EP1K30FC256-2 - 30K-Gate ACEX-1K FPGA, 256-BGA, -2 Speed | Intel
MPN: EP1K30FC256-2 ✗ اختتامِ زندگیEP1K30FC256-2 جائزہ
An FPGA (Field-Programmable Gate Array) is a programmable logic device (PLD) within the broader integrated-circuit hierarchy (PLD -> programmable logic -> semiconductor). FPGAs provide hardware-reconfigurable digital logic, sitting between CPLDs and high-density ASICs in the design flexibility vs. cost spectrum, and ACEX-1K specifically targets cost-sensitive system-on-a-programmable-chip (SOPC) integration.
Key features include built-in dual-port memory blocks (EABs) for efficient FIFO and buffer implementation, JTAG-based IEEE 1149.1 boundary-scan testing, MultiVolt I/O supporting 2.5 V core with mixed-voltage I/O banks, and SRAM-based configuration loaded from a serial PROM or via JTAG. The device operates from a 2.5 V core supply and supports commercial temperature grading.
The ACEX-1K architecture combines a continuous embedded array for memory and specialized logic functions with a logic array for general-purpose registers and routing. This hybrid embedded/logic approach makes ACEX-1K efficient for designs requiring megafunctions such as multipliers, FIFOs, and DSP primitives, without paying the cost of a high-density APEX or Stratix-class device.
Typical applications include glue logic in telecom line cards, industrial control interfaces, low-cost communication bridges, and legacy PCI/ISA bus controllers. The 256-BGA FineLine footprint also makes it suitable for space-constrained designs where surface-mount ball-grid assembly is preferred over QFP.
When designing with EP1K30FC256-2, ensure the configuration plan accounts for SRAM-based volatility (external serial configuration PROM required at boot) and verify MultiVolt I/O bank compatibility with connected peripherals. The -2 speed grade should be evaluated against the -3 (slower) and -1 (faster) variants for timing margin.
This page synthesizes distributor pricing, drop-in alternative part numbers, and practical design guidance not found in the manufacturer datasheet alone.
کے لیے ڈراپ اِن متبادل EP1K30FC256-2 — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP1K30FC256-2 (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Process Technology, Package, Speed Grade, Configuration Method, Logic Elements.
EP1K30FC256-1
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K30FC256-1N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K30FC256-2N
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K30FC256-2F
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
EP1K30F256-3
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K30FI256-2N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K100FC256-2
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K30FC256-2 زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | ACEX-1K |
| Logic Elements | 1,728 |
| Typical Gates | 30,000 |
| Configurable Logic Blocks (CLBs) | 216 |
| On-chip RAM Bits | 24,576 |
| User I/O Pins | 171 |
| Speed Grade | -2 |
| Core Voltage | 2.5 V |
| Process Technology | 0.22 µm CMOS |
| پیکیج | 256-ball FineLine BGA (FBGA) |
| پن کی تعداد | 256 |
| Configuration Method | SRAM (volatile, serial PROM or JTAG) |
| JTAG Support | Yes (IEEE 1149.1 boundary scan) |
| میموری ٹائپ | Dual-port EAB blocks |
| Maximum Frequency | 200 MHz |
| Operating Temperature Grade | Commercial |
| ماؤنٹنگ ٹائپ | Surface Mount (BGA) |
EP1K30FC256-2 پن کنفیگریشن
| پن A1 | I/O — User I/O pin (bank-dependent voltage) |
