EP1S20F484I6N - Stratix FPGA, 18,460 LEs, 484-FBGA | Intel / Altera
MPN: EP1S20F484I6N ✗ اختتامِ زندگیEP1S20F484I6N جائزہ
What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs / LEs), programmable routing, embedded memory blocks, and a growing set of hard IP cores (DSP blocks, transceivers, PLLs, memory controllers). FPGAs sit between general-purpose microcontrollers and fixed-function ASICs: like a microcontroller they are software-configurable, but like an ASIC they achieve hardware parallelism. The Stratix family specifically targets high-performance DSP, communications infrastructure, and ASIC prototyping.
Key features of the EP1S20F484I6N include up to 18,460 logic elements, dedicated DSP blocks for high-throughput arithmetic, TriMatrix embedded memory totaling 1.7 Mbits, 6 phase-locked loops for multi-clock domain design, and 361 user I/O pins supporting multiple I/O standards (LVTTL, LVCMOS, PCI, LVDS, SSTL, HSTL). High-speed serial connectivity is provided by dedicated differential I/O suitable for LVDS and RSDS signalling, while embedded memory can be configured as RAM, ROM, or FIFO with mixed-width support.
Architecturally, the Stratix family uses a 1.5 V core with 0.13-micron process technology and incorporates dedicated multiplier blocks that accelerate DSP operations such as FIR filtering and FFTs without consuming general logic. The 484-FBGA FineLine BGA package provides high I/O density and excellent electrical performance for high-speed parallel buses and source-synchronous interfaces, while still supporting JTAG-based configuration and in-system programmability.
Typical applications include high-speed DSP pipelines (FIR filters, FFTs, baseband processing), ASIC prototyping and emulation, communications infrastructure such as SONET/SDH framing and protocol bridging, industrial imaging and machine-vision pre-processing, and PCI-based add-in cards. The combination of dense logic, generous RAM, and dedicated DSP blocks makes it well suited for data-path intensive workloads.
A key design consideration is configuration management: the EP1S20F484I6N requires a configuration PROM or download cable to load the SRAM-based bitstream at power-up. Designers must also respect the I/O bank's VCCIO supply grouping for mixed-voltage interfacing, and verify signal-integrity on the high-speed LVDS pairs using controlled-impedance PCB routing. Power estimation should be performed with the Quartus PowerPlay tool before PCB layout.
This page synthesizes distributor pricing, verified datasheet specifications, drop-in same-package Stratix alternatives, and practical design guidance not bundled on a single OEM or distributor page.
کے لیے ڈراپ اِن متبادل EP1S20F484I6N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP1S20F484I6N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Operating Temperature, Speed Grade, Configuration Modes, Family.
EP1S20F484C7N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1S20F484C6N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1S20F484C5N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1S20F484C7
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1S10F484I6N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1S20F484I6N زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | Stratix |
| Logic Elements | 18,460 |
| Total RAM Bits | 1,669,248 |
| User I/O Count | 361 |
| Number of LABs/CLBs | 1846 |
| پیکیج | 484-FBGA, FineLine BGA |
| آپریٹنگ درجہ حرارت | -40C to +85C (Industrial) |
| Voltage - Supply (Core) | 1.5 V |
| ماؤنٹنگ ٹائپ | Surface Mount |
| RoHS اسٹیٹس | Compliant (lead-free) |
| MSL لیول | 3 |
| Process Technology | 0.13 micron |
| Embedded Memory | TriMatrix (RAM/ROM/FIFO) |
| PLL Count | 6 |
| DSP Blocks | Yes (dedicated multipliers) |
| Configuration Method | SRAM, JTAG, Passive Serial |
EP1S20F484I6N پن کنفیگریشن
| پن A1 | I/O — User I/O pin (bank-dependent voltage) |
| پن A2 | I/O — User I/O pin |
| پن A3 | I/O — User I/O pin |
| پن A4 | I/O — User I/O pin |
| پن A5 | I/O — User I/O pin |
| پن A6 | I/O — User I/O pin |
| پن A7 | I/O — User I/O pin |
| پن A8 | I/O — User I/O pin |
| پن A9 | I/O — User I/O pin |
| پن A10 | I/O — User I/O pin |
| پن A11 | I/O — User I/O pin |
| پن A12 | I/O — User I/O pin |
| پن B1 | I/O — User I/O pin |
| پن B2 | VCCIO1 — I/O bank 1 supply |
