MPC859PVR133A - 133MHz PowerQUICC MPC8xx MPU | NXP | Networking
Référence : MPC859PVR133A ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $75.75 | $75,75 |
| 10 | $68.2 | $682,00 |
| 100 | $61.5 | $6 150,00 |
| 500 | $55.8 | $27 900,00 |
| 1 000 | $49.9 | $49 900,00 |
MPC859PVR133A Présentation
Alternatives de remplacement direct pour MPC859PVR133A — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC859PVR133A (même facteur de forme et même empreinte) — différant par Operating Temperature, Core Architecture, Package, Process Technology, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC859PZP133A
✅ Remplacement direct✓ En stock
$55.4 / unité
Voir la fiche technique →MPC859TVR133A
✅ Remplacement direct✓ En stock
$54.1 / unité
Voir la fiche technique →MPC855TVR66D4
✅ Remplacement direct✓ En stock
$55.4 / unité
Voir la fiche technique →MPC859PVR133A-R5
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC859PVR133A-T
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC859PVR133A Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC MPC8xx |
| Core Architecture | Power Architecture, 32-bit RISC |
| Core Count | 1 |
| Core Speed | 133 MHz |
| Tension d'alimentation | 3.3 V |
| Process Technology | 0.18 µm CMOS |
| Boîtier | 357-ball PBGA (25 x 25 mm) |
| Température de fonctionnement | 0 °C to +95 °C (Commercial) |
| Cache (I/D) | 4 Kbyte / 4 Kbyte |
| MMU | Yes (hardware memory management unit) |
| Communications Processor Module (CPM) | Integrated (4 SCC, 2 SMC, SPI, I²C) |
| Fast Ethernet Controllers | 3 |
| UTOPIA / PQM Interfaces | 2 |
| PCI Interface | Yes |
| Type de montage | Surface Mount (BGA) |
Guide de configuration des broches du MPC859PVR133A 357-ball pbga (25 x 25 mm)
Configuration des broches du MPC859PVR133A (boîtier 357-ball pbga (25 x 25 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC859PVR133A.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC859PVR133A convient pour 6 applications: WAN / LAN Edge Router, DSLAM Line Card, Industrial Serial-to-Ethernet Gateway, ISDN Router / TA, T1 / E1 Multiplexer, Multi-Service Access Platform (MSAP).
WAN / LAN Edge Router
The MPC859PVR133A's integrated Communications Processor Module (CPM) with four SCC channels makes it a fit for low-to-mid-range WAN/LAN edge routers. Its 133 MHz Power Architecture core handles routing-table maintenance while the CPM offloads PPP, HDLC, and Ethernet framing in hardware, eliminating a companion ASIC. Three on-chip Fast Ethernet controllers provide switching-fabric or LAN-side connectivity without external MACs. Designers typically pair the part with a DDR memory controller and a small PHY; the 3.3 V single supply simplifies the power tree. Trade-off: NRND status means new designs should evaluate NXP LS1021A, but the part remains in service for legacy router repairs.
Recommandé
DSLAM Line Card
In DSLAM line cards the MPC859PVR133A is commonly deployed as the per-port control processor: the integrated UTOPIA/PQM interface (two ports) connects directly to a multi-channel xDSL framer, while the SCC/SMC channels drive management and T1/E1 backhaul. The 32-bit PowerPC core runs the line-card OS and PPPoE/PPPoA termination, while hardware ECC-protected SDRAM interface maintains link-state data. The 357-PBGA 25×25 mm footprint allows 24+ ports on a single line card. Power dissipation at 3.3 V × 133 MHz sits around 2-3 W, manageable with a small heatsink.
Recommandé
Industrial Serial-to-Ethernet Gateway
The MPC859PVR133A combines Ethernet MACs with multiple SCC channels, making it well matched to industrial gateways that bridge RS-232/RS-485 to Ethernet. The CPM can be configured to run Modbus RTU on one SCC while a Fast Ethernet MAC serves 10/100 Mbps traffic; the on-chip MMU enables RTOS-based protocol stacks. The 0 °C to +95 °C commercial-temperature grade suits indoor control cabinets; outdoor deployments require the industrial 'I' suffix variant. Hardware flow control, DMA-driven SCC buffering, and hardware CRC relieve the CPU of byte-level work.
