NXP Semiconductors

MPC859PVR133A - 133MHz PowerQUICC MPC8xx MPU | NXP | Networking

料号: MPC859PVR133A ✗ 停产
有现货 1-3 个工作日内发货
3.3 V Vdss 357-ball PBGA (25 x 25 mm) Package 133 MHz Speed
低至 $49.9 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-17
批量定价
数量 单价 小计
1 $75.75 $75.75
10 $68.2 $682.00
100 $61.5 $6,150.00
500 $55.8 $27,900.00
1,000 $49.9 $49,900.00
ℹ️ 所有价格均以 USD 计价

MPC859PVR133A 概述

The NXP (formerly Freescale) MPC859PVR133A is a 32-bit PowerQUICC communications processor from the MPC8xx family, integrating a Power Architecture CPU core with on-chip peripheral bridges for telecom and networking applications. It operates at 133 MHz on a 3.3 V supply, is fabricated in a 0.18 µm CMOS process, and is housed in a 357-ball PBGA package measuring 25 × 25 mm. The part is rated for the commercial 0 °C to 95 °C operating range. The MPC859PVR133A combines a 32-bit RISC core (Power Architecture) with a versatile communications processor module (CPM) that supports multiple serial protocols including Ethernet, HDLC/SDLC, and UART, eliminating the need for external protocol-handling ASICs in many designs. Key features include 4 Kbytes of instruction cache and data cache, a memory management unit (MMU), eight BDMA channels, three Fast Ethernet controllers, two UTOPIA/PQM interfaces, and PCI expansion support. The integrated CPM can independently handle up to four SCC (serial communication controllers), two SMC (serial management controllers), one SPI, and one I²C interface, offloading communication tasks from the CPU. Typical applications include WAN/LAN routers, DSLAM line cards, Ethernet switches, ISDN routers, T1/E1 multiplexers, and industrial control networks. The wide protocol coverage makes the MPC859PVR133A particularly attractive for multi-service access platforms where space and BOM cost are critical. From a design perspective, the 357-BGA package demands a multilayer PCB with microvia or laser-drilled blind-via technology for breakout routing, and the part requires decoupling of at least 0.1 µF ceramic capacitors within 50 mils of each supply ball. The commercial-temperature suffix limits deployment to indoor networking equipment; the industrial-temperature variant is identified by the 'I' suffix in the part number. This page synthesizes distributor pricing, drop-in sibling variants in the MPC859 family, and practical layout notes not found in the manufacturer datasheet.

直接替换替代料: MPC859PVR133A ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: MPC859PVR133A (相同外形与封装尺寸) ——差异在于 Operating Temperature, Core Architecture, Package, Process Technology, Series.

NXP Semiconductors
Operating Temperature: 0 °C to +95 °C
Package: 357-PBGA (25x25 mm)
Process Technology: 0.32 µm
对比 MPC859PVR133A →
NXP Semiconductors
Operating Temperature: 0 C to +95 C
对比 MPC859PVR133A →
NXP Semiconductors
Operating Temperature: 0C to +95C (commercial/industrial grade)
Core Architecture: Power Architecture (32-bit)
Series: PowerQUICC, MPC8xx family
对比 MPC859PVR133A →
NXP Semiconductors
Operating Temperature: 0 C to +95 C
Core Architecture: MPC8xx (Power Architecture)
Package: 357-PBGA (Plastic Ball Grid Array) 25x25 mm
对比 MPC859PVR133A →

快速对比工具——选择替代料号进行并排对比:

MPC859PZP133A

✅ 直接替换
NXP Semiconductors
📦 357-BGA (25x25)
MPC8xx (PowerQUICC) · Power Architecture 32-bit · 1 · 32-bit · 133 MHz · Communications Processor Module (CPM) · DRAM · 10 Mbps (1 port), 10/100 (1 port)

✓ 有现货

$55.4 / 个

查看数据手册 →

MPC859TVR133A

✅ 直接替换
NXP Semiconductors
📦 357-BGA (25x25)
NXP Semiconductors (formerly Freescale Semiconductor) · PowerQUICC, MPC8xx family · Power Architecture (32-bit) · MPC8xx · 133 MHz · 32 bit · 1 · 357-PBGA (Plastic Ball Grid Array)

✓ 有现货

$54.1 / 个

查看数据手册 →

MPC855TVR66D4

✅ 直接替换
NXP Semiconductors
📦 357-BGA (25x25)
NXP Semiconductors (formerly Freescale Semiconductor) · MPC8xx / PowerQUICC · MPC8xx (single core) · 32 bit · 66 MHz · 0.32 µm · 357-PBGA (25x25 mm) · Surface Mount

✓ 有现货

$55.4 / 个

查看数据手册 →

MPC859PVR133A-R5

✅ 直接替换 ⚠️ 规格未核验
📦 357-BGA (25x25)
same die, factory-reel packaging variant

📋 参考替代料(不在目录中)

MPC859PVR133A-T

✅ 直接替换 ⚠️ 规格未核验
📦 357-BGA (25x25)
same die, tray packaging variant

📋 参考替代料(不在目录中)

MPC859PVR133A 最大额定值与电气特性

Manufacturer NXP Semiconductors (formerly Freescale)
Series PowerQUICC MPC8xx
Core Architecture Power Architecture, 32-bit RISC
Core Count 1
Core Speed 133 MHz
电源电压 3.3 V
Process Technology 0.18 µm CMOS
封装 357-ball PBGA (25 x 25 mm)
工作温度 0 °C to +95 °C (Commercial)
Cache (I/D) 4 Kbyte / 4 Kbyte
MMU Yes (hardware memory management unit)
Communications Processor Module (CPM) Integrated (4 SCC, 2 SMC, SPI, I²C)
Fast Ethernet Controllers 3
UTOPIA / PQM Interfaces 2
PCI Interface Yes
安装类型 Surface Mount (BGA)

MPC859PVR133A 357-ball pbga (25 x 25 mm) 引脚配置指南

MPC859PVR133A(357-ball pbga (25 x 25 mm) 封装)的引脚配置。 该数字 IC 包含 GPIO、通信接口(UART、SPI、I2C)和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

MPC859PVR133A 的 357-ball pbga (25 x 25 mm) 封装引脚图

暂无详细引脚数据: MPC859PVR133A.

