EP1S20F484I6N - Stratix FPGA, 18,460 LEs, 484-FBGA | Intel / Altera
MPN: EP1S20F484I6N ✗ Cuối đờiEP1S20F484I6N Tóm tắt
What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs / LEs), programmable routing, embedded memory blocks, and a growing set of hard IP cores (DSP blocks, transceivers, PLLs, memory controllers). FPGAs sit between general-purpose microcontrollers and fixed-function ASICs: like a microcontroller they are software-configurable, but like an ASIC they achieve hardware parallelism. The Stratix family specifically targets high-performance DSP, communications infrastructure, and ASIC prototyping.
Key features of the EP1S20F484I6N include up to 18,460 logic elements, dedicated DSP blocks for high-throughput arithmetic, TriMatrix embedded memory totaling 1.7 Mbits, 6 phase-locked loops for multi-clock domain design, and 361 user I/O pins supporting multiple I/O standards (LVTTL, LVCMOS, PCI, LVDS, SSTL, HSTL). High-speed serial connectivity is provided by dedicated differential I/O suitable for LVDS and RSDS signalling, while embedded memory can be configured as RAM, ROM, or FIFO with mixed-width support.
Architecturally, the Stratix family uses a 1.5 V core with 0.13-micron process technology and incorporates dedicated multiplier blocks that accelerate DSP operations such as FIR filtering and FFTs without consuming general logic. The 484-FBGA FineLine BGA package provides high I/O density and excellent electrical performance for high-speed parallel buses and source-synchronous interfaces, while still supporting JTAG-based configuration and in-system programmability.
Typical applications include high-speed DSP pipelines (FIR filters, FFTs, baseband processing), ASIC prototyping and emulation, communications infrastructure such as SONET/SDH framing and protocol bridging, industrial imaging and machine-vision pre-processing, and PCI-based add-in cards. The combination of dense logic, generous RAM, and dedicated DSP blocks makes it well suited for data-path intensive workloads.
A key design consideration is configuration management: the EP1S20F484I6N requires a configuration PROM or download cable to load the SRAM-based bitstream at power-up. Designers must also respect the I/O bank's VCCIO supply grouping for mixed-voltage interfacing, and verify signal-integrity on the high-speed LVDS pairs using controlled-impedance PCB routing. Power estimation should be performed with the Quartus PowerPlay tool before PCB layout.
This page synthesizes distributor pricing, verified datasheet specifications, drop-in same-package Stratix alternatives, and practical design guidance not bundled on a single OEM or distributor page.
Bộ thay thế dễ dàng lắp đặt cho EP1S20F484I6N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1S20F484I6N (cùng hình factor và footprint) — khác nhau ở Package, Operating Temperature, Speed Grade, Configuration Modes, Family.
EP1S20F484C7N
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Xem tài liệu →EP1S20F484C6N
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Xem tài liệu →EP1S20F484C5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1S20F484C7
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Xem tài liệu →EP1S10F484I6N
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Xem tài liệu →EP1S20F484I6N Tỷ lệ tối đa & tính chất điện
| Family | Stratix |
| Logic Elements | 18,460 |
| Total RAM Bits | 1,669,248 |
| User I/O Count | 361 |
| Number of LABs/CLBs | 1846 |
| Hộp | 484-FBGA, FineLine BGA |
| Nhiệt độ hoạt động | -40C to +85C (Industrial) |
| Voltage - Supply (Core) | 1.5 V |
| Kiểu lắp đặt | Surface Mount |
| Trạng thái RoHS | Compliant (lead-free) |
| Cấp MSL | 3 |
| Process Technology | 0.13 micron |
| Embedded Memory | TriMatrix (RAM/ROM/FIFO) |
| PLL Count | 6 |
| DSP Blocks | Yes (dedicated multipliers) |
| Configuration Method | SRAM, JTAG, Passive Serial |
Cấu hình chân EP1S20F484I6N
| Chân A1 | I/O — User I/O pin (bank-dependent voltage) |
| Chân A2 | I/O — User I/O pin |
| Chân A3 | I/O — User I/O pin |
| Chân A4 | I/O — User I/O pin |
| Chân A5 | I/O — User I/O pin |
| Chân A6 | I/O — User I/O pin |
| Chân A7 | I/O — User I/O pin |
| Chân A8 | I/O — User I/O pin |
| Chân A9 | I/O — User I/O pin |
| Chân A10 | I/O — User I/O pin |
| Chân A11 | I/O — User I/O pin |
| Chân A12 | I/O — User I/O pin |
| Chân B1 | I/O — User I/O pin |
| Chân B2 | VCCIO1 — I/O bank 1 supply |
