - C denotes commercial temperature grade] | — |
| Technology | CMOS EPROM | — |
| Programmability | UV-erasable, JEDEC fuse map | — |
| Temperature na Operasyon | Commercial (0C to +70C) | 0C to +70C (commercial) |
| Volte ng Pagbibigay | [DATA_NEEDED: VCC range] | 5 V |
| Propagation Delay | [DATA_NEEDED: tpd specification] | — |
| Maximum Toggle Frequency | [DATA_NEEDED: fmax] | — |
| Uri ng Pagpapasok | Surface Mount or Through-Hole (package dependent) | Surface Mount |
| Tindminan RoHS | unknown | Non-compliant (ceramic windowless package, lead-bearing termination) |
| Lead-Free | unknown | — |
| Level ng MSL | [DATA_NEEDED] | — |
| Family | — | MAX 5000 |
| Usable Gates | — | 3,750 |
| Macrocells | — | 192 |
| Logic Array Blocks (LABs) | — | 4 |
| User I/O Pins | — | 64 |
| Maximum Operating Frequency | — | 62.5 MHz |
| Propagation Delay (tpd) | — | [DATA_NEEDED: -1 speed grade tpd in ns] |
| Process Technology | — | UV EPROM, erasable windowless |
| Programmable Interconnect | — | PIA (Programmable Interconnect Array) |
| JTAG Boundary Scan | — | IEEE 1149.1 compliant |
| Packhaging | — | 64-pin Ceramic J-Lead Chip Carrier (LC) |