K4B4G1646D-BCK00 vs H5TC4G63AFR-PBJ Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng K4B4G1646D-BCK00 sa pamamagitan ng Samsung Electronics at H5TC4G63AFR-PBJ sa pamamagitan ng SK hynix. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Samsung Electronics
K4B4G1646D-BCK00 - 4Gb DDR3L SDRAM x16 96FBGA | Samsung
K4B4G1646D-BCK00 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | K4B4G1646D-BCK00 | H5TC4G63AFR-PBJ |
|---|---|---|
| Brand | Samsung Electronics | SK hynix |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Density | 4 Gb | — |
| Organisasyon | 256M x 16 | — |
| Uri ng Memory | DDR3L SDRAM | DDR3L SDRAM |
| Speed Grade | DDR3-1600 (800 MHz) | — |
| Rate ng Data | 1600 Mbps/pin | [DATA_NEEDED: Data rate (e.g., 1600 Mbps)] |
| Volte ng Pagbibigay | 1.35V (1.283V to 1.45V) | 1.35 V |
| I/O Voltage | 1.35V | — |
| Packhaging | 96-ball FBGA (13 x 9 mm, 0.8 mm pitch) | 96-ball TFBGA |
| Temperature na Operasyon | 0°C to 95°C (Tcase) | — |
| Number of Banks | 8 | — |
| Latensya ng CAS | 11 (at 1600 Mbps) | [DATA_NEEDED: CAS Latency] |
| Burst Length | 8, 4 (with burst chop) | — |
| RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Wala sa Halogen | Yes | — |
| Laki ng Memory | — | 4 Gb (256M x 16) |
| Temperature Grade | — | Industrial (-40°C to +95°C) |
| Refresh Cycles | — | 8192 |
| Package Shape | — | Rectangular |
| Number of Terminals | — | 96 |
| Access Time | — | 0.225 ns (from H5TC4G63AFR-PBR datasheet) |
| Auto Self-Refresh | — | Yes |
| Data Mask | — | Yes |
| Auto Precharge | — | Yes |
| Asynchronous Reset | — | Yes |
| Dynamic On-Chip Termination | — | Yes |
| ZQ Calibration | — | Yes |
| Write Leveling | — | Yes |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS Status] |