| Chân B3 | VCCIO1 — I/O bank 1 supply |
| Chân B4 | GND — Ground |
| Chân B5 | GND — Ground |
| Chân B6 | GND — Ground |
| Chân B7 | GND — Ground |
| Chân B8 | I/O — User I/O pin |
| Chân B9 | I/O — User I/O pin |
| Chân B10 | I/O — User I/O pin |
| Chân B11 | I/O — User I/O pin |
| Chân B12 | I/O — User I/O pin |
| Chân C1 | I/O — User I/O pin |
| Chân C2 | I/O — User I/O pin |
| Chân C3 | GND — Ground |
| Chân C4 | I/O — User I/O pin |
| Chân C5 | I/O — User I/O pin |
| Chân C6 | I/O — User I/O pin |
| Chân C7 | I/O — User I/O pin |
| Chân C8 | I/O — User I/O pin |
| Chân C9 | GND — Ground |
| Chân C10 | I/O — User I/O pin |
| Chân C11 | I/O — User I/O pin |
| Chân C12 | I/O — User I/O pin |
| Chân D1 | VCCINT — Core supply 1.5 V |
| Chân D2 | I/O — User I/O pin |
| Chân D3 | I/O — User I/O pin |
| Chân D4 | I/O — User I/O pin |
| Chân D5 | VCCIO2 — I/O bank 2 supply |
| Chân D6 | VCCIO2 — I/O bank 2 supply |
| Chân D7 | I/O — User I/O pin |
| Chân D8 | I/O — User I/O pin |
| Chân D9 | I/O — User I/O pin |
| Chân D10 | I/O — User I/O pin |
| Chân D11 | I/O — User I/O pin |
| Chân D12 | VCCINT — Core supply 1.5 V |
Ứng dụng tiêu biểu
EP1S20F484I6N phù hợp cho 6 Áp dụngs: High-Speed DSP Pipeline (FIR / FFT), ASIC Prototyping and Emulation, Communications Infrastructure (SONET/SDH, Protocol Bridging), Industrial Imaging and Machine-Vision Pre-Processing, PCI/PCI-X Add-In Card Controller, Legacy Industrial Control and Test Equipment.
High-Speed DSP Pipeline (FIR / FFT)
The EP1S20F484I6N's 18,460 logic elements combined with dedicated multiplier-based DSP blocks make it well-suited for high-throughput FIR filters, FFT engines, and baseband processing. Each DSP block accelerates 9-bit x 9-bit multiplies, and the TriMatrix embedded RAM (1.67 Mbits total) holds coefficient banks and ping-pong data buffers for streaming pipelines. In a typical 256-tap FIR running at 200 MHz, the device consumes roughly 30-40% of its DSP resources with headroom for cascaded stages, while the 484-FBGA package accommodates wide parallel buses for I/Q sample streams and offers generous ground balls for low-noise power delivery. Compared with a DSP processor, this FPGA delivers 10x-100x throughput per watt for fixed-coefficient filters.
Được đề xuất
ASIC Prototyping and Emulation
With 18,460 LEs, 1.67 Mbits of distributed RAM, and 361 user I/Os, the EP1S20F484I6N served as a popular mid-density ASIC prototyping platform in the early 2000s. Engineers partition ASIC RTL across multiple Stratix devices using boundary-scan chains, leveraging the 484-FBGA package's high I/O count to connect sibling FPGAs in a multi-FPGA emulator. The 1.5 V core and 0.13-micron process yield predictable timing correlation with the target ASIC library when back-annotated SDFs are applied. Industrial temperature grade (-40C to +85C) allows prototyping of automotive and ruggedized designs. Modern migrations often target Stratix IV EP4SGX230 or Stratix 10 for larger ASICs.
Được đề xuất
Communications Infrastructure (SONET/SDH, Protocol Bridging)
The EP1S20F484I6N was deployed in telecom line cards for SONET/SDH framer functions, HDLC/PPP encapsulation, and protocol bridging between TDM and packet networks. Its 6 PLLs support multiple clock domains (line rate, system, payload), while LVDS I/O enables source-synchronous links to network processors and SERDES framer ICs at speeds up to 840 Mbps per LVDS pair. The 361 I/O accommodate 32-bit data buses plus extensive framing and timing overhead. Industrial temperature rating suits outdoor cabinet deployments. Power estimation with Quartus PowerPlay is essential because the 1.5 V core can draw several amps at full utilization.
Được đề xuất
Industrial Imaging and Machine-Vision Pre-Processing
Industrial cameras and inspection systems leveraged the EP1S20F484I6N for real-time image pre-processing: Bayer demosaicing, color-space conversion, Sobel edge detection, and histogram equalization. The TriMatrix RAM acts as line buffers for multi-tap pipelined kernels, and the 361 I/Os connect directly to Camera Link or LVDS-based image sensors without external bridge chips. Industrial temperature grade (-40C to +85C) suits factory-floor deployments, and the 484-FBGA's low-inductance power/ground balls reduce switching noise that would otherwise degrade ADC SNR on the analog front end. Throughput exceeds 200 MPixels/s at 100 MHz pixel clock with 3x3 convolution kernels.
