XC6SLX45-2FGG676C vs XC6SLX45-2FG676I Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng XC6SLX45-2FGG676C sa pamamagitan ng AMD at XC6SLX45-2FG676I sa pamamagitan ng AMD. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro XC6SLX45-2FGG676C XC6SLX45-2FG676I
Brand AMD AMD
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Device Family Spartan-6 LX —
Logic Cells 43,661 43,661 cells
Block RAM (bits) 2,138,112 —
User I/O Count 358 —
Number of CLBs 3,411 —
Packhaging 676-ball FFG / FBGA, 27 x 27 mm, 1.0 mm pitch 676-BGA
Speed Grade -2 (standard performance) -2
Process Technology 45 nm CMOS, low-power copper —
Core Voltage (Vccint) 1.2 V nominal (1.14 V to 1.26 V range) —
Auxiliary Voltage (Vccaux) 2.5 V nominal —
I/O Bank Voltage (Vcco) 1.2 V to 3.3 V per bank —
Temperature na Operasyon 0 C to +85 C (commercial, "C" suffix) —
Uri ng Pagpapasok Surface Mount (BGA) —
Level ng MSL 3 (168 hours) —
Lead Free / REACH Lead free per MO-275 —
Device Type — Spartan-6 LX Field Programmable Gate Array (FPGA)
I/O Count — 358 I/O
Technology — 45 nm CMOS
Core Supply Voltage — 1.2 V
Temperature Grade — Industrial
Package Type — BGA
Number of Terminals — 676
Package Shape — Square
Terminal Form — Ball
Programmable Logic Type — FPGA
Manufacturer — AMD / Xilinx
Tindminan RoHS — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]
Hanay ng Temperature na Operasyon — [DATA_NEEDED: operating temperature range]
Maksimum na Taktiko ng Oras — [DATA_NEEDED: maximum clock frequency]
Block RAM — [DATA_NEEDED: block RAM capacity]
DSP Resources — [DATA_NEEDED: DSP resource count]

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