EP1S25F1020C6N - Stratix 25K LE FPGA, 706 I/O, FBGA-1020 | Intel
MPN: EP1S25F1020C6N ✗ Son Kullanım ZamanıEP1S25F1020C6N Genel Bakış
An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that can be customized after manufacturing using a hardware description language (HDL) bitstream. FPGAs occupy a specific tier of the digital semiconductor hierarchy: they sit above general-purpose microcontrollers in raw parallel computational throughput but below ASICs in per-unit cost efficiency. Stratix family FPGAs target high-bandwidth signal processing, telecom/datacom line cards, and prototyping platforms where time-to-market outweighs the cost-per-gate penalty of structured ASIC.
Key differentiating specifications include 706 user I/O pins, embedded multiplier blocks, up to 12 transceiver channels (per Stratix family architecture), and a maximum internal clock frequency near 450 MHz. The FC-FBGA-1020 package uses flip-chip interconnect for improved electrical and thermal performance, enabling higher I/O counts at finer pitches than wire-bonded BGAs of equivalent area. The commercial grade temperature range makes the EP1S25F1020C6N suitable for controlled-environment applications rather than industrial or automotive deployments.
Typical applications include telecom line cards, high-speed data acquisition backplanes, video broadcast equipment, and ASIC prototyping for protocol bridges and DSP pipelines. The high I/O count (706 pins) and substantial embedded memory (1,944,576 bits) make this device well-suited for multi-channel baseband processing where parallel data paths are required. Designers transitioning to newer process nodes should evaluate Cyclone IV/V or Stratix IV/V equivalents for active lifecycle and toolchain support, since the original Stratix family is no longer in active production.
When designing with this part, ensure a proper decoupling network on each core and I/O voltage rail, follow Altera's flip-chip PCB layout guidelines for the 1 mm-pitch BGA, and use Quartus II (legacy versions) for synthesis, place-and-route, and bitstream generation. The Stratix family uses 1.5 V VCCINT, and reliable configuration requires the EPC configuration device family or JTAG download cable compatible with legacy Quartus Programmer.
Drop-in alternatifler için EP1S25F1020C6N — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller EP1S25F1020C6N (aynı form faktörü ve ayağa oturma) — farklı olan Operating Temperature, DSP Blocks, Package, Speed Grade, Configuration Method.
EP1S25F1020C6
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP1S25F1020C5N
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP1S25F1020C5
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP1S25B672C7N
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP1S25F1020C6N Maksimum Değerlendirmeler & Elektriksel Özellikler
| Family | Stratix |
| Logic Elements (LE) | 25,660 |
| Logic Cells | 25,660 |
| Embedded Memory (bits) | 1,944,576 |
| User I/O Pins | 706 |
| LABs (Logic Array Blocks) | 2,566 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.5 V |
| Paket | 1020-ball FC-FBGA (33 x 33 mm, 1.0 mm pitch) |
| Maximum Internal Clock Frequency | 450.05 MHz |
| İşletim Sıcaklığı | 0C to +85C (Commercial) |
| Montaj Türü | Surface Mount |
| Configuration Method | JTAG or EPC configuration device |
| Family Generation | Stratix (1st generation) |
EP1S25F1020C6N 1020-ball fc-fbga (33 x 33 mm, 1.0 mm pitch) Pin Yapısı Kılavuzu
EP1S25F1020C6N (1020-ball fc-fbga (33 x 33 mm, 1.0 mm pitch) paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: EP1S25F1020C6N.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
EP1S25F1020C6N için uygundur 6 uygulamas: Telecom Line Card Aggregation, ASIC Prototyping and Emulation, High-Speed Data Acquisition Backplane, Video Broadcast and Image Processing, DSP Pipeline Aggregation, Legacy Industrial Control and Test Equipment.
Telecom Line Card Aggregation
The EP1S25F1020C6N's 25,660 logic elements and 706 user I/O pins make it well-suited for telecom line card aggregation where multiple lower-speed serial links are multiplexed onto a higher-speed backplane. Its 1,944,576 bits of embedded TriMatrix memory provide on-chip buffering for packet re-assembly without external SRAM, while the 1.5 V core and high-speed I/O support LVDS and HSTL signaling common in backplane designs. Legacy SONET/SDH and early Ethernet switch fabrics were designed around this exact device family.
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ASIC Prototyping and Emulation
With 25,660 logic elements and abundant M4K/M-RAM memory blocks, the EP1S25F1020C6N is widely deployed in ASIC prototyping platforms where a single chip can host a large block of pre-silicon RTL. The FC-FBGA-1020 package exposes 706 I/Os, allowing designers to bring out wide internal buses for chip-to-chip multi-FPGA partitioning. Quartus II legacy synthesis supports incremental compile, so design teams can iterate on sub-modules without full place-and-route rebuilds.
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High-Speed Data Acquisition Backplane
The 706 user I/O and 1 mm pitch FC-FBGA package support high-density LVDS interfaces typical of multi-channel data acquisition cards digitizing analog signals at 100+ MSPS per channel. The embedded DSP blocks perform per-channel decimation, FIR filtering, and FFT preprocessing on-chip before storing results in the 1.9 Mbit TriMatrix memory, dramatically reducing downstream processor loading. Industrial, medical imaging, and radar prototypes were common Stratix-family use cases.