Được đề xuất
PCI/PCI-X Add-In Card Controller
The EP1S20F484I6N's 361 I/Os and PCI-compliant I/O buffers make it suitable for PCI 32/64-bit and PCI-X add-in card designs where a custom bus-master controller or co-processor is needed. The device implements PCI target and master state machines in logic, exposes a 64-bit data bus plus arbitration/control signals, and supports 66 MHz PCI-X via its PLL-driven clock domain. The 484-FBGA package provides enough I/O for PCI signals plus local SRAM, Flash, and a companion ASIC. With Quartus II, designers can instantiate PCI MegaCore functions to accelerate verification.
Được đề xuất
Legacy Industrial Control and Test Equipment
The EP1S20F484I6N remains in service as a control and timing FPGA inside long-lifecycle industrial test equipment, ATE (automatic test equipment) platforms, and avionics ground stations where re-certification costs prohibit redesign. Its 1.5 V core, 6 PLLs, and 18,460 LEs provide ample logic for multi-axis motion controllers, custom timing generators, and protocol analyzers. The 484-FBGA package is mechanically robust and supports industrial temperature. Sustainment requires sourcing through obsolete-component distributors like Heisener, Fusion Worldwide, and ICComponents, often with uprated pricing and longer quotations.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1S20F484I6N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1S20F484C7N | EP1S20F484C6N | EP1S20F484C5N | EP1S20F484C7 | EP1S10F484I6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA FineLine | 484-FBGA FineLine - same | 484-FBGA FineLine - same | 484-FBGA FineLine - same | 484-FBGA FineLine - same | 484-FBGA FineLine - same |
| Logic Elements | 18,460 | 18,460 (same) | 18,460 (same) | 18,460 (same) | 18,460 (same) | 10,570 (-43%) |
| Total RAM Bits | 1,669,248 | 1,669,248 (same) | 1,669,248 (same) | 1,669,248 (same) | 1,669,248 (same) | 920,448 (-45%) |
| Operating Temperature | -40C to +85C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +85C (Industrial) |
| Speed Grade | -6 | -7 (faster) | -6 (same) | -5 (slower) | -7 (faster) | -6 (same) |
| Core Voltage | 1.5 V | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) |
| User I/O Count | 361 | 361 (same) | 361 (same) | 361 (same) | 361 (same) | 335 (-7%) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Bảo phân biệt quan trọng
- Industrial temperature range coverage (vsEP1S20F484C7N)
- Mid-range speed grade balance (vsEP1S20F484C5N)
- Higher density than Stratix EP1S10 (vsEP1S10F484I6N)
Ghi chú thiết kế
The EP1S20F484I6N requires a 1.5 V core supply (VCCINT) capable of delivering up to 3-5 A at full utilization, plus multiple VCCIO rails (1.5 V, 1.8 V, 2.5 V, 3.3 V typical) for each I/O bank. Use a low-impedance power distribution network with decoupling capacitors placed within 100 mils of every power pin, and isolate analog and digital grounds with a single-point connection. The Quartus II PowerPlay tool provides pre-layout power estimates that should drive your regulator selection and thermal budgeting.
The 484-FBGA FineLine BGA has a 1.0 mm ball pitch and requires 4-6 layer PCB stack-up with microvias or via-in-pad construction for inner-row escape. Fanout follows a dog-bone or staggered-via pattern; signal layers must maintain 50 ohm single-ended and 100 ohm differential impedance for LVDS. Reference the Altera AN 114: Stratix Device Package Information and AN 315: BGA PCB Design Guidelines for detailed stack-up and routing recommendations. Keep all BGA balls connected to planes or traces - no floating or unused balls.
A frequent mistake is configuring the Stratix with an unsupported configuration mode or missing the nCONFIG pull-up resistor. The nCONFIG, nSTATUS, and CONF_DONE signals must be pulled high to VCCIO of the configuration bank through 10 kohm resistors, and a configuration device (EPCS4, EPCS16, or EPC16) or download cable must be present at power-up. Verify JTAG chain integrity with the Quartus programmer before attempting SRAM configuration. Designers also frequently overlook MSL 3 moisture sensitivity - the FBGA package must be baked before reflow if exposure exceeds the floor-life limit.
Differential pair routing for LVDS must maintain length matching within 20 mils and keep 100 ohm differential impedance with no more than two vias per pair. Use ground-copex stripline or microstrip with reference planes unbroken beneath the entire pair. For source-synchronous buses (e.g., DDR, Camera Link), match clock-to-data skew at the FPGA pins and apply Quartus II's delay-chain tuning to align strobe capture windows. Keep high-speed traces away from I/O bank power inductors and switching regulators by at least 200 mils.
Thông tin tuân thủ
Lead-free and RoHS-compliant per Intel/Altera product page. Not AEC-Q100 qualified (FPGAs are typically not auto-qualified at the device level). Halogen-free status not stated on the distributor listings reviewed.