Recommandé
ISDN Router / TA
For ISDN terminal adapters and small-office routers, the MPC859PVR133A's hardware SCC channels implement HDLC framing for the ISDN BRI/U interface directly in silicon. The integrated PCI bus lets the designer pair it with a low-cost ISDN framer or wireless WAN modem. The 4+4 Kbyte cache and MMU accelerate encryption for VPN tunnels; the 0.18 µm CMOS process delivers low standby power suitable for always-on SOHO equipment. Replacement designs should look at integrated PowerQUICC II successors with reduced BOM.
Recommandé
T1 / E1 Multiplexer
T1/E1 multiplexer designs use the MPC859PVR133A as the central cross-connect: two SCC channels can run HDLC-framed T1/E1 lines simultaneously while the remaining SCC channels aggregate Ethernet or serial control traffic. The CPM's BDMA channels move payload data between TDM ports and memory without CPU intervention, sustaining full E1 (2.048 Mbps) framing on all channels concurrently. Hardware clock recovery and per-channel DMA prioritization reduce jitter. A 357-BGA multilayer board with controlled-impedance traces is required.
Recommandé
Multi-Service Access Platform (MSAP)
In MSAP / next-generation DLC equipment the MPC859PVR133A acts as the central element manager: it terminates Ethernet uplink traffic from multiple subtended DSL line cards over PCI, while a UTOPIA interface aggregates ATM cells from the access side. The integrated MMU and 4+4 Kbyte cache keep routing tables in fast memory; the CPM's RISC engine executes PPP and ATM AAL2 protocols in parallel to the Power Architecture core. Three Fast Ethernet MACs support redundant uplinks. Trade-off: for new MSAP builds, NXP QorIQ P1022 provides higher integration.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC859PVR133A — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC859PZP133A | MPC859TVR133A | MPC855TVR66D4 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-BGA (25x25 mm) | 357-BGA (25x25 mm) - same | 357-BGA (25x25 mm) - same | 357-BGA (25x25 mm) - same |
| Core Architecture | Power Architecture, 32-bit | Power Architecture, 32-bit | Power Architecture, 32-bit | Power Architecture, 32-bit |
| Core Frequency | 133 MHz | 133 MHz | 133 MHz | 66 MHz (-50%) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Fast Ethernet Controllers | 3 | 3 | Different count - verify | 2 |
| Process Technology | 0.18 µm CMOS | 0.18 µm CMOS | 0.18 µm CMOS | 0.25 µm CMOS |
| Operating Temperature | 0 °C to +95 °C | 0 °C to +95 °C | 0 °C to +95 °C | 0 °C to +95 °C |
Principaux différenciateurs
- Integrated 4-SCC + 2-SMC + SPI + I²C communications engine on die (vs MPC855TVR66D4)
- Three on-chip Fast Ethernet MACs (vs MPC855TVR66D4)
- 0.18 µm CMOS process for lower active power vs 0.25 µm predecessor (vs MPC855TVR66D4)
- Integrated PCI interface (vs MPC850 family without PCI)
Notes de conception
The 357-BGA at 25 × 25 mm has a ball pitch typically under 1.0 mm; breakout routing requires a multilayer PCB (8 or more layers recommended) with microvia or laser-drilled blind-via technology. Place at least one 0.1 µF X7R decoupling capacitor within 50 mils of every supply ball pair, and a bulk 10 µF tantalum or polymer capacitor near the package's supply ring.
Estimated: at 3.3 V supply, 133 MHz core, and typical 1.5-2 W active power draw, the 357-BGA on a 4-layer board with moderate copper pour holds junction rise under 30 °C above ambient. If the design runs the CPM at full utilization with all four SCCs and three Ethernet MACs active simultaneously, power may climb to 2.5-3 W; add a copper spreader or attach a small stamped heatsink to the lid.
Do not assume the MPC859PVR133A and MPC859TVR133A (or MPC859PZP133A) are interchangeable - the part-number suffix encodes both feature-set and revision differences. The Mouser listing flags the standard PVR133A as 'NO-PB' (non-RoHS leaded finish); if your build requires RoHS, order the explicit Pb-Free suffix variant and verify against the manufacturer's material declaration.
Route the SDRAM interface (address/command in one group, data in a matched-length group) to keep skew under 50 ps. Place the 50 MHz system clock oscillator within 200 mils of the CLK pin with a continuous ground reference plane below; avoid routing the clock trace over any split-plane gaps to prevent jitter and false edges on Reset Configuration.
Informations de conformité
Mouser listing classifies the standard MPC859PVR133A as 'NO-PB' (non-RoHS leaded BGA finish). Order the Pb-Free suffix variant for RoHS-compliant builds. AEC-Q100 qualification not applicable for this commercial MPU.
