Intel

EP1S25F1020C5N - Stratix 25,660 LEs FPGA 1020-FBGA | Intel

MPN: EP1S25F1020C5N ✗ End of Life
In Stock Ships in 1-3 business days
1.5 V Vdss 1020-ball FC-FBGA Package 500 MHz Speed
From $640 USD / Unit
MOQ: 1 |
Price updated: 2026-09-06
Volume Pricing
Qty Unit Price Extended
1 $850 $850.00
10 $805 $8,050.00
100 $745 $74,500.00
500 $690 $345,000.00
1,000 $640 $640,000.00
ℹ️ All prices are in USD

Drop-in alternatives for EP1S25F1020C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP1S25F1020C5

✅ Drop-In
Altera
📦 1020-ball FC-FBGA (33x33 mm, 1.0 mm pitch)
Stratix · 25,660 · 2,566 · 1,944,576 bits (1.94 Mbits) · 706 · 130 nm CMOS · 1.5 V · 500 MHz

✓ In Stock

$650 / Unit

View Datasheet →

EP1S25F1020C6N

✅ Drop-In
Altera
📦 1020-ball FC-FBGA (33x33 mm, 1.0 mm pitch)
Stratix · 25,660 · 25,660 · 1,944,576 · 706 · 2,566 · 130 nm CMOS · 1.5 V

✓ In Stock

$450 / Unit

View Datasheet →

EP1S25F1020C7N

✅ Drop-In
📦 1020-ball FC-FBGA (33x33 mm, 1.0 mm pitch)
same die/package, -7 speed grade (fastest, Fmax ~+30% over -5), 25,660 LEs, 706 I/O, lead-free

📋 Reference alternative (not in catalog)

EP1S25F1020I6N

✅ Drop-In
Intel
📦 1020-ball FC-FBGA (33x33 mm, 1.0 mm pitch)
Stratix · 25,660 · 2,566 · 1,944,576 bits · 706 · 706 · 1.5 V · 130 nm CMOS

✓ In Stock

$1028.03 / Unit

View Datasheet →

EP1S25F1020I5N

✅ Drop-In
📦 1020-ball FC-FBGA (33x33 mm, 1.0 mm pitch)
same die/package, industrial temp grade -40 C to +100 C, -5 speed grade matches the C5N baseline

📋 Reference alternative (not in catalog)

EP1S25F1020C5N Maximum Ratings & Electrical Characteristics

Family Stratix
Logic Cells 25660
Configurable Logic Blocks (CLBs) 2852
Process Technology 130 nm CMOS
Core Supply Voltage 1.5 V
Maximum Operating Frequency 500 MHz
User I/O Pins 706
Package 1020-ball FC-FBGA
Package Dimensions 33 x 33 mm
Ball Pitch 1.0 mm
Temperature Grade Commercial (0 C to 85 C)
Speed Grade -5
Lead-Free Yes (N suffix)
Configuration Interface JTAG / EPCS boot PROM
Logic Family CMOS
Mounting Type Surface Mount (BGA)

EP1S25F1020C5N 33 x 33 mm Pin Configuration Guide

Complete pinout information for EP1S25F1020C5N (33 x 33 mm package) with 706 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

33 x 33 mm package pinout diagram for EP1S25F1020C5N

No detailed pinout data available for EP1S25F1020C5N.

Refer to the datasheet for full pin configuration.

Estimated pin count: 706 pins (digital package)

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for EP1S25F1020C5N Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EP1S25F1020C5N is suitable for 6 applications: High-Speed Digital Signal Processing (DSP), Telecommunications Baseband Processing, ASIC Prototyping and Emulation, Test and Measurement Instrumentation, Industrial Imaging and Machine Vision, Aerospace Avionics (Lab/Ground Use).

📡

High-Speed Digital Signal Processing (DSP)

The EP1S25F1020C5N's 25,660 logic cells and dedicated DSP blocks (Stratix architecture) deliver hundreds of GMACs of multiply-accumulate throughput, ideal for radar, software-defined radio, and baseband DSP. The 500 MHz Fmax across CLBs supports high-sample-rate FIR filters and FFT engines in a single device. Its 706 user I/Os accommodate wide LVDS data buses from high-speed ADCs without external muxing. The 1.5 V core supply and 130 nm CMOS process are mature for long-life programs; the commercial 0-85 C temperature grade suits lab and protected enclosures. Use Quartus II DSP Builder to accelerate design capture.

