XPC8240LVV200E vs MPC8245LVV333D Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng XPC8240LVV200E sa pamamagitan ng NXP Semiconductors at MPC8245LVV333D sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor
MPC8245LVV333D ObsoletePagsanggunian na paghahambing
| Parametro | XPC8240LVV200E | MPC8245LVV333D |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Manufacturer | NXP Semiconductors | NXP USA Inc. (formerly Freescale / Motorola) |
| Series | MPC82xx / PowerQUICC II | — |
| Core Processor | PowerPC 603e | — |
| Core Architecture | 32-bit RISC PowerPC | PowerPC 603e (Power Architecture technology) |
| Number of Cores | 1 | — |
| Core Clock Speed | 200 MHz | — |
| Core Supply Voltage | 2.5 V | — |
| L1 Instruction Cache | 16 KB | — |
| L1 Data Cache | 16 KB | — |
| Local Bus Width | 64-bit 60x bus | — |
| Integrated Bridge | PCI bridge (PCI 2.2 compatible) | PCI bridge + memory controller |
| Memory Controller | SDRAM, ROM/Flash, burst SRAM | 64-bit SDRAM (PC133), ROM/Flash interface |
| Serial Interfaces | 2x UART, I2C | — |
| Debug Interface | JTAG / COP | — |
| Packhaging | 352-TBGA (35 x 35 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Packaging | Tray | — |
| Temperature na Operasyon | Extended (E suffix) | 0 C to +105 C (junction) |
| Lead Free Status | Lead Free | — |
| Tindminan RoHS | RoHS Compliant | [DATA_NEEDED: rohs status not confirmed in verified web data] |
| Product Category | — | Microprocessors (MPU) |
| Core Count | — | 1 |
| Width ng Data Bus | — | 32-bit |
| Core Frequency | — | 333 MHz |
| PCI Interface | — | PCI 2.2 compliant, 32-bit, up to 66 MHz |
| Supply Voltage - Core | — | 2.0 V (L suffix, low-voltage core) |
| Supply Voltage - I/O | — | 3.3 V |
| Packhaging / Kaso | — | 352-TBGA (35x35 mm) |
| Lead-Free / BGA Solder | — | [DATA_NEEDED: lead-free status not confirmed] |