XC6SLX45-2FGG676C vs XC6SLX45-2FG676I 对比

详细并排对比 XC6SLX45-2FGG676C 出自 AMD 和 XC6SLX45-2FG676I 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 XC6SLX45-2FGG676C XC6SLX45-2FG676I
品牌 AMD AMD
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
Device Family Spartan-6 LX —
Logic Cells 43,661 43,661 cells
Block RAM (bits) 2,138,112 —
User I/O Count 358 —
Number of CLBs 3,411 —
封装 676-ball FFG / FBGA, 27 x 27 mm, 1.0 mm pitch 676-BGA
Speed Grade -2 (standard performance) -2
Process Technology 45 nm CMOS, low-power copper —
Core Voltage (Vccint) 1.2 V nominal (1.14 V to 1.26 V range) —
Auxiliary Voltage (Vccaux) 2.5 V nominal —
I/O Bank Voltage (Vcco) 1.2 V to 3.3 V per bank —
工作温度 0 C to +85 C (commercial, "C" suffix) —
安装类型 Surface Mount (BGA) —
MSL 等级 3 (168 hours) —
Lead Free / REACH Lead free per MO-275 —
Device Type — Spartan-6 LX Field Programmable Gate Array (FPGA)
I/O Count — 358 I/O
Technology — 45 nm CMOS
Core Supply Voltage — 1.2 V
Temperature Grade — Industrial
Package Type — BGA
Number of Terminals — 676
Package Shape — Square
Terminal Form — Ball
Programmable Logic Type — FPGA
Manufacturer — AMD / Xilinx
RoHS 状态 — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]
工作温度范围 — [DATA_NEEDED: operating temperature range]
最大时钟频率 — [DATA_NEEDED: maximum clock frequency]
Block RAM — [DATA_NEEDED: block RAM capacity]
DSP Resources — [DATA_NEEDED: DSP resource count]

数据手册与资源

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