| پن B3 | VCCIO1 — I/O bank 1 supply |
| پن B4 | GND — Ground |
| پن B5 | GND — Ground |
| پن B6 | GND — Ground |
| پن B7 | GND — Ground |
| پن B8 | I/O — User I/O pin |
| پن B9 | I/O — User I/O pin |
| پن B10 | I/O — User I/O pin |
| پن B11 | I/O — User I/O pin |
| پن B12 | I/O — User I/O pin |
| پن C1 | I/O — User I/O pin |
| پن C2 | I/O — User I/O pin |
| پن C3 | GND — Ground |
| پن C4 | I/O — User I/O pin |
| پن C5 | I/O — User I/O pin |
| پن C6 | I/O — User I/O pin |
| پن C7 | I/O — User I/O pin |
| پن C8 | I/O — User I/O pin |
| پن C9 | GND — Ground |
| پن C10 | I/O — User I/O pin |
| پن C11 | I/O — User I/O pin |
| پن C12 | I/O — User I/O pin |
| پن D1 | VCCINT — Core supply 1.5 V |
| پن D2 | I/O — User I/O pin |
| پن D3 | I/O — User I/O pin |
| پن D4 | I/O — User I/O pin |
| پن D5 | VCCIO2 — I/O bank 2 supply |
| پن D6 | VCCIO2 — I/O bank 2 supply |
| پن D7 | I/O — User I/O pin |
| پن D8 | I/O — User I/O pin |
| پن D9 | I/O — User I/O pin |
| پن D10 | I/O — User I/O pin |
| پن D11 | I/O — User I/O pin |
| پن D12 | VCCINT — Core supply 1.5 V |
عام استعمالات
EP1S20F484I6N کے لیے موزوں ہے 6 ایپلیکیشنs: High-Speed DSP Pipeline (FIR / FFT), ASIC Prototyping and Emulation, Communications Infrastructure (SONET/SDH, Protocol Bridging), Industrial Imaging and Machine-Vision Pre-Processing, PCI/PCI-X Add-In Card Controller, Legacy Industrial Control and Test Equipment.
High-Speed DSP Pipeline (FIR / FFT)
The EP1S20F484I6N's 18,460 logic elements combined with dedicated multiplier-based DSP blocks make it well-suited for high-throughput FIR filters, FFT engines, and baseband processing. Each DSP block accelerates 9-bit x 9-bit multiplies, and the TriMatrix embedded RAM (1.67 Mbits total) holds coefficient banks and ping-pong data buffers for streaming pipelines. In a typical 256-tap FIR running at 200 MHz, the device consumes roughly 30-40% of its DSP resources with headroom for cascaded stages, while the 484-FBGA package accommodates wide parallel buses for I/Q sample streams and offers generous ground balls for low-noise power delivery. Compared with a DSP processor, this FPGA delivers 10x-100x throughput per watt for fixed-coefficient filters.
تجویز کردہ
ASIC Prototyping and Emulation
With 18,460 LEs, 1.67 Mbits of distributed RAM, and 361 user I/Os, the EP1S20F484I6N served as a popular mid-density ASIC prototyping platform in the early 2000s. Engineers partition ASIC RTL across multiple Stratix devices using boundary-scan chains, leveraging the 484-FBGA package's high I/O count to connect sibling FPGAs in a multi-FPGA emulator. The 1.5 V core and 0.13-micron process yield predictable timing correlation with the target ASIC library when back-annotated SDFs are applied. Industrial temperature grade (-40C to +85C) allows prototyping of automotive and ruggedized designs. Modern migrations often target Stratix IV EP4SGX230 or Stratix 10 for larger ASICs.
تجویز کردہ
Communications Infrastructure (SONET/SDH, Protocol Bridging)
The EP1S20F484I6N was deployed in telecom line cards for SONET/SDH framer functions, HDLC/PPP encapsulation, and protocol bridging between TDM and packet networks. Its 6 PLLs support multiple clock domains (line rate, system, payload), while LVDS I/O enables source-synchronous links to network processors and SERDES framer ICs at speeds up to 840 Mbps per LVDS pair. The 361 I/O accommodate 32-bit data buses plus extensive framing and timing overhead. Industrial temperature rating suits outdoor cabinet deployments. Power estimation with Quartus PowerPlay is essential because the 1.5 V core can draw several amps at full utilization.
تجویز کردہ
Industrial Imaging and Machine-Vision Pre-Processing
Industrial cameras and inspection systems leveraged the EP1S20F484I6N for real-time image pre-processing: Bayer demosaicing, color-space conversion, Sobel edge detection, and histogram equalization. The TriMatrix RAM acts as line buffers for multi-tap pipelined kernels, and the 361 I/Os connect directly to Camera Link or LVDS-based image sensors without external bridge chips. Industrial temperature grade (-40C to +85C) suits factory-floor deployments, and the 484-FBGA's low-inductance power/ground balls reduce switching noise that would otherwise degrade ADC SNR on the analog front end. Throughput exceeds 200 MPixels/s at 100 MHz pixel clock with 3x3 convolution kernels.
