EP1K30FC256-2 - 30K-Gate ACEX-1K FPGA, 256-BGA, -2 Speed | Intel
MPN: EP1K30FC256-2 ✗ Cuối đờiEP1K30FC256-2 Tóm tắt
An FPGA (Field-Programmable Gate Array) is a programmable logic device (PLD) within the broader integrated-circuit hierarchy (PLD -> programmable logic -> semiconductor). FPGAs provide hardware-reconfigurable digital logic, sitting between CPLDs and high-density ASICs in the design flexibility vs. cost spectrum, and ACEX-1K specifically targets cost-sensitive system-on-a-programmable-chip (SOPC) integration.
Key features include built-in dual-port memory blocks (EABs) for efficient FIFO and buffer implementation, JTAG-based IEEE 1149.1 boundary-scan testing, MultiVolt I/O supporting 2.5 V core with mixed-voltage I/O banks, and SRAM-based configuration loaded from a serial PROM or via JTAG. The device operates from a 2.5 V core supply and supports commercial temperature grading.
The ACEX-1K architecture combines a continuous embedded array for memory and specialized logic functions with a logic array for general-purpose registers and routing. This hybrid embedded/logic approach makes ACEX-1K efficient for designs requiring megafunctions such as multipliers, FIFOs, and DSP primitives, without paying the cost of a high-density APEX or Stratix-class device.
Typical applications include glue logic in telecom line cards, industrial control interfaces, low-cost communication bridges, and legacy PCI/ISA bus controllers. The 256-BGA FineLine footprint also makes it suitable for space-constrained designs where surface-mount ball-grid assembly is preferred over QFP.
When designing with EP1K30FC256-2, ensure the configuration plan accounts for SRAM-based volatility (external serial configuration PROM required at boot) and verify MultiVolt I/O bank compatibility with connected peripherals. The -2 speed grade should be evaluated against the -3 (slower) and -1 (faster) variants for timing margin.
This page synthesizes distributor pricing, drop-in alternative part numbers, and practical design guidance not found in the manufacturer datasheet alone.
Bộ thay thế dễ dàng lắp đặt cho EP1K30FC256-2 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1K30FC256-2 (cùng hình factor và footprint) — khác nhau ở Process Technology, Package, Speed Grade, Configuration Method, Logic Elements.
EP1K30FC256-1
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K30FC256-1N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K30FC256-2N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP1K30FC256-2F
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP1K30F256-3
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K30FI256-2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K100FC256-2
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP1K30FC256-2 Tỷ lệ tối đa & tính chất điện
| Family | ACEX-1K |
| Logic Elements | 1,728 |
| Typical Gates | 30,000 |
| Configurable Logic Blocks (CLBs) | 216 |
| On-chip RAM Bits | 24,576 |
| User I/O Pins | 171 |
| Speed Grade | -2 |
| Core Voltage | 2.5 V |
| Process Technology | 0.22 µm CMOS |
| Hộp | 256-ball FineLine BGA (FBGA) |
| Số chân | 256 |
| Configuration Method | SRAM (volatile, serial PROM or JTAG) |
| JTAG Support | Yes (IEEE 1149.1 boundary scan) |
| Kiểu bộ nhớ | Dual-port EAB blocks |
| Maximum Frequency | 200 MHz |
| Operating Temperature Grade | Commercial |
| Kiểu lắp đặt | Surface Mount (BGA) |
Cấu hình chân EP1K30FC256-2
| Chân A1 | I/O — User I/O pin (bank-dependent voltage) |
| Chân A2 | I/O — User I/O pin (bank-dependent voltage) |
| Chân A3 | VCCIO — I/O bank supply voltage |
