XC6SLX45-2FGG676C vs XC6SLX45-2FG676I 比較

詳細並排比較 XC6SLX45-2FGG676C 由 AMD 與 XC6SLX45-2FG676I 由 AMD. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 XC6SLX45-2FGG676C XC6SLX45-2FG676I
品牌 AMD AMD
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Device Family Spartan-6 LX —
Logic Cells 43,661 43,661 cells
Block RAM (bits) 2,138,112 —
User I/O Count 358 —
Number of CLBs 3,411 —
封裝 676-ball FFG / FBGA, 27 x 27 mm, 1.0 mm pitch 676-BGA
Speed Grade -2 (standard performance) -2
Process Technology 45 nm CMOS, low-power copper —
Core Voltage (Vccint) 1.2 V nominal (1.14 V to 1.26 V range) —
Auxiliary Voltage (Vccaux) 2.5 V nominal —
I/O Bank Voltage (Vcco) 1.2 V to 3.3 V per bank —
工作溫度 0 C to +85 C (commercial, "C" suffix) —
安裝類型 Surface Mount (BGA) —
MSL 等級 3 (168 hours) —
Lead Free / REACH Lead free per MO-275 —
Device Type — Spartan-6 LX Field Programmable Gate Array (FPGA)
I/O Count — 358 I/O
Technology — 45 nm CMOS
Core Supply Voltage — 1.2 V
Temperature Grade — Industrial
Package Type — BGA
Number of Terminals — 676
Package Shape — Square
Terminal Form — Ball
Programmable Logic Type — FPGA
Manufacturer — AMD / Xilinx
RoHS 狀態 — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]
工作溫度範圍 — [DATA_NEEDED: operating temperature range]
最大時脈頻率 — [DATA_NEEDED: maximum clock frequency]
Block RAM — [DATA_NEEDED: block RAM capacity]
DSP Resources — [DATA_NEEDED: DSP resource count]

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