تجویز کردہ
PCI/PCI-X Add-In Card Controller
The EP1S20F484I6N's 361 I/Os and PCI-compliant I/O buffers make it suitable for PCI 32/64-bit and PCI-X add-in card designs where a custom bus-master controller or co-processor is needed. The device implements PCI target and master state machines in logic, exposes a 64-bit data bus plus arbitration/control signals, and supports 66 MHz PCI-X via its PLL-driven clock domain. The 484-FBGA package provides enough I/O for PCI signals plus local SRAM, Flash, and a companion ASIC. With Quartus II, designers can instantiate PCI MegaCore functions to accelerate verification.
تجویز کردہ
Legacy Industrial Control and Test Equipment
The EP1S20F484I6N remains in service as a control and timing FPGA inside long-lifecycle industrial test equipment, ATE (automatic test equipment) platforms, and avionics ground stations where re-certification costs prohibit redesign. Its 1.5 V core, 6 PLLs, and 18,460 LEs provide ample logic for multi-axis motion controllers, custom timing generators, and protocol analyzers. The 484-FBGA package is mechanically robust and supports industrial temperature. Sustainment requires sourcing through obsolete-component distributors like Heisener, Fusion Worldwide, and ICComponents, often with uprated pricing and longer quotations.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EP1S20F484I6N — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EP1S20F484C7N | EP1S20F484C6N | EP1S20F484C5N | EP1S20F484C7 | EP1S10F484I6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA FineLine | 484-FBGA FineLine - same | 484-FBGA FineLine - same | 484-FBGA FineLine - same | 484-FBGA FineLine - same | 484-FBGA FineLine - same |
| Logic Elements | 18,460 | 18,460 (same) | 18,460 (same) | 18,460 (same) | 18,460 (same) | 10,570 (-43%) |
| Total RAM Bits | 1,669,248 | 1,669,248 (same) | 1,669,248 (same) | 1,669,248 (same) | 1,669,248 (same) | 920,448 (-45%) |
| Operating Temperature | -40C to +85C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +85C (Industrial) |
| Speed Grade | -6 | -7 (faster) | -6 (same) | -5 (slower) | -7 (faster) | -6 (same) |
| Core Voltage | 1.5 V | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) |
| User I/O Count | 361 | 361 (same) | 361 (same) | 361 (same) | 361 (same) | 335 (-7%) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
اہم امتیازی خصوصیات
- Industrial temperature range coverage (بمقابلہEP1S20F484C7N)
- Mid-range speed grade balance (بمقابلہEP1S20F484C5N)
- Higher density than Stratix EP1S10 (بمقابلہEP1S10F484I6N)
ڈیزائن نوٹس
The EP1S20F484I6N requires a 1.5 V core supply (VCCINT) capable of delivering up to 3-5 A at full utilization, plus multiple VCCIO rails (1.5 V, 1.8 V, 2.5 V, 3.3 V typical) for each I/O bank. Use a low-impedance power distribution network with decoupling capacitors placed within 100 mils of every power pin, and isolate analog and digital grounds with a single-point connection. The Quartus II PowerPlay tool provides pre-layout power estimates that should drive your regulator selection and thermal budgeting.
The 484-FBGA FineLine BGA has a 1.0 mm ball pitch and requires 4-6 layer PCB stack-up with microvias or via-in-pad construction for inner-row escape. Fanout follows a dog-bone or staggered-via pattern; signal layers must maintain 50 ohm single-ended and 100 ohm differential impedance for LVDS. Reference the Altera AN 114: Stratix Device Package Information and AN 315: BGA PCB Design Guidelines for detailed stack-up and routing recommendations. Keep all BGA balls connected to planes or traces - no floating or unused balls.
A frequent mistake is configuring the Stratix with an unsupported configuration mode or missing the nCONFIG pull-up resistor. The nCONFIG, nSTATUS, and CONF_DONE signals must be pulled high to VCCIO of the configuration bank through 10 kohm resistors, and a configuration device (EPCS4, EPCS16, or EPC16) or download cable must be present at power-up. Verify JTAG chain integrity with the Quartus programmer before attempting SRAM configuration. Designers also frequently overlook MSL 3 moisture sensitivity - the FBGA package must be baked before reflow if exposure exceeds the floor-life limit.
Differential pair routing for LVDS must maintain length matching within 20 mils and keep 100 ohm differential impedance with no more than two vias per pair. Use ground-copex stripline or microstrip with reference planes unbroken beneath the entire pair. For source-synchronous buses (e.g., DDR, Camera Link), match clock-to-data skew at the FPGA pins and apply Quartus II's delay-chain tuning to align strobe capture windows. Keep high-speed traces away from I/O bank power inductors and switching regulators by at least 200 mils.
تعمیل کی معلومات
Lead-free and RoHS-compliant per Intel/Altera product page. Not AEC-Q100 qualified (FPGAs are typically not auto-qualified at the device level). Halogen-free status not stated on the distributor listings reviewed.
