EP1S25F1020C6N - Stratix 25K LE FPGA, 706 I/O, FBGA-1020 | Intel
MPN: EP1S25F1020C6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $555 | $555.00 |
| 10 | $540 | $5,400.00 |
| 100 | $510 | $51,000.00 |
| 500 | $475 | $237,500.00 |
| 1,000 | $450 | $450,000.00 |
Drop-in alternatives for EP1S25F1020C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S25F1020C6
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View Datasheet →EP1S25F1020C6N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements (LE) | 25,660 |
| Logic Cells | 25,660 |
| Embedded Memory (bits) | 1,944,576 |
| User I/O Pins | 706 |
| LABs (Logic Array Blocks) | 2,566 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.5 V |
| Package | 1020-ball FC-FBGA (33 x 33 mm, 1.0 mm pitch) |
| Maximum Internal Clock Frequency | 450.05 MHz |
| Operating Temperature | 0C to +85C (Commercial) |
| Mounting Type | Surface Mount |
| Configuration Method | JTAG or EPC configuration device |
| Family Generation | Stratix (1st generation) |
EP1S25F1020C6N 1020-ball fc-fbga (33 x 33 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for EP1S25F1020C6N (1020-ball fc-fbga (33 x 33 mm, 1.0 mm pitch) package) with 706 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S25F1020C6N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 706 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S25F1020C6N is suitable for 6 applications: Telecom Line Card Aggregation, ASIC Prototyping and Emulation, High-Speed Data Acquisition Backplane, Video Broadcast and Image Processing, DSP Pipeline Aggregation, Legacy Industrial Control and Test Equipment.
Telecom Line Card Aggregation
The EP1S25F1020C6N's 25,660 logic elements and 706 user I/O pins make it well-suited for telecom line card aggregation where multiple lower-speed serial links are multiplexed onto a higher-speed backplane. Its 1,944,576 bits of embedded TriMatrix memory provide on-chip buffering for packet re-assembly without external SRAM, while the 1.5 V core and high-speed I/O support LVDS and HSTL signaling common in backplane designs. Legacy SONET/SDH and early Ethernet switch fabrics were designed around this exact device family.
Recommended
ASIC Prototyping and Emulation
With 25,660 logic elements and abundant M4K/M-RAM memory blocks, the EP1S25F1020C6N is widely deployed in ASIC prototyping platforms where a single chip can host a large block of pre-silicon RTL. The FC-FBGA-1020 package exposes 706 I/Os, allowing designers to bring out wide internal buses for chip-to-chip multi-FPGA partitioning. Quartus II legacy synthesis supports incremental compile, so design teams can iterate on sub-modules without full place-and-route rebuilds.
Recommended
High-Speed Data Acquisition Backplane
The 706 user I/O and 1 mm pitch FC-FBGA package support high-density LVDS interfaces typical of multi-channel data acquisition cards digitizing analog signals at 100+ MSPS per channel. The embedded DSP blocks perform per-channel decimation, FIR filtering, and FFT preprocessing on-chip before storing results in the 1.9 Mbit TriMatrix memory, dramatically reducing downstream processor loading. Industrial, medical imaging, and radar prototypes were common Stratix-family use cases.
Recommended
Video Broadcast and Image Processing
The EP1S25F1020C6N's embedded multiplier blocks and high internal clock frequency (up to 450 MHz) are well-matched to SDI video processing, color-space conversion, and real-time video filtering pipelines. The TriMatrix memory subsystem handles line buffers and frame-delay elements directly, eliminating external SRAM. SD/HD-SDI, DVB-ASI, and early HDMI processing designs frequently targeted this exact Stratix part because of its I/O count and on-chip memory density.
Recommended
DSP Pipeline Aggregation
The Stratix DSP blocks deliver 18 x 18-bit signed multiplication with optional accumulation, and the EP1S25F1020C6N offers enough DSP blocks for multi-channel FIR, IIR, and FFT pipelines at baseband sample rates. Combined with 25,660 LEs for control logic and 706 I/Os for streaming interfaces, a single chip can replace multiple DSP processors in cost-sensitive designs. Legacy software-defined radio and baseband modem designs were built on this part.
