MPC859PVR133A - 133MHz PowerQUICC MPC8xx MPU | NXP | Networking
MPN: MPC859PVR133A ✗ اختتامِ زندگیMPC859PVR133A جائزہ
کے لیے ڈراپ اِن متبادل MPC859PVR133A — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں MPC859PVR133A (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Operating Temperature, Core Architecture, Package, Process Technology, Series.
MPC859PZP133A
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →MPC859TVR133A
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →MPC855TVR66D4
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →MPC859PVR133A-R5
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
MPC859PVR133A-T
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
MPC859PVR133A زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC MPC8xx |
| Core Architecture | Power Architecture, 32-bit RISC |
| Core Count | 1 |
| Core Speed | 133 MHz |
| سپلائی وولٹیج | 3.3 V |
| Process Technology | 0.18 µm CMOS |
| پیکیج | 357-ball PBGA (25 x 25 mm) |
| آپریٹنگ درجہ حرارت | 0 °C to +95 °C (Commercial) |
| Cache (I/D) | 4 Kbyte / 4 Kbyte |
| MMU | Yes (hardware memory management unit) |
| Communications Processor Module (CPM) | Integrated (4 SCC, 2 SMC, SPI, I²C) |
| Fast Ethernet Controllers | 3 |
| UTOPIA / PQM Interfaces | 2 |
| PCI Interface | Yes |
| ماؤنٹنگ ٹائپ | Surface Mount (BGA) |
MPC859PVR133A 357-ball pbga (25 x 25 mm) پن کنفیگریشن گائیڈ
MPC859PVR133A (357-ball pbga (25 x 25 mm) پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں MPC859PVR133A.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
MPC859PVR133A کے لیے موزوں ہے 6 ایپلیکیشنs: WAN / LAN Edge Router, DSLAM Line Card, Industrial Serial-to-Ethernet Gateway, ISDN Router / TA, T1 / E1 Multiplexer, Multi-Service Access Platform (MSAP).
WAN / LAN Edge Router
The MPC859PVR133A's integrated Communications Processor Module (CPM) with four SCC channels makes it a fit for low-to-mid-range WAN/LAN edge routers. Its 133 MHz Power Architecture core handles routing-table maintenance while the CPM offloads PPP, HDLC, and Ethernet framing in hardware, eliminating a companion ASIC. Three on-chip Fast Ethernet controllers provide switching-fabric or LAN-side connectivity without external MACs. Designers typically pair the part with a DDR memory controller and a small PHY; the 3.3 V single supply simplifies the power tree. Trade-off: NRND status means new designs should evaluate NXP LS1021A, but the part remains in service for legacy router repairs.
تجویز کردہ
DSLAM Line Card
In DSLAM line cards the MPC859PVR133A is commonly deployed as the per-port control processor: the integrated UTOPIA/PQM interface (two ports) connects directly to a multi-channel xDSL framer, while the SCC/SMC channels drive management and T1/E1 backhaul. The 32-bit PowerPC core runs the line-card OS and PPPoE/PPPoA termination, while hardware ECC-protected SDRAM interface maintains link-state data. The 357-PBGA 25×25 mm footprint allows 24+ ports on a single line card. Power dissipation at 3.3 V × 133 MHz sits around 2-3 W, manageable with a small heatsink.
تجویز کردہ
Industrial Serial-to-Ethernet Gateway
The MPC859PVR133A combines Ethernet MACs with multiple SCC channels, making it well matched to industrial gateways that bridge RS-232/RS-485 to Ethernet. The CPM can be configured to run Modbus RTU on one SCC while a Fast Ethernet MAC serves 10/100 Mbps traffic; the on-chip MMU enables RTOS-based protocol stacks. The 0 °C to +95 °C commercial-temperature grade suits indoor control cabinets; outdoor deployments require the industrial 'I' suffix variant. Hardware flow control, DMA-driven SCC buffering, and hardware CRC relieve the CPU of byte-level work.
تجویز کردہ
ISDN Router / TA
For ISDN terminal adapters and small-office routers, the MPC859PVR133A's hardware SCC channels implement HDLC framing for the ISDN BRI/U interface directly in silicon. The integrated PCI bus lets the designer pair it with a low-cost ISDN framer or wireless WAN modem. The 4+4 Kbyte cache and MMU accelerate encryption for VPN tunnels; the 0.18 µm CMOS process delivers low standby power suitable for always-on SOHO equipment. Replacement designs should look at integrated PowerQUICC II successors with reduced BOM.
