EP3SE260F1152C3N vs EP3SE260F1152C4N Karşılaştırma

Ayrıntılı yan yana karşılaştırma EP3SE260F1152C3N tarafından Intel ve EP3SE260F1152C4N tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.

Özellik Karşılaştırması

Parametre EP3SE260F1152C3N EP3SE260F1152C4N
Marka Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Yaşam Döngüsü Durumu Aktif Obsolete
Series Stratix III E Stratix III E
Logic Elements / Cells 255,000 —
Embedded Memory Bits 16,672,768 bits —
Logic Array Blocks (LABs) 10,200 —
User I/O Count 744 —
Paket 1152-BBGA, FCBGA 1152-ball FC-FBGA (flip-chip)
Montaj Türü Surface Mount Surface Mount (BGA)
Process Technology 65 nm 65 nm CMOS
Core Voltage 1.1 V 1.1 V
İşletim Sıcaklığı 0 C to +85 C (Commercial) 0C to +85C (commercial, 'C' suffix)
Transceivers Integrated high-speed transceivers —
DSP Blocks Yes (dedicated multiplier/accumulator) —
Embedded Memory Type TriMatrix (true dual-port, FIFO, ROM, RAM) —
External Memory Support DDR3, DDR2, QDR II+, RLDRAM II —
Configuration Modes AS, AP, PS, FPP, JTAG —
Partial Reconfiguration Supported —
Programmable Power Technology Yes (up to 50% dynamic power reduction) —
RoHS Durumu Compliant —
Family — Stratix III (Enhanced)
Logic Elements (LEs) — 255,000
Embedded Memory — 16,672,768 bits (16.67 Mbit)
Maximum User I/Os — 744
Number of LABs/CLBs — 10,200
DSP / 18x18 Multipliers — 768 embedded multipliers
Maximum Operating Frequency — 450 MHz
Speed Grade — -4 (commercial temperature)
Packaging — Tray
Lead-Free / RoHS — Lead-free finish (RoHS compliant per distributor listing)
Bellek Türü — SRAM-based, volatile (requires configuration device)
Configuration — External EPCS / enhanced configuration via AS, PS, JTAG, or FPP
Product Status — Obsolete (per Xecor cross-reference data)

Dökümanlar & Kaynaklar

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