MT40A1G8SA-062E vs H5AN8G8NDJR-XNC Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MT40A1G8SA-062E sa pamamagitan ng Micron Technology at H5AN8G8NDJR-XNC sa pamamagitan ng SK hynix. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | MT40A1G8SA-062E | H5AN8G8NDJR-XNC |
|---|---|---|
| Brand | Micron Technology | SK hynix |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Uri ng Memory | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gbit | — |
| Organisasyon | 1G x 8 | — |
| Rate ng Data | 3200 MT/s (DDR4-3200) | 3200 MT/s (DDR4-3200) |
| Clock Frequency | 1.6 GHz | 1.6 GHz (I/O clock) |
| Access Time (CAS Latency) | CL22 at 3200 MT/s | — |
| Row Access Time | 19 ns | — |
| VDD / VDDQ | 1.2 V +/-60 mV | — |
| VPP | 2.5 V, -125 mV, +250 mV | — |
| Internal Banks | 16 banks (4 bank groups x 4 banks) | — |
| Refresh | 8192-cycle; 64 ms (0-85C), 32 ms (85-95C), 16 ms (>95C) | — |
| Temperature na Operasyon | 0C to +95C (CT range; IT: -40C to +95C) | — |
| I/O Type | 1.2 V pseudo open-drain | — |
| Burst Length | BL8, BC4 (burst chop) | — |
| Packhaging | 78-ball FBGA (7.5 x 11 mm) | FBGA-78 (7.5 x 11 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Mga Karakteristika | Auto self-refresh, write leveling, dynamic ODT, CRC, auto precharge, ZQ calibration, on-die adjustable VREFDQ | — |
| Laki ng Memory | — | 8 Gbit (1 G x 8) |
| Supply Voltage (VDD) | — | 1.14 V to 1.26 V (nominal 1.2 V) |
| I/O Voltage (VDDQ) | — | 1.14 V to 1.26 V (nominal 1.2 V) |
| Operating Temperature (TC) | — | 0°C to +95°C |
| Memory Organization | — | 1G x 8 |
| Interface | — | Parallel |
| RoHS | — | Compliant |
| Lead-Free | — | Yes |
| Packaging | — | Tray |
| Status | — | Active |