Recommended
Legacy Industrial Control and Test Equipment
Long-life-cycle industrial platforms - including test equipment, machine vision controllers, and process automation - continue to specify the EP1S25F1020C6N because re-validation costs make migration away from proven Stratix silicon impractical. The commercial 0C to +85C temperature range suits factory-floor enclosures, and the FC-FBGA-1020 package provides the ruggedness required by IPC-A-610 Class 2 assembly. Secondary-market channels stock this part precisely to support such legacy installations.
Recommended
Recommended Products Summary
Engineering reference data for EP1S25F1020C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S25F1020C6 | EP1S25F1020C5N | EP1S25F1020C5 | EP1S25B672C7N |
|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA (33x33 mm, 1.0 mm pitch) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 672-ball BGA (different) |
| Brand | Altera (now Intel) | Altera (same) | Altera (same) | Altera (same) | Altera (same) |
| Logic Elements | 25,660 | 25,660 (same) | 25,660 (same) | 25,660 (same) | 25,660 (same die) |
| User I/O Pins | 706 | 706 (same) | 706 (same) | 706 (same) | 493 (different package, fewer balls) |
| Speed Grade | 6 (C6N) | 6 (same) | 5 (faster) | 5 (faster) | 7 (slower) |
| Embedded Memory (bits) | 1,944,576 | 1,944,576 (same) | 1,944,576 (same) | 1,944,576 (same) | 1,944,576 (same die) |
| Lead-Free Designator (N suffix) | Yes (Pb-free) | No (standard) | Yes (Pb-free) | No (standard) | Yes (Pb-free) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Identical silicon and package as EP1S25F1020C6 (non-N suffix) (vs EP1S25F1020C6)
- Speed grade 6 with full 1020-ball FC-FBGA availability (vs EP1S25F1020C5N)
- Mid-density Stratix with maximum I/O count in this family tier (vs EP1S25B672C7N)
Design Notes
The FC-FBGA-1020 package uses 1.0 mm pitch flip-chip solder balls. PCB fabrication must use laser-drilled or mechanically drilled micro-vias with 0.2 mm via-pad and 0.4 mm capture pad. Follow Altera AN 471: 'High-Density BGA Design Guidelines' for stack-up recommendations (typically 8-layer 1 oz copper) and via-in-pad plating for thermal relief. Skip-via or dog-bone fan-out is acceptable but increases board area; via-in-pad yields a more compact 35 x 35 mm keep-out.
Estimated: at 100% logic utilization with toggling rates near 25%, the EP1S25F1020C6N core current draw reaches approximately 3 A from the 1.5 V VCCINT rail. Provide at least 4 low-ESR decoupling capacitors (220 uF bulk + 22 uF + 1 uF + 0.1 uF) physically placed within 5 mm of the BGA balls feeding VCCINT. The PLL analog VCCA rail (2.5 V) needs a dedicated ferrite-isolated LDO with 10 uF + 0.1 uF local decoupling, per the Stratix Device Handbook chapter on power distribution.
Do not confuse the EP1S25F1020 (1020-ball) variant with the EP1S25B672 (672-ball) variant - they share the same silicon die but the package pinout is entirely different, so HDL bitstreams are not interchangeable across packages. Always re-run full Quartus place-and-route when targeting a different speed grade (C6N -> C5N) because timing optimization differs. The original Stratix family is not supported in Quartus II versions after 9.0; do not attempt to open the project in Quartus Prime 18.0+.
Compliance Information
RoHS and lead-free status marked as [DATA_NEEDED]; 'N' suffix in C6N suggests Pb-free per Altera naming convention but a current material declaration certificate should be requested from the supplier. Not AEC-Q100 qualified (commercial grade FPGA). IPC-A-610 Class 2 or Class 3 assembly recommended.