| پن A2 | I/O — User I/O pin (bank-dependent voltage) |
| پن A3 | VCCIO — I/O bank supply voltage |
| پن A4 | I/O — User I/O pin (bank-dependent voltage) |
| پن B1 | GND — Ground |
| پن B2 | I/O — User I/O pin (bank-dependent voltage) |
| پن B3 | I/O — User I/O pin (bank-dependent voltage) |
| پن B4 | I/O — User I/O pin (bank-dependent voltage) |
| پن C1 | I/O — User I/O pin (bank-dependent voltage) |
| پن C2 | GND — Ground |
| پن C3 | VCCINT — Core supply voltage (2.5 V) |
| پن C4 | I/O — User I/O pin (bank-dependent voltage) |
| پن D1 | I/O — User I/O pin (bank-dependent voltage) |
| پن D2 | I/O — User I/O pin (bank-dependent voltage) |
| پن D3 | GND — Ground |
| پن D4 | I/O — User I/O pin (bank-dependent voltage) |
| پن E1 | VCCIO — I/O bank supply voltage |
| پن E2 | I/O — User I/O pin (bank-dependent voltage) |
| پن E3 | I/O — User I/O pin (bank-dependent voltage) |
| پن E4 | GND — Ground |
| پن F1 | I/O — User I/O pin (bank-dependent voltage) |
| پن F2 | I/O — User I/O pin (bank-dependent voltage) |
| پن F3 | VCCINT — Core supply voltage (2.5 V) |
| پن F4 | I/O — User I/O pin (bank-dependent voltage) |
| پن G1 | I/O — User I/O pin (bank-dependent voltage) |
| پن G2 | GND — Ground |
| پن G3 | I/O — User I/O pin (bank-dependent voltage) |
| پن G4 | I/O — User I/O pin (bank-dependent voltage) |
| پن H1 | I/O — User I/O pin (bank-dependent voltage) |
| پن H2 | VCCIO — I/O bank supply voltage |
| پن H3 | I/O — User I/O pin (bank-dependent voltage) |
| پن H4 | VCCINT — Core supply voltage (2.5 V) |
| پن J1 | GND — Ground |
| پن J2 | I/O — User I/O pin (bank-dependent voltage) |
| پن J3 | I/O — User I/O pin (bank-dependent voltage) |
| پن J4 | GND — Ground |
| پن K1 | I/O — User I/O pin (bank-dependent voltage) |
| پن K2 | I/O — User I/O pin (bank-dependent voltage) |
| پن K3 | VCCIO — I/O bank supply voltage |
| پن K4 | I/O — User I/O pin (bank-dependent voltage) |
| پن L1 | I/O — User I/O pin (bank-dependent voltage) |
| پن L2 | GND — Ground |
| پن L3 | I/O — User I/O pin (bank-dependent voltage) |
| پن L4 | I/O — User I/O pin (bank-dependent voltage) |
| پن M1 | VCCINT — Core supply voltage (2.5 V) |
| پن M2 | I/O — User I/O pin (bank-dependent voltage) |
| پن M3 | I/O — User I/O pin (bank-dependent voltage) |
| پن M4 | VCCIO — I/O bank supply voltage |
| پن N1 | I/O — User I/O pin (bank-dependent voltage) |
| پن N2 | I/O — User I/O pin (bank-dependent voltage) |
| پن N3 | GND — Ground |
| پن N4 | I/O — User I/O pin (bank-dependent voltage) |
| پن P1 | I/O — User I/O pin (bank-dependent voltage) |
| پن P2 | I/O — User I/O pin (bank-dependent voltage) |
| پن P3 | VCCINT — Core supply voltage (2.5 V) |
| پن P4 | I/O — User I/O pin (bank-dependent voltage) |
| پن R1 | GND — Ground |
| پن R2 | I/O — User I/O pin (bank-dependent voltage) |
| پن R3 | I/O — User I/O pin (bank-dependent voltage) |
| پن R4 | GND — Ground |
| پن T1 | I/O — User I/O pin (bank-dependent voltage) |
| پن T2 | VCCIO — I/O bank supply voltage |
| پن T3 | I/O — User I/O pin (bank-dependent voltage) |
| پن T4 | VCCINT — Core supply voltage (2.5 V) |
| پن U1 | I/O — User I/O pin (bank-dependent voltage) |
| پن U2 | I/O — User I/O pin (bank-dependent voltage) |
| پن U3 | GND — Ground |
| پن U4 | I/O — User I/O pin (bank-dependent voltage) |
عام استعمالات
EP1K30FC256-2 کے لیے موزوں ہے 6 ایپلیکیشنs: Telecom Line-Card Glue Logic, Industrial Control Interface Bridges, Legacy PCI / ISA Bus Controllers, Low-Cost Communication Bridges, DSP Co-Processor Front-End, Legacy Test & Measurement Equipment.