| Chân A4 | I/O — User I/O pin (bank-dependent voltage) |
| Chân B1 | GND — Ground |
| Chân B2 | I/O — User I/O pin (bank-dependent voltage) |
| Chân B3 | I/O — User I/O pin (bank-dependent voltage) |
| Chân B4 | I/O — User I/O pin (bank-dependent voltage) |
| Chân C1 | I/O — User I/O pin (bank-dependent voltage) |
| Chân C2 | GND — Ground |
| Chân C3 | VCCINT — Core supply voltage (2.5 V) |
| Chân C4 | I/O — User I/O pin (bank-dependent voltage) |
| Chân D1 | I/O — User I/O pin (bank-dependent voltage) |
| Chân D2 | I/O — User I/O pin (bank-dependent voltage) |
| Chân D3 | GND — Ground |
| Chân D4 | I/O — User I/O pin (bank-dependent voltage) |
| Chân E1 | VCCIO — I/O bank supply voltage |
| Chân E2 | I/O — User I/O pin (bank-dependent voltage) |
| Chân E3 | I/O — User I/O pin (bank-dependent voltage) |
| Chân E4 | GND — Ground |
| Chân F1 | I/O — User I/O pin (bank-dependent voltage) |
| Chân F2 | I/O — User I/O pin (bank-dependent voltage) |
| Chân F3 | VCCINT — Core supply voltage (2.5 V) |
| Chân F4 | I/O — User I/O pin (bank-dependent voltage) |
| Chân G1 | I/O — User I/O pin (bank-dependent voltage) |
| Chân G2 | GND — Ground |
| Chân G3 | I/O — User I/O pin (bank-dependent voltage) |
| Chân G4 | I/O — User I/O pin (bank-dependent voltage) |
| Chân H1 | I/O — User I/O pin (bank-dependent voltage) |
| Chân H2 | VCCIO — I/O bank supply voltage |
| Chân H3 | I/O — User I/O pin (bank-dependent voltage) |
| Chân H4 | VCCINT — Core supply voltage (2.5 V) |
| Chân J1 | GND — Ground |
| Chân J2 | I/O — User I/O pin (bank-dependent voltage) |
| Chân J3 | I/O — User I/O pin (bank-dependent voltage) |
| Chân J4 | GND — Ground |
| Chân K1 | I/O — User I/O pin (bank-dependent voltage) |
| Chân K2 | I/O — User I/O pin (bank-dependent voltage) |
| Chân K3 | VCCIO — I/O bank supply voltage |
| Chân K4 | I/O — User I/O pin (bank-dependent voltage) |
| Chân L1 | I/O — User I/O pin (bank-dependent voltage) |
| Chân L2 | GND — Ground |
| Chân L3 | I/O — User I/O pin (bank-dependent voltage) |
| Chân L4 | I/O — User I/O pin (bank-dependent voltage) |
| Chân M1 | VCCINT — Core supply voltage (2.5 V) |
| Chân M2 | I/O — User I/O pin (bank-dependent voltage) |
| Chân M3 | I/O — User I/O pin (bank-dependent voltage) |
| Chân M4 | VCCIO — I/O bank supply voltage |
| Chân N1 | I/O — User I/O pin (bank-dependent voltage) |
| Chân N2 | I/O — User I/O pin (bank-dependent voltage) |
| Chân N3 | GND — Ground |
| Chân N4 | I/O — User I/O pin (bank-dependent voltage) |
| Chân P1 | I/O — User I/O pin (bank-dependent voltage) |
| Chân P2 | I/O — User I/O pin (bank-dependent voltage) |
| Chân P3 | VCCINT — Core supply voltage (2.5 V) |
| Chân P4 | I/O — User I/O pin (bank-dependent voltage) |
| Chân R1 | GND — Ground |
| Chân R2 | I/O — User I/O pin (bank-dependent voltage) |
| Chân R3 | I/O — User I/O pin (bank-dependent voltage) |
| Chân R4 | GND — Ground |
| Chân T1 | I/O — User I/O pin (bank-dependent voltage) |
| Chân T2 | VCCIO — I/O bank supply voltage |
| Chân T3 | I/O — User I/O pin (bank-dependent voltage) |
| Chân T4 | VCCINT — Core supply voltage (2.5 V) |
| Chân U1 | I/O — User I/O pin (bank-dependent voltage) |
| Chân U2 | I/O — User I/O pin (bank-dependent voltage) |
| Chân U3 | GND — Ground |
| Chân U4 | I/O — User I/O pin (bank-dependent voltage) |
Ứng dụng tiêu biểu
EP1K30FC256-2 phù hợp cho 6 Áp dụngs: Telecom Line-Card Glue Logic, Industrial Control Interface Bridges, Legacy PCI / ISA Bus Controllers, Low-Cost Communication Bridges, DSP Co-Processor Front-End, Legacy Test & Measurement Equipment.