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Video Broadcast and Image Processing
The EP1S25F1020C6N's embedded multiplier blocks and high internal clock frequency (up to 450 MHz) are well-matched to SDI video processing, color-space conversion, and real-time video filtering pipelines. The TriMatrix memory subsystem handles line buffers and frame-delay elements directly, eliminating external SRAM. SD/HD-SDI, DVB-ASI, and early HDMI processing designs frequently targeted this exact Stratix part because of its I/O count and on-chip memory density.
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DSP Pipeline Aggregation
The Stratix DSP blocks deliver 18 x 18-bit signed multiplication with optional accumulation, and the EP1S25F1020C6N offers enough DSP blocks for multi-channel FIR, IIR, and FFT pipelines at baseband sample rates. Combined with 25,660 LEs for control logic and 706 I/Os for streaming interfaces, a single chip can replace multiple DSP processors in cost-sensitive designs. Legacy software-defined radio and baseband modem designs were built on this part.
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Legacy Industrial Control and Test Equipment
Long-life-cycle industrial platforms - including test equipment, machine vision controllers, and process automation - continue to specify the EP1S25F1020C6N because re-validation costs make migration away from proven Stratix silicon impractical. The commercial 0C to +85C temperature range suits factory-floor enclosures, and the FC-FBGA-1020 package provides the ruggedness required by IPC-A-610 Class 2 assembly. Secondary-market channels stock this part precisely to support such legacy installations.
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Önerilen Ürünler Özeti
Mühendislik referans verileri: EP1S25F1020C6N — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | EP1S25F1020C6 | EP1S25F1020C5N | EP1S25F1020C5 | EP1S25B672C7N |
|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA (33x33 mm, 1.0 mm pitch) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 672-ball BGA (different) |
| Brand | Altera (now Intel) | Altera (same) | Altera (same) | Altera (same) | Altera (same) |
| Logic Elements | 25,660 | 25,660 (same) | 25,660 (same) | 25,660 (same) | 25,660 (same die) |
| User I/O Pins | 706 | 706 (same) | 706 (same) | 706 (same) | 493 (different package, fewer balls) |
| Speed Grade | 6 (C6N) | 6 (same) | 5 (faster) | 5 (faster) | 7 (slower) |
| Embedded Memory (bits) | 1,944,576 | 1,944,576 (same) | 1,944,576 (same) | 1,944,576 (same) | 1,944,576 (same die) |
| Lead-Free Designator (N suffix) | Yes (Pb-free) | No (standard) | Yes (Pb-free) | No (standard) | Yes (Pb-free) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Ana Farklılayıcılar
- Identical silicon and package as EP1S25F1020C6 (non-N suffix) (karşılaştırma:EP1S25F1020C6)
- Speed grade 6 with full 1020-ball FC-FBGA availability (karşılaştırma:EP1S25F1020C5N)
- Mid-density Stratix with maximum I/O count in this family tier (karşılaştırma:EP1S25B672C7N)
Tasarım Notları
The FC-FBGA-1020 package uses 1.0 mm pitch flip-chip solder balls. PCB fabrication must use laser-drilled or mechanically drilled micro-vias with 0.2 mm via-pad and 0.4 mm capture pad. Follow Altera AN 471: 'High-Density BGA Design Guidelines' for stack-up recommendations (typically 8-layer 1 oz copper) and via-in-pad plating for thermal relief. Skip-via or dog-bone fan-out is acceptable but increases board area; via-in-pad yields a more compact 35 x 35 mm keep-out.
Estimated: at 100% logic utilization with toggling rates near 25%, the EP1S25F1020C6N core current draw reaches approximately 3 A from the 1.5 V VCCINT rail. Provide at least 4 low-ESR decoupling capacitors (220 uF bulk + 22 uF + 1 uF + 0.1 uF) physically placed within 5 mm of the BGA balls feeding VCCINT. The PLL analog VCCA rail (2.5 V) needs a dedicated ferrite-isolated LDO with 10 uF + 0.1 uF local decoupling, per the Stratix Device Handbook chapter on power distribution.
Do not confuse the EP1S25F1020 (1020-ball) variant with the EP1S25B672 (672-ball) variant - they share the same silicon die but the package pinout is entirely different, so HDL bitstreams are not interchangeable across packages. Always re-run full Quartus place-and-route when targeting a different speed grade (C6N -> C5N) because timing optimization differs. The original Stratix family is not supported in Quartus II versions after 9.0; do not attempt to open the project in Quartus Prime 18.0+.
Uyumluluk Bilgisi
RoHS and lead-free status marked as [DATA_NEEDED]; 'N' suffix in C6N suggests Pb-free per Altera naming convention but a current material declaration certificate should be requested from the supplier. Not AEC-Q100 qualified (commercial grade FPGA). IPC-A-610 Class 2 or Class 3 assembly recommended.