MSC8157TVT1000A vs MSC8157ETVT1000A Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MSC8157TVT1000A sa pamamagitan ng NXP Semiconductors at MSC8157ETVT1000A sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MSC8157TVT1000A - 6-Core SC3850 DSP 1GHz 783-FCBGA | NXP
MSC8157TVT1000A ObsoleteNXP Semiconductors
MSC8157ETVT1000A - 1GHz Six-Core StarCore DSP, 783-FCBGA | NXP
MSC8157ETVT1000A ObsoletePagsanggunian na paghahambing
| Parametro | MSC8157TVT1000A | MSC8157ETVT1000A |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | DSP | DSP |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | StarCore | StarCore |
| Type | SC3850 Six-Core Digital Signal Processor | SC3850 Six-Core Digital Signal Processor (DSP) |
| Width ng Data Bus | 32-Bit / 64-Bit | 64-bit |
| Core Architecture | StarCore SC3850 | — |
| Number of Cores | 6 | — |
| Clock Rate | 1 GHz | 1 GHz (1000 MHz) |
| Performance | 1000 MIPS per core (up to 6000 MIPS aggregate) | — |
| Package Type | FCBGA-783 (29 mm x 29 mm) | — |
| Bilang ng Pin | 783 | 783 |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (FCBGA) |
| Temperature na Operasyon | -40 C to +105 C | -40°C to +105°C (Extended) |
| Voltage - Core (Vccint) | 1.0 V | — |
| Voltage - I/O | 1.0 V / 1.5 V / 2.5 V | 1.0 V / 1.5 V / 2.5 V (selectable) |
| On-Chip RAM | 6.375 MB | 6.375 MB |
| Non-Volatile Memory (ROM) | 96 kB | — |
| Interfaces | Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART | Ethernet, I²C, SPI, UART/USART, PCI, RGMII, SGMII, Serial RapidIO |
| Memory Controller | DDR2 / DDR3 (32-bit / 64-bit) | — |
| Tindminan RoHS | Lead-free (per FCBGA marking) | — |
| Status | Obsolete (EOL) | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Architecture | — | StarCore SC3850, six independent cores |
| Core Count | — | 6 |
| On-Chip ROM | — | 96 kB |
| L1 Instruction Cache (per core) | — | 32 KB |
| L1 Data Cache (per core) | — | 32 KB |
| Voltage - Core | — | 1.0 V |
| Packhaging | — | 783-FCBGA (Flip-Chip BGA), 29 mm × 29 mm |
| Lead Status | — | Lead Free |
| Process Technology | — | CMOS |