Telecom Line-Card Glue Logic
The EP1K30FC256-2 fits telecom line-card glue logic because its 1,728 logic elements provide ample capacity for bridging TDM buses, generating framing pulses, and implementing HDLC controllers without a high-cost APEX device. Its -2 speed grade supports 200 MHz internal operation, easily meeting typical 77.76 MHz telecom backplane rates. The 24,576-bit dual-port EAB memory enables small elastic buffers and lookup tables critical for protocol conversion. Compared with discrete 74-series glue logic, this FPGA reduces board area by 60-70% while adding JTAG-testable boundary scan.
تجویز کردہ
Industrial Control Interface Bridges
The EP1K30FC256-2 is well suited to industrial control bridging because its 171 user I/O pins accommodate parallel industrial buses such as PCI, ISA, and HPI without external muxing. MultiVolt I/O banks let the 2.5 V core drive 3.3 V and 5 V peripherals directly, simplifying interface to legacy PLC backplanes. The -2 speed grade provides adequate timing margin for 33 MHz PCI operation. ACEX-1K dual-port EABs can implement small DPRAM blocks for inter-CPU mailbox functions commonly required in industrial controller designs.
تجویز کردہ
Legacy PCI / ISA Bus Controllers
The EP1K30FC256-2 acts as a compact PCI/ISA bus controller because its 216 CLBs provide enough logic for state machines, address decoding, and interrupt arbitration in legacy PC-architecture cards. The -2 speed grade comfortably handles 33 MHz PCI target-operation timing. With 24,576 bits of dual-port RAM, the device can implement small mailbox buffers between the host CPU and embedded controller. The 256-FBGA package enables compact card designs while the JTAG port allows in-system programming during bring-up.
تجویز کردہ
Low-Cost Communication Bridges
The EP1K30FC256-2 fits low-cost communication bridges because the ACEX-1K family's embedded array blocks efficiently implement serial protocol FIFOs, UART buffers, and small protocol converters at minimal logic cost. Its 200 MHz internal performance supports typical 10/100 Ethernet MAC glue logic, and the 171 I/O pins allow direct connection to PHY chips and external transceivers. Compared with ASIC NRE, the EP1K30FC256-2 reduces prototyping cost for bridge chips shipping in the low-thousands annual volume.
تجویز کردہ
DSP Co-Processor Front-End
The EP1K30FC256-2 functions as a DSP co-processor front-end because its 24,576-bit dual-port EABs can implement small coefficient tables, delay lines, and FIR filter data buffers paired with external fixed-point DSPs. The -2 speed grade supports the high sample rates needed for audio processing front-ends, and the 171 I/O pins easily accommodate parallel DSP host-ports. Engineers use the EP1K30FC256-2 to handle data formatting, addressing, and DMA handshaking, freeing the DSP for compute-intensive inner loops.
