EP1S30F1020C7N - Stratix 32k LE FPGA, 1020-BGA, 420MHz | Intel
MPN： EP1S30F1020C7N ✗ 停產EP1S30F1020C7N 概覽
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that combines configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit within the broader semiconductor hierarchy as: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Unlike fixed-function ASICs, FPGAs can be reconfigured in the field to implement arbitrary digital logic, glue functions, signal-processing pipelines, and full system-on-chip prototypes.
Key features include 3,244 Kbits (M4K) + 144 Kbits (M-RAM) of block RAM, dedicated DSP blocks for high-throughput arithmetic, up to 16 global clock networks with PLL support, and Stratix-tier I/O support including LVDS, SSTL, and HSTL standards. The 1020-pin FineLine BGA exposes 726 user I/Os, leaving the remaining balls for power, ground, configuration, and JTAG.
The Stratix architecture combines a TriMatrix memory structure (MLAB + M4K + M-RAM) with DSP blocks optimized for finite-impulse-response (FIR) filters and complex FFT pipelines. The 130 nm process delivers an internal clock performance envelope of 420 MHz, making the part suitable for parallel DSP workloads, telecom channel cards, and prototyping of ASIC-class signal chains before tape-out.
Typical applications include telecom baseband processing, high-speed data acquisition, software-defined radio (SDR), industrial motion control, ASIC prototyping, and military/aerospace signal processing where a high pin-count, high-density programmable fabric is required. The 1020-BGA footprint also supports multi-gigabit transceiver-rich boards when paired with companion clock devices.
When designing with this device, provide at least six PCB layers, controlled-impedance routing for all high-speed signals, and a minimum of 1 oz copper on inner power planes for the 1.5 V core rail. Thermal management relies on the exposed-die BGA lid; heatsink or airflow is required when continuous logic utilization exceeds 70%.
This page synthesizes distributor pricing, drop-in same-brand alternatives from the Stratix family, and practical design notes not aggregated in the manufacturer datasheet.
直接替換替代品，適用於 EP1S30F1020C7N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1S30F1020C7N （相同外形與佔位） — 差異在於 Operating Temperature, Package, Family, Logic Elements, Speed Grade.
EP1S30F1020C7
✅ 直接替換聯絡詢價
查看資料表 →EP1S30F1020C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1S30F1020C6
✅ 直接替換聯絡詢價
查看資料表 →EP1S30F1020C5N
✅ 直接替換聯絡詢價
查看資料表 →EP1S25F1020C7N
✅ 直接替換📋 參考替代品（不在目錄中）
EP1S25F1020C7
✅ 直接替換聯絡詢價
查看資料表 →EP1S25F1020C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1S30F1020C7N 最大額定值與電氣特性
| Series | Stratix |
| Family | Stratix (1.5 V core) |
| Logic Elements | 32,470 |
| Total Block RAM Bits | 3,317,184 |
| User I/O Count | 726 |
| LABs (Logic Array Blocks) | 3247 |
| Process Technology | 130 nm CMOS |
| Max Internal Frequency | 420.17 MHz |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) |
| Package Type | 1020-ball FineLine BGA (FC-FBGA) |
| Package Dimensions | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| 工作溫度 | 0 C to +85 C (commercial extended) |
| 安裝類型 | Surface Mount (BGA) |
| MSL 等級 | 3 (168 hours) |
| Peak Reflow Temperature Max Time | 40 s |
| RoHS 狀態 | Compliant |
EP1S30F1020C7N 33 x 33 mm 腳位配置指南
EP1S30F1020C7N（33 x 33 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1S30F1020C7N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1S30F1020C7N 適用於 6 應用s: Telecom Baseband Processing, Software Defined Radio (SDR), High-Speed Data Acquisition, ASIC Prototyping, Industrial Motion Control, Military and Aerospace Signal Processing.
