N25Q512A83G12A0F vs N25Q512A13GSFA0F Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng N25Q512A83G12A0F sa pamamagitan ng Micron Technology at N25Q512A13GSFA0F sa pamamagitan ng Micron Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Micron Technology
N25Q512A83G12A0F - 512Mbit SPI NOR Flash 108MHz | Micron
N25Q512A83G12A0F ✓ NakahandaMicron Technology
N25Q512A13GSFA0F - 512Mb SPI NOR Flash 108MHz | Micron
N25Q512A13GSFA0F ✓ NakahandaPagsanggunian na paghahambing
| Parametro | N25Q512A83G12A0F | N25Q512A13GSFA0F |
|---|---|---|
| Brand | Micron Technology | Micron Technology |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Uri ng Memory | Flash - NOR Memory IC | SPI NOR Flash (Multiple I/O) |
| Memory Capacity | 512 Mbit (64 MB) | — |
| Organisasyon | 128M x 4 | 512M/256M/128M x 1Bit/2Bit/4Bit |
| Interface | SPI - Multiple I/O (Standard/Dual/Quad) | SPI-compatible serial bus |
| Clock Frequency | 108 MHz | — |
| Volte ng Pagbibigay | 2.7 V to 3.6 V (3V class) | 2.7 V to 3.6 V |
| Cell Type | SLC | — |
| Sector Erase Size | 4 KB | 4 KB |
| Packhaging | 24-T-PBGA (6x8 mm) | 16-Pin SOIC (SOP-II 16/16) |
| Package Structure | Dual-Die Package (DDP) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Program/Erase Protection | Software and hardware write protection | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | -40C to +125C |
| Endurance | [DATA_NEEDED: program/erase endurance cycles] | — |
| Active Read Current | [DATA_NEEDED: active read current] | — |
| Standby Current | [DATA_NEEDED: standby current] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Level ng MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Density | — | 512 Mbit (64 MByte) |
| Max Clock Frequency (STR) | — | 108 MHz |
| Max Clock Frequency (DTR) | — | 54 MHz |
| Access Time | — | 7 ns |
| Construction | — | Stacked device (two 256Mb die) |
| Protocols | — | Standard, Dual Output, Dual I/O, Quad Output, Quad I/O, DTR |
| Packaging | — | Tape & Reel (T/R) |
| Temperature Grade | — | Automotive |