Telecom Line-Card Glue Logic
The EP1K30FC256-2 fits telecom line-card glue logic because its 1,728 logic elements provide ample capacity for bridging TDM buses, generating framing pulses, and implementing HDLC controllers without a high-cost APEX device. Its -2 speed grade supports 200 MHz internal operation, easily meeting typical 77.76 MHz telecom backplane rates. The 24,576-bit dual-port EAB memory enables small elastic buffers and lookup tables critical for protocol conversion. Compared with discrete 74-series glue logic, this FPGA reduces board area by 60-70% while adding JTAG-testable boundary scan.
Được đề xuất
Industrial Control Interface Bridges
The EP1K30FC256-2 is well suited to industrial control bridging because its 171 user I/O pins accommodate parallel industrial buses such as PCI, ISA, and HPI without external muxing. MultiVolt I/O banks let the 2.5 V core drive 3.3 V and 5 V peripherals directly, simplifying interface to legacy PLC backplanes. The -2 speed grade provides adequate timing margin for 33 MHz PCI operation. ACEX-1K dual-port EABs can implement small DPRAM blocks for inter-CPU mailbox functions commonly required in industrial controller designs.
Được đề xuất
Legacy PCI / ISA Bus Controllers
The EP1K30FC256-2 acts as a compact PCI/ISA bus controller because its 216 CLBs provide enough logic for state machines, address decoding, and interrupt arbitration in legacy PC-architecture cards. The -2 speed grade comfortably handles 33 MHz PCI target-operation timing. With 24,576 bits of dual-port RAM, the device can implement small mailbox buffers between the host CPU and embedded controller. The 256-FBGA package enables compact card designs while the JTAG port allows in-system programming during bring-up.
Được đề xuất
Low-Cost Communication Bridges
The EP1K30FC256-2 fits low-cost communication bridges because the ACEX-1K family's embedded array blocks efficiently implement serial protocol FIFOs, UART buffers, and small protocol converters at minimal logic cost. Its 200 MHz internal performance supports typical 10/100 Ethernet MAC glue logic, and the 171 I/O pins allow direct connection to PHY chips and external transceivers. Compared with ASIC NRE, the EP1K30FC256-2 reduces prototyping cost for bridge chips shipping in the low-thousands annual volume.
Được đề xuất
DSP Co-Processor Front-End
The EP1K30FC256-2 functions as a DSP co-processor front-end because its 24,576-bit dual-port EABs can implement small coefficient tables, delay lines, and FIR filter data buffers paired with external fixed-point DSPs. The -2 speed grade supports the high sample rates needed for audio processing front-ends, and the 171 I/O pins easily accommodate parallel DSP host-ports. Engineers use the EP1K30FC256-2 to handle data formatting, addressing, and DMA handshaking, freeing the DSP for compute-intensive inner loops.