Telecom Baseband Processing
The EP1S30F1020C7N's 32,470 logic elements and 3.3 Mbits of block RAM fit multi-channel telecom baseband line cards where U-plane and C-plane processing must be partitioned in parallel datapaths. Its 420 MHz internal clock and dedicated multiplier blocks enable parallel FIR filtering and Viterbi decoding at rates up to a few hundred Msymbols/s per channel. Placed on the line card between the SERDES framer and the backplane, the FPGA absorbs protocol overhead while staying within the 1.5 V core power envelope. Compared with fixed DSP ASICs, the same package can be reconfigured across product generations without board rework.
推薦
Software Defined Radio (SDR)
Software-defined radio platforms rely on FPGA fabric to perform DDC/DUC, channelization, and FFT computations in real time. The EP1S30F1020C7N's 3.3 Mbit TriMatrix RAM buffers baseband samples between the ADC front-end and the host processor, while the 32,470 logic elements and dedicated DSP blocks sustain 1024-point FFTs at sample rates beyond 100 MSPS. The 726 user I/Os accept parallel LVDS ADC data plus GPIOs for tuning and gain control. Versus discrete DSP chains, the same 1020-BGA footprint lets designers retarget the radio for new waveforms by recompiling Quartus without PCB rework.
推薦
High-Speed Data Acquisition
Multi-channel data-acquisition cards use the EP1S30F1020C7N to aggregate 8-16 LVDS ADC lanes, perform real-time decimation, and stream DMA to host memory. The device's 726 user I/Os comfortably absorb 16 LVDS pairs plus GPIO banks for trigger and clock distribution, while 3.3 Mbits of block RAM stages ping-pong buffers between ADC bursts and PCIe readout. The 420 MHz internal clock matches typical 14-bit 250 MSPS ADC data rates with margin for digital filtering. Placed adjacent to the ADC analog front-end, the FPGA keeps digital and analog grounds separate while preserving timing closure across all I/O banks.
推薦
ASIC Prototyping
ASIC prototyping platforms use the EP1S30F1020C7N as one of several Stratix FPGAs stitched together to emulate a multi-million-gate ASIC. With 32,470 logic elements per device and 3.3 Mbits of on-chip memory, the part is well-matched to a typical SoC block partition, while the 1020-BGA package exposes enough user I/Os for inter-FPGA serial or parallel channels. The -7 speed grade shortens emulation cycles by allowing higher clock rates during bring-up. Compared with larger Stratix IV/V parts, the EP1S30F1020C7N offers a familiar Quartus flow with abundant third-party IP.
推薦
Industrial Motion Control
Multi-axis servo and motor-control systems use the EP1S30F1020C7N to implement field-oriented control loops, encoder decoding, and safety logic on a single device. The 32,470 logic elements handle 8-12 axes of FOC plus resolver or SSI feedback decoding, while the dedicated PLL resources drive deterministic switching frequencies from 8 kHz to 32 kHz per axis. The 726 user I/Os accommodate quadrature encoders, PWM outputs, gate-driver enables, and EtherCAT or CAN-FD side-channels. Placed between the power stage and the host PLC, the FPGA keeps latency below one PWM period versus discrete microcontrollers.
推薦
Military and Aerospace Signal Processing
Defense and aerospace platforms use the EP1S30F1020C7N for radar, electronic-warfare, and secure-communication preprocessing where commercial microprocessors lack determinism. The part's 32,470 logic elements, 3.3 Mbit embedded RAM, and 420 MHz clock support pulse-compression, beamforming, and crypto offload on a single 1020-BGA device. The commercial/extended 0 C to +85 C temperature range covers many ground-mobile and shipboard environments, while the 1.5 V core and 1 mm-pitch BGA suit ruggedized chassis layouts. Designers should confirm long-term availability with procurement as the part is classified obsolete.