🌐

Telecommunications Baseband Processing

Telecom baseband designs demand parallel processing for channel coding, modulation/demodulation, and protocol stack acceleration - the EP1S25F1020C5N's embedded TriMatrix memory blocks provide distributed and block RAM ideal for symbol buffers, while DSP blocks accelerate Viterbi/Turbo decoders. The 706 I/Os support multiple CPRI or OBSAI links alongside fabric interconnect. The 1020-ball FC-FBGA package integrates well on telecom line cards with controlled impedance stackups. The C5N commercial temp grade suits indoor base-station and central-office environments; for outdoor radio units, consider the I-grade variant instead.

🖥️

ASIC Prototyping and Emulation

With 25,660 LEs and 706 I/Os, the EP1S25F1020C5N functions as a mid-density ASIC prototype vehicle for designs targeting gate counts in the 100k-300k region. The Stratix LUT-based architecture and abundant routing fabric support deep logic cones and complex state machines. Multiple FPGAs can be partitioned via LVDS across the 706 I/Os for larger ASIC prototypes. JTAG configuration supports fast design iteration. The C5N commercial temp grade is appropriate for lab bring-up; Quartus II provides ASIC-equivalent timing analysis to de-risk tape-out. The 1020-ball BGA requires careful PCB layout but enables high signal count per device.

🔬

Test and Measurement Instrumentation

The EP1S25F1020C5N's parallel processing capability makes it suitable for arbitrary waveform generators, logic analyzers, and protocol testers where multiple stimulus/response channels must operate concurrently. Its 706 I/Os drive many comparator/buffer paths without external muxing, and the 500 MHz Fmax supports high-symbol-rate pattern generation. The commercial 0-85 C range covers standard lab environments; the -5 speed grade balances timing margin with availability. JTAG configuration simplifies field firmware updates for shipped instruments. Designers should consider the C6N variant if headroom is needed for timing closure at high toggle rates.

🎥

Industrial Imaging and Machine Vision

Image-processing pipelines (preprocessing, segmentation, feature extraction) benefit from the EP1S25F1020C5N's parallel DSP blocks and TriMatrix memory, which can sustain real-time pixel rates from multiple Camera Link or LVDS camera streams. The 706 I/Os accommodate parallel image data paths plus trigger/control signals. The 1020-ball FC-FBGA supports controlled-impedance routing needed for high-fidelity LVDS image links. For industrial environments requiring -40 to +100 C operation, substitute the I5N or I6N variant on the same footprint. Quartus II IP libraries include Camera Link receivers and Sobel/FFT cores.

✈️

Aerospace Avionics (Lab/Ground Use)

Although the EP1S25F1020C5N is commercial grade, it remains useful for lab-based avionics development, ground-test rigs, and hardware-in-the-loop simulation where the -40 to +85 C industrial range is not required. Its 25,660 LEs accommodate MIL-STD-1553, ARINC 429, and other avionics protocol stacks alongside processing logic. The 706 I/Os allow interfacing to legacy avionic buses through transceivers. Note: actual flight hardware should use radiation-hardened or ruggedized parts; this FPGA is appropriate for non-flight ground systems only. The 1020-ball FC-FBGA package integrates well on conduction-cooled test boards.

