XPC8240LVV200E vs MPC8245LVV333D 比較
詳細並排比較 XPC8240LVV200E 由 NXP Semiconductors 與 MPC8245LVV333D 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor
MPC8245LVV333D Obsolete規格比較
| 參數 | XPC8240LVV200E | MPC8245LVV333D |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | Obsolete |
| Manufacturer | NXP Semiconductors | NXP USA Inc. (formerly Freescale / Motorola) |
| Series | MPC82xx / PowerQUICC II | — |
| Core Processor | PowerPC 603e | — |
| Core Architecture | 32-bit RISC PowerPC | PowerPC 603e (Power Architecture technology) |
| Number of Cores | 1 | — |
| Core Clock Speed | 200 MHz | — |
| Core Supply Voltage | 2.5 V | — |
| L1 Instruction Cache | 16 KB | — |
| L1 Data Cache | 16 KB | — |
| Local Bus Width | 64-bit 60x bus | — |
| Integrated Bridge | PCI bridge (PCI 2.2 compatible) | PCI bridge + memory controller |
| Memory Controller | SDRAM, ROM/Flash, burst SRAM | 64-bit SDRAM (PC133), ROM/Flash interface |
| Serial Interfaces | 2x UART, I2C | — |
| Debug Interface | JTAG / COP | — |
| 封裝 | 352-TBGA (35 x 35 mm) | — |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| Packaging | Tray | — |
| 工作溫度 | Extended (E suffix) | 0 C to +105 C (junction) |
| Lead Free Status | Lead Free | — |
| RoHS 狀態 | RoHS Compliant | [DATA_NEEDED: rohs status not confirmed in verified web data] |
| Product Category | — | Microprocessors (MPU) |
| Core Count | — | 1 |
| 資料匯流排寬度 | — | 32-bit |
| Core Frequency | — | 333 MHz |
| PCI Interface | — | PCI 2.2 compliant, 32-bit, up to 66 MHz |
| Supply Voltage - Core | — | 2.0 V (L suffix, low-voltage core) |
| Supply Voltage - I/O | — | 3.3 V |
| 封裝 / 外殼 | — | 352-TBGA (35x35 mm) |
| Lead-Free / BGA Solder | — | [DATA_NEEDED: lead-free status not confirmed] |