Được đề xuất
Legacy Test & Measurement Equipment
The EP1K30FC256-2 is used in legacy test and measurement equipment because its 171 I/O pins and 1,728 logic elements can implement custom waveform generators, pattern sequencers, and protocol-aware instrument front-ends. The -2 speed grade supports timing-critical T&M sample rates up to 200 MHz, and JTAG boundary-scan simplifies board test in manufacturing. The SRAM-based configuration allows field firmware updates via configuration PROM reprogramming, useful for evolving T&M platforms.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1K30FC256-2 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1K30FC256-1 | EP1K30FC256-1N | EP1K30FC256-2N | EP1K30FC256-2F | EP1K30F256-3 | EP1K30FI256-2N | EP1K100FC256-2 |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA (FBGA) - same | 256-ball FineLine BGA (FBGA) - same | 256-ball FineLine BGA (FBGA) - same | 256-ball FineLine BGA (FBGA) - same | 256-ball FineLine BGA (FBGA) - same | 256-ball FineLine BGA (FBGA) - same | 256-ball FineLine BGA (FBGA) - same |
| Speed Grade | -2 | -1 (faster) | -1 (faster) | -2 (same) | -2 (same) | -3 (slower) | -2 (same) | -2 (same) |
| Typical Gates | 30,000 | 30,000 (same) | 30,000 (same) | 30,000 (same) | 30,000 (same) | 30,000 (same) | 30,000 (same) | 100,000 (3x upgrade) |
| Logic Elements | 1,728 | 1,728 (same) | 1,728 (same) | 1,728 (same) | 1,728 (same) | 1,728 (same) | 1,728 (same) | 4,992 (3x upgrade) |
| User I/O Pins | 171 | 171 (same) | 171 (same) | 171 (same) | 171 (same) | 171 (same) | 171 (same) | 171 (same) |
| On-chip RAM Bits | 24,576 | 24,576 (same) | 24,576 (same) | 24,576 (same) | 24,576 (same) | 24,576 (same) | 24,576 (same) | 49,152 (2x) |
| Core Voltage | 2.5 V | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Commercial | Commercial | Industrial (upgrade) | Commercial |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Bảo phân biệt quan trọng
- Drop-in -1 speed-grade upgrade available (vsEP1K30FC256-1)
- Higher-density pin-compatible upgrade path (vsEP1K100FC256-2)
- Industrial-temperature variant available in same package (vsEP1K30FI256-2N)
Ghi chú thiết kế
The EP1K30FC256-2 requires a clean 2.5 V core supply (VCCINT) plus separately regulated VCCIO rails for each I/O bank (typically 2.5 V, 3.3 V, or 5 V). Place 0.1 µF ceramic decoupling capacitors as close as practical to every VCCINT and VCCIO ball, with bulk 10-100 µF tantalum or polymer caps on the supply rails. Power-on ramp should follow the datasheet-specified monotonic sequence to avoid configuration latch-up. Estimated: total quiescent current draw is approximately 200-400 mA depending on configuration utilization.
Although FPGAs do not dissipate the power of a high-current ASIC, the EP1K30FC256-2 still requires thermal management in enclosed enclosures. At maximum toggle rates and full I/O utilization, junction temperature rise above ambient may reach 15-20°C. Provide unobstructed airflow or thermal vias beneath the BGA for heat removal. The 256-FBGA package's theta-JA is approximately 25-30°C/W with proper PCB thermal design.
The 256-ball FineLine BGA uses 1.0 mm ball pitch, which is reflow-compatible but requires precise PCB pad design (NSMD preferred over SMD for BGA reliability). Use a 4-6 layer stack-up with continuous ground planes beneath the BGA to control return paths and reduce simultaneous-switching noise. Maintain 50-ohm controlled impedance on high-speed I/O traces. Keep configuration PROM (e.g. EPC2) within 2-3 cm of the FPGA to minimize DCLK/nCONFIG trace lengths.
ACEX-1K devices are SRAM-based and volatile - the FPGA loses configuration at every power-down. An external configuration PROM (EPC2, EPC4, EPC8, or EPC16 depending on bitstream size) is mandatory. Verify nCONFIG, nSTATUS, and CONF_DONE pull-up/pull-down networks per datasheet; incorrect values prevent configuration. Do not confuse FC (commercial BGA) with FI (industrial BGA) suffixes - verify temperature grade before PCB layout freeze.
Thông tin tuân thủ
Compliance data not stated in ACEX-1K legacy datasheet. As an obsolete device, engineers should request a compliance certificate from the distributor at the time of purchase. AEC-Q100 not applicable to FPGAs.