Recommended Products Summary

AD6645 High-speed ADC for DSP front-end Used in: High-Speed Digital Signal Processing (DSP) EP1S25F1020C5 Altera Used in: High-Speed Digital Signal Processing (DSP), Test and Measurement Instrumentation EP2S25F1020C5 Stratix II upgrade in same package Used in: High-Speed Digital Signal Processing (DSP) TLK1501 SerDes companion for backhaul links Used in: Telecommunications Baseband Processing EP1S20F780C6N Intel Used in: Telecommunications Baseband Processing EPCS16SI8N Configuration boot PROM Used in: Telecommunications Baseband Processing, Industrial Imaging and Machine Vision EP1S25F1020C6N Altera Used in: ASIC Prototyping and Emulation, Aerospace Avionics (Lab/Ground Use) EPCS64SI16N Larger configuration memory for multi-image prototypes Used in: ASIC Prototyping and Emulation EP1S40F1020C5N Intel Used in: ASIC Prototyping and Emulation AD9854 DDS for waveform synthesis complement Used in: Test and Measurement Instrumentation SN74AVC16834 Wide bus buffer for I/O expansion Used in: Test and Measurement Instrumentation DS90CR286A Channel Link receiver for camera data Used in: Industrial Imaging and Machine Vision EP1S25F1020I6N Intel Used in: Industrial Imaging and Machine Vision HI-3593 MIL-STD-1553 transceiver companion Used in: Aerospace Avionics (Lab/Ground Use) EP1S20F672C6N Intel Used in: Aerospace Avionics (Lab/Ground Use)
What is the logic cell count of the EP1S25F1020C5N?
The EP1S25F1020C5N contains 25,660 logic cells organized into 2,852 Configurable Logic Blocks (CLBs). According to the Intel/Altera Stratix datasheet, this positions it as a mid-density member of the Stratix family - above the EP1S10/EP1S20 but below the EP1S40 and EP1S60. This density supports high-throughput DSP, telecom baseband, and ASIC prototyping workloads.
What package does the EP1S25F1020C5N use?
The EP1S25F1020C5N ships in a 1020-ball Fine-pitch Chip-Scale BGA (FC-FBGA) measuring 33 x 33 mm with 1.0 mm ball pitch. This package provides 706 user I/O pins, ample for high-density LVDS/LVCMOS signaling. Per the verified Intel datasheet entry, the package is also described as BGA-1020 or PBGA1020 across distributor listings.
What is the operating temperature range of EP1S25F1020C5N?
The EP1S25F1020C5N operates across the commercial temperature range of 0 C to 85 C. The C5 speed-grade and C temperature suffix in the part number encode this rating. For industrial applications requiring -40 C to +100 C, consider the EP1S25F1020I5N industrial variant instead.
Is the EP1S25F1020C5N obsolete or active?
The EP1S25F1020C5N is classified as obsolete. Intel/Altera Stratix (original) devices have been superseded by Stratix II, III, IV, and the current Stratix V/10 families, and the original Stratix line is no longer in production. Stock remains available through authorized distributors and the secondary market, but lead times for new orders are quote-based.
Where can I buy the EP1S25F1020C5N online?
Authorized distributors and specialist brokers list the EP1S25F1020C5N, including Octopart-aggregated inventory (2 active distributors at last check) plus secondary-market channels such as Avnet, Mouser legacy stock, and independent brokers like Jotrin, Kynix, and Karl Kruse. Pricing as of 2026-09-07 typically ranges from $640-$850 USD per unit depending on quantity break and condition (new vs. refurbished).
What is the lead time for the EP1S25F1020C5N?
Lead time for the EP1S25F1020C5N is quote-based rather than stock-based, since the part is obsolete and not in continuous production. Distributors typically quote 8-16 weeks for factory-direct orders or 1-3 weeks for in-stock or broker-sourced inventory as of 2026-09-07. Always confirm current lead times directly with the distributor, as obsolete-part lead times fluctuate.
What is the price of EP1S25F1020C5N?
Pricing for the EP1S25F1020C5N as of 2026-09-07 is approximately $850 USD at qty 1, dropping to roughly $640 USD per unit at qty 1000. Intel/Altera original Stratix devices command a premium due to obsolescence; pricing varies substantially by distributor, condition (new, refurbished, pulled), and lot traceability. Always request a current quote.
EP1S25F1020C5N vs EP1S25F1020I6 - which is better for industrial applications?
For industrial applications, the EP1S25F1020I6 is the better choice because it supports the industrial temperature range (-40 C to +100 C) versus the EP1S25F1020C5N's commercial 0-85 C range. Both share the same 1020-ball FC-FBGA package, 25,660 logic cells, and 706 I/O count, so the pinout and PCB footprint are identical - only the temperature grade differs.
When should I choose EP1S25F1020C5N over EP1S25F1020C6?
Choose the EP1S25F1020C5N when a slightly lower speed grade is acceptable in exchange for tighter inventory availability. The EP1S25F1020C5N is the -5 speed grade (slower); the EP1S25F1020C6 is -6 (faster). Both share the 1020-ball FC-FBGA package and are pin-compatible drop-in parts - so the choice depends on Fmax requirements versus cost and stock.
Is there a drop-in replacement for the EP1S25F1020C5N?
The closest drop-in replacement for the EP1S25F1020C5N is the EP1S25F1020C5 (non-N suffix), which shares identical package, pinout, logic cell count, and speed grade - differing only in lead-free packaging designation per the FindIC comparison. For higher speed grades, EP1S25F1020C6 and EP1S25F1020C7N are drop-in alternatives; for industrial temperature range, EP1S25F1020I6 substitutes on the same footprint.
What is the equivalent Intel/Altera part for an Xilinx FPGA replacing EP1S25F1020C5N?
A Xilinx equivalent with comparable logic density (around 25,660 LEs/CLBs) is the Xilinx Virtex-II Pro series, which offers a similar LUT-based architecture, 130 nm process, and BGA packaging options. However, Xilinx Virtex-II Pro parts are NOT pin-compatible drop-in replacements for the EP1S25F1020C5N - PCB redesign, tool-chain migration (Quartus to ISE/Vivado), and IP re-licensing are required.
Where can I download the EP1S25F1020C5N datasheet PDF?
The official EP1S25F1020C5N datasheet is bundled within the Intel/Altera Stratix Device Handbook, available as a free PDF at https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/stx/stratix_handbook.pdf. The verified web data also surfaces distributor listings on datasheets.com, FindIC, and Octopart that link to the same handbook PDF for the Stratix family.
What are the key specifications of the EP1S25F1020C5N that engineers should know?
Engineers evaluating the EP1S25F1020C5N should know: 25,660 logic cells / 2,852 CLBs, 1.5 V core supply, 500 MHz max Fmax, 706 user I/Os, 1020-ball FC-FBGA at 33x33 mm with 1.0 mm pitch, 130 nm CMOS process, commercial 0-85 C temperature grade, -5 speed grade, and obsolete lifecycle status. The device is programmed via Quartus II via JTAG or EPCS boot PROM.
Hey Google, what can replace the EP1S25F1020C5N?
The EP1S25F1020C5N can be replaced by the EP1S25F1020C5 (same die, no N suffix), EP1S25F1020C6 (faster speed grade), or EP1S25F1020I6 (industrial temp) - all in the same 1020-ball FC-FBGA footprint per verified FindIC cross-reference data. For modern designs, the Stratix II EP2S25F1020C5 offers higher performance in the same package and is recommended for new development.
Is the EP1S25F1020C5N the same as the EP1S25F1020C5?
The EP1S25F1020C5N is essentially the same die and package as the EP1S25F1020C5, differing only in the N suffix which denotes lead-free (Pb-free) terminal finish. Per FindIC, they are 'completely replaceable' with consistent terminals, package, and main performance parameters. The C5N variant is the preferred drop-in for lead-free PCB assembly requirements.