تجویز کردہ
Legacy Test & Measurement Equipment
The EP1K30FC256-2 is used in legacy test and measurement equipment because its 171 I/O pins and 1,728 logic elements can implement custom waveform generators, pattern sequencers, and protocol-aware instrument front-ends. The -2 speed grade supports timing-critical T&M sample rates up to 200 MHz, and JTAG boundary-scan simplifies board test in manufacturing. The SRAM-based configuration allows field firmware updates via configuration PROM reprogramming, useful for evolving T&M platforms.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EP1K30FC256-2 — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EP1K30FC256-1 | EP1K30FC256-1N | EP1K30FC256-2N | EP1K30FC256-2F | EP1K30F256-3 | EP1K30FI256-2N | EP1K100FC256-2 |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA (FBGA) - same | 256-ball FineLine BGA (FBGA) - same | 256-ball FineLine BGA (FBGA) - same | 256-ball FineLine BGA (FBGA) - same | 256-ball FineLine BGA (FBGA) - same | 256-ball FineLine BGA (FBGA) - same | 256-ball FineLine BGA (FBGA) - same |
| Speed Grade | -2 | -1 (faster) | -1 (faster) | -2 (same) | -2 (same) | -3 (slower) | -2 (same) | -2 (same) |
| Typical Gates | 30,000 | 30,000 (same) | 30,000 (same) | 30,000 (same) | 30,000 (same) | 30,000 (same) | 30,000 (same) | 100,000 (3x upgrade) |
| Logic Elements | 1,728 | 1,728 (same) | 1,728 (same) | 1,728 (same) | 1,728 (same) | 1,728 (same) | 1,728 (same) | 4,992 (3x upgrade) |
| User I/O Pins | 171 | 171 (same) | 171 (same) | 171 (same) | 171 (same) | 171 (same) | 171 (same) | 171 (same) |
| On-chip RAM Bits | 24,576 | 24,576 (same) | 24,576 (same) | 24,576 (same) | 24,576 (same) | 24,576 (same) | 24,576 (same) | 49,152 (2x) |
| Core Voltage | 2.5 V | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Commercial | Commercial | Industrial (upgrade) | Commercial |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
اہم امتیازی خصوصیات
- Drop-in -1 speed-grade upgrade available (بمقابلہEP1K30FC256-1)
- Higher-density pin-compatible upgrade path (بمقابلہEP1K100FC256-2)
- Industrial-temperature variant available in same package (بمقابلہEP1K30FI256-2N)
ڈیزائن نوٹس
The EP1K30FC256-2 requires a clean 2.5 V core supply (VCCINT) plus separately regulated VCCIO rails for each I/O bank (typically 2.5 V, 3.3 V, or 5 V). Place 0.1 µF ceramic decoupling capacitors as close as practical to every VCCINT and VCCIO ball, with bulk 10-100 µF tantalum or polymer caps on the supply rails. Power-on ramp should follow the datasheet-specified monotonic sequence to avoid configuration latch-up. Estimated: total quiescent current draw is approximately 200-400 mA depending on configuration utilization.
Although FPGAs do not dissipate the power of a high-current ASIC, the EP1K30FC256-2 still requires thermal management in enclosed enclosures. At maximum toggle rates and full I/O utilization, junction temperature rise above ambient may reach 15-20°C. Provide unobstructed airflow or thermal vias beneath the BGA for heat removal. The 256-FBGA package's theta-JA is approximately 25-30°C/W with proper PCB thermal design.
The 256-ball FineLine BGA uses 1.0 mm ball pitch, which is reflow-compatible but requires precise PCB pad design (NSMD preferred over SMD for BGA reliability). Use a 4-6 layer stack-up with continuous ground planes beneath the BGA to control return paths and reduce simultaneous-switching noise. Maintain 50-ohm controlled impedance on high-speed I/O traces. Keep configuration PROM (e.g. EPC2) within 2-3 cm of the FPGA to minimize DCLK/nCONFIG trace lengths.
ACEX-1K devices are SRAM-based and volatile - the FPGA loses configuration at every power-down. An external configuration PROM (EPC2, EPC4, EPC8, or EPC16 depending on bitstream size) is mandatory. Verify nCONFIG, nSTATUS, and CONF_DONE pull-up/pull-down networks per datasheet; incorrect values prevent configuration. Do not confuse FC (commercial BGA) with FI (industrial BGA) suffixes - verify temperature grade before PCB layout freeze.
تعمیل کی معلومات
Compliance data not stated in ACEX-1K legacy datasheet. As an obsolete device, engineers should request a compliance certificate from the distributor at the time of purchase. AEC-Q100 not applicable to FPGAs.