推薦
推薦產品摘要
工程參考資料，適用於 EP1S30F1020C7N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1S30F1020C7 | EP1S30F1020C6N | EP1S30F1020C6 | EP1S30F1020C5N | EP1S25F1020C7N |
|---|---|---|---|---|---|---|
| Package | 1020-BGA (33x33 mm) | 1020-BGA (33x33 mm) - same | 1020-BGA (33x33 mm) - same | 1020-BGA (33x33 mm) - same | 1020-BGA (33x33 mm) - same | 1020-BGA (33x33 mm) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 32,470 | 32,470 (same) | 32,470 (same) | 32,470 (same) | 32,470 (same) | 25,660 (-21%) |
| Block RAM Bits | 3,317,184 | 3,317,184 (same) | 3,317,184 (same) | 3,317,184 (same) | 3,317,184 (same) | 1,922,048 (-42%) |
| Max Internal Frequency | 420.17 MHz | 420.17 MHz (same) | ~320 MHz (-24%) | ~320 MHz (-24%) | ~250 MHz (-40%) | 420.17 MHz (same) |
| User I/O Count | 726 | 726 (same) | 726 (same) | 726 (same) | 726 (same) | 726 (same) |
| Core Voltage | 1.5 V | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) |
| Operating Temperature | 0 C to +85 C | 0 C to +85 C (same) | 0 C to +85 C (same) | 0 C to +85 C (same) | 0 C to +85 C (same) | 0 C to +85 C (same) |
| Lead-Free Finish (N suffix) | Yes (N suffix) | No (standard finish) | Yes (N suffix) | No (standard finish) | Yes (N suffix) | Yes (N suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Highest available speed grade in the EP1S30F1020 family (對比EP1S30F1020C6N)
- 32,470 logic elements versus 25,660 in the EP1S25 family (對比EP1S25F1020C7N)
- Lead-free (N) finish for RoHS-compliant assemblies (對比EP1S30F1020C7)
- 3.3 Mbit TriMatrix block RAM versus 1.9 Mbit on EP1S25 (對比EP1S25F1020C7N)
設計說明
The EP1S30F1020C7N requires four independent supply rails: VCCINT (1.5 V core), VCCIO (1.5 V/1.8 V/2.5 V/3.3 V per I/O bank), VCCA_PLL (3.3 V analog for PLL cleanliness), and VCCPD (3.3 V pre-driver). At 420 MHz with full logic utilization, estimated VCCINT current reaches 2.5 A to 3.0 A; bulk decoupling should include at least 4 x 100 uF polymer plus 24 x 0.1 uF ceramics placed under and adjacent to the BGA. Failure to keep VCCA_PLL isolated from digital switching noise will manifest as PLL jitter degradation above 50 ps RMS.
Estimated: at full 32,470-LE utilization and 420 MHz, the EP1S30F1020C7N dissipates approximately 4 to 6 W depending on switching activity. With the 33 x 33 mm FineLine BGA and a typical theta_JA of 18 C/W for a properly designed 12-layer PCB with 1 oz copper on core/inner power planes, junction temperature rises approximately 70 C to 110 C above ambient. A heatsink or 200 LFM airflow is required when continuous logic utilization exceeds 70%; verify via thermal sensor embedded in the Quartus device-health monitor.
The 1020-ball FineLine BGA requires a minimum 8-layer stackup with 1 oz copper and a 1 mm ball pitch translating to 0.5 mm escape via fan-out. Use laser-drilled stacked micro-vias for inner rows and through-vias for outer rows. Matched 50 ohm single-ended and 100 ohm differential impedance on the top layer, with the second layer as a continuous GND plane for LVDS and SSTL signal integrity. Per manufacturer reference designs, place the JTAG header within 5 cm of the FPGA to avoid TCK/TMS signal-integrity issues.
Per the manufacturer datasheet, leaving any VCCINT or VCCIO ball unconnected causes the device to malfunction regardless of overall system power. Designers must verify the complete BGA ballout against the device pin table - missed balls are a common prototype-bring-up defect. Configuration mode (AS, AP, FPP, PS) must be selected by MSEL[3..0] straps at power-up; once configured, the device will not autonomously re-enter configuration mode without a nCONFIG pulse.
合規資訊
RoHS compliant per N suffix in MPN per Intel/Altera ordering convention. AEC-Q100 not applicable - this is an FPGA, not an automotive-qualified IC. Halogen-free and conflict-minerals status not verified in the provided web data and marked unknown.