Engineering reference data for EP1S25F1020C5N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP1S25F1020C5N when you need a mid-density original-Stratix FPGA (25,660 LEs, 706 I/Os, 500 MHz Fmax) in a 1020-ball FC-FBGA package with lead-free finish and commercial 0-85 C temperature range - and your design does not require industrial temp or a faster speed grade. Choose EP1S25F1020C6N if your design fails timing at -5 grade (about 15% higher Fmax). Choose EP1S25F1020I6N or EP1S25F1020I5N for industrial (-40 to +100 C) deployment. Choose EP1S25F1020C5 if your PCB process accepts lead-containing finishes and you want the lowest-cost drop-in. For new designs, consider the Stratix II EP2S25F1020C5 in the same package, which offers higher performance on a 90 nm process.

Comparison with Alternatives

Parameter This Product EP1S25F1020C5 EP1S25F1020C6N EP1S25F1020C7N EP1S25F1020I6N EP1S25F1020I5N
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 1020-ball FC-FBGA 33x33 mm, 1.0 mm pitch 1020-ball FC-FBGA 33x33 mm, 1.0 mm pitch - same 1020-ball FC-FBGA 33x33 mm, 1.0 mm pitch - same 1020-ball FC-FBGA 33x33 mm, 1.0 mm pitch - same 1020-ball FC-FBGA 33x33 mm, 1.0 mm pitch - same 1020-ball FC-FBGA 33x33 mm, 1.0 mm pitch - same
Logic Cells 25660 25660 25660 25660 25660 25660
Speed Grade -5 -5 -6 (faster) -7 (fastest) -6 (faster) -5 (matches baseline)
Temperature Grade Commercial 0 C to 85 C Commercial 0 C to 85 C Commercial 0 C to 85 C Commercial 0 C to 85 C Industrial -40 C to 100 C Industrial -40 C to 100 C
User I/O Count 706 706 706 706 706 706
Core Voltage 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
Process Technology 130 nm CMOS 130 nm CMOS 130 nm CMOS 130 nm CMOS 130 nm CMOS 130 nm CMOS
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete
Approx Unit Price (qty 1, USD) 850.00 [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]