تجویز کردہ
T1 / E1 Multiplexer
T1/E1 multiplexer designs use the MPC859PVR133A as the central cross-connect: two SCC channels can run HDLC-framed T1/E1 lines simultaneously while the remaining SCC channels aggregate Ethernet or serial control traffic. The CPM's BDMA channels move payload data between TDM ports and memory without CPU intervention, sustaining full E1 (2.048 Mbps) framing on all channels concurrently. Hardware clock recovery and per-channel DMA prioritization reduce jitter. A 357-BGA multilayer board with controlled-impedance traces is required.
تجویز کردہ
Multi-Service Access Platform (MSAP)
In MSAP / next-generation DLC equipment the MPC859PVR133A acts as the central element manager: it terminates Ethernet uplink traffic from multiple subtended DSL line cards over PCI, while a UTOPIA interface aggregates ATM cells from the access side. The integrated MMU and 4+4 Kbyte cache keep routing tables in fast memory; the CPM's RISC engine executes PPP and ATM AAL2 protocols in parallel to the Power Architecture core. Three Fast Ethernet MACs support redundant uplinks. Trade-off: for new MSAP builds, NXP QorIQ P1022 provides higher integration.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا MPC859PVR133A — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | MPC859PZP133A | MPC859TVR133A | MPC855TVR66D4 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-BGA (25x25 mm) | 357-BGA (25x25 mm) - same | 357-BGA (25x25 mm) - same | 357-BGA (25x25 mm) - same |
| Core Architecture | Power Architecture, 32-bit | Power Architecture, 32-bit | Power Architecture, 32-bit | Power Architecture, 32-bit |
| Core Frequency | 133 MHz | 133 MHz | 133 MHz | 66 MHz (-50%) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Fast Ethernet Controllers | 3 | 3 | Different count - verify | 2 |
| Process Technology | 0.18 µm CMOS | 0.18 µm CMOS | 0.18 µm CMOS | 0.25 µm CMOS |
| Operating Temperature | 0 °C to +95 °C | 0 °C to +95 °C | 0 °C to +95 °C | 0 °C to +95 °C |
اہم امتیازی خصوصیات
- Integrated 4-SCC + 2-SMC + SPI + I²C communications engine on die (بمقابلہMPC855TVR66D4)
- Three on-chip Fast Ethernet MACs (بمقابلہMPC855TVR66D4)
- 0.18 µm CMOS process for lower active power vs 0.25 µm predecessor (بمقابلہMPC855TVR66D4)
- Integrated PCI interface (بمقابلہMPC850 family without PCI)
ڈیزائن نوٹس
The 357-BGA at 25 × 25 mm has a ball pitch typically under 1.0 mm; breakout routing requires a multilayer PCB (8 or more layers recommended) with microvia or laser-drilled blind-via technology. Place at least one 0.1 µF X7R decoupling capacitor within 50 mils of every supply ball pair, and a bulk 10 µF tantalum or polymer capacitor near the package's supply ring.
Estimated: at 3.3 V supply, 133 MHz core, and typical 1.5-2 W active power draw, the 357-BGA on a 4-layer board with moderate copper pour holds junction rise under 30 °C above ambient. If the design runs the CPM at full utilization with all four SCCs and three Ethernet MACs active simultaneously, power may climb to 2.5-3 W; add a copper spreader or attach a small stamped heatsink to the lid.
Do not assume the MPC859PVR133A and MPC859TVR133A (or MPC859PZP133A) are interchangeable - the part-number suffix encodes both feature-set and revision differences. The Mouser listing flags the standard PVR133A as 'NO-PB' (non-RoHS leaded finish); if your build requires RoHS, order the explicit Pb-Free suffix variant and verify against the manufacturer's material declaration.
Route the SDRAM interface (address/command in one group, data in a matched-length group) to keep skew under 50 ps. Place the 50 MHz system clock oscillator within 200 mils of the CLK pin with a continuous ground reference plane below; avoid routing the clock trace over any split-plane gaps to prevent jitter and false edges on Reset Configuration.
تعمیل کی معلومات
Mouser listing classifies the standard MPC859PVR133A as 'NO-PB' (non-RoHS leaded BGA finish). Order the Pb-Free suffix variant for RoHS-compliant builds. AEC-Q100 qualification not applicable for this commercial MPU.