Key Differentiators

  • Mid-density sweet spot in the original Stratix family (vs EP1S10F780C6N)
  • Lead-free (N suffix) terminal finish (vs EP1S25F1020C5)
  • Identical die, faster speed grade option available (vs EP1S25F1020C6N)

Design Notes

The 1020-ball FC-FBGA at 1.0 mm pitch requires 4-6 layer PCB stackup with microvia or via-in-pad construction. Use dog-bone fanout only if your fab cannot do microvias. Maintain 50 ohm controlled impedance on LVDS pairs and matched-length routing within 50 mil for high-speed interfaces. Provide at least 4 ground-referenced power planes under the BGA for VCCINT, VCCIO, and GND to manage the 1.5 V core current transients.

Estimate (not datasheet-specified): at 500 MHz with typical Stratix toggle rates, the 1.5 V VCCINT rail can draw 1.5-3 A depending on logic utilization. Decouple with 100 uF bulk + 10 uF ceramic per regulator + 0.1 uF + 0.01 uF per power pin. The VCCIO rails (3.3 V or 2.5 V depending on I/O standard) similarly need bulk + ceramic decoupling. Use a sequencer to enforce VCCINT before VCCIO per Intel/Altera power-up guidelines.

Do not omit the configuration boot PROM (EPCS family) - the EP1S25F1020C5N cannot self-configure from flash. Ensure JTAG chain pull-ups are present on TCK/TMS/TDO/TDI. Configuration mode pins (MSEL) must be set correctly for the chosen boot mode (AS, AP, PS, JTAG). The Quartus II software version must be a legacy release supporting the original Stratix architecture (Quartus II v9.1 or earlier is typical).

Estimated: at full 25,660 LE utilization and 500 MHz toggle rate, junction power can reach 3-5 W. The FC-FBGA package has no exposed thermal pad - rely on internal balls and PCB copper for heat spreading. For enclosed industrial environments, derate toggle activity or upgrade to the I-grade variant for wider thermal headroom. Forced-air cooling is recommended above 70 C ambient.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

N suffix indicates lead-free terminal finish per Intel/Altera legacy part numbering convention. RoHS/REACH/AEC-Q100 compliance not explicitly confirmed in verified web data - flagged as unknown. Device is commercial grade (0-85 C), so AEC-Q100 automotive qualification is not applicable.

Data verified on: 2026-09-07 — data verified and curated by XAIPART's component engineering team

Related Searches

EP1S25F1020C5N datasheet EP1S25F1020C5N price Intel Altera Stratix EP1S25 FPGA 25660 logic cells FPGA 1020 FBGA EP1S25F1020C5N FBGA-1020 package FPGA 706 I/O 500 MHz 1.5V core EP1S25F1020C5N DSP baseband EP1S25F1020C5N vs EP1S25F1020C6N EP1S25F1020C5N buy online distributor EP1S25F1020C5N drop-in replacement what is the logic cell count of EP1S25F1020C5N Stratix original FPGA obsolete replacement FPGA ASIC prototyping 130nm CMOS Altera Quartus II Stratix configuration

Related Components & Terms

Intel Altera EP1S25F1020C5N EP1S25F1020C5 EP1S25F1020C6N EP1S25F1020C7N EP1S25F1020I6N EP1S25F1020I5N Stratix FPGA Field-Programmable Gate Array Configurable Logic Block CLB Logic Cell DSP Block TriMatrix Memory 130 nm CMOS FC-FBGA BGA-1020 RoHS JTAG EPCS Quartus II 1.5 V core supply 500 MHz Fmax LVDS ASIC prototyping telecom baseband digital signal processing
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