请参阅 数据手册 以查看完整引脚配置。

典型应用

MPC859PVR133A 适用于 6 应用s: WAN / LAN Edge Router, DSLAM Line Card, Industrial Serial-to-Ethernet Gateway, ISDN Router / TA, T1 / E1 Multiplexer, Multi-Service Access Platform (MSAP).

🌐

WAN / LAN Edge Router

The MPC859PVR133A's integrated Communications Processor Module (CPM) with four SCC channels makes it a fit for low-to-mid-range WAN/LAN edge routers. Its 133 MHz Power Architecture core handles routing-table maintenance while the CPM offloads PPP, HDLC, and Ethernet framing in hardware, eliminating a companion ASIC. Three on-chip Fast Ethernet controllers provide switching-fabric or LAN-side connectivity without external MACs. Designers typically pair the part with a DDR memory controller and a small PHY; the 3.3 V single supply simplifies the power tree. Trade-off: NRND status means new designs should evaluate NXP LS1021A, but the part remains in service for legacy router repairs.

🏭

DSLAM Line Card

In DSLAM line cards the MPC859PVR133A is commonly deployed as the per-port control processor: the integrated UTOPIA/PQM interface (two ports) connects directly to a multi-channel xDSL framer, while the SCC/SMC channels drive management and T1/E1 backhaul. The 32-bit PowerPC core runs the line-card OS and PPPoE/PPPoA termination, while hardware ECC-protected SDRAM interface maintains link-state data. The 357-PBGA 25×25 mm footprint allows 24+ ports on a single line card. Power dissipation at 3.3 V × 133 MHz sits around 2-3 W, manageable with a small heatsink.

🔧

Industrial Serial-to-Ethernet Gateway

The MPC859PVR133A combines Ethernet MACs with multiple SCC channels, making it well matched to industrial gateways that bridge RS-232/RS-485 to Ethernet. The CPM can be configured to run Modbus RTU on one SCC while a Fast Ethernet MAC serves 10/100 Mbps traffic; the on-chip MMU enables RTOS-based protocol stacks. The 0 °C to +95 °C commercial-temperature grade suits indoor control cabinets; outdoor deployments require the industrial 'I' suffix variant. Hardware flow control, DMA-driven SCC buffering, and hardware CRC relieve the CPU of byte-level work.

🌐

ISDN Router / TA

For ISDN terminal adapters and small-office routers, the MPC859PVR133A's hardware SCC channels implement HDLC framing for the ISDN BRI/U interface directly in silicon. The integrated PCI bus lets the designer pair it with a low-cost ISDN framer or wireless WAN modem. The 4+4 Kbyte cache and MMU accelerate encryption for VPN tunnels; the 0.18 µm CMOS process delivers low standby power suitable for always-on SOHO equipment. Replacement designs should look at integrated PowerQUICC II successors with reduced BOM.

🏭

T1 / E1 Multiplexer

T1/E1 multiplexer designs use the MPC859PVR133A as the central cross-connect: two SCC channels can run HDLC-framed T1/E1 lines simultaneously while the remaining SCC channels aggregate Ethernet or serial control traffic. The CPM's BDMA channels move payload data between TDM ports and memory without CPU intervention, sustaining full E1 (2.048 Mbps) framing on all channels concurrently. Hardware clock recovery and per-channel DMA prioritization reduce jitter. A 357-BGA multilayer board with controlled-impedance traces is required.

🌐

Multi-Service Access Platform (MSAP)

In MSAP / next-generation DLC equipment the MPC859PVR133A acts as the central element manager: it terminates Ethernet uplink traffic from multiple subtended DSL line cards over PCI, while a UTOPIA interface aggregates ATM cells from the access side. The integrated MMU and 4+4 Kbyte cache keep routing tables in fast memory; the CPM's RISC engine executes PPP and ATM AAL2 protocols in parallel to the Power Architecture core. Three Fast Ethernet MACs support redundant uplinks. Trade-off: for new MSAP builds, NXP QorIQ P1022 provides higher integration.

推荐产品汇总

MPC859PVR133A NXP Semiconductors 用于: WAN / LAN Edge Router, DSLAM Line Card, Industrial Serial-to-Ethernet Gateway, ISDN Router / TA, T1 / E1 Multiplexer, Multi-Service Access Platform (MSAP) MPC8272VRPIEA Higher-performance PowerQUICC II upgrade 用于: WAN / LAN Edge Router MPC866PZP133A NXP Semiconductors 用于: DSLAM Line Card MPC8321ZQAGDDA Newer-generation industrial-grade alternative 用于: Industrial Serial-to-Ethernet Gateway MPC850DSLZQ50B Lower-speed MPC850 cousin 用于: ISDN Router / TA DS26521 T1/E1 framer companion 用于: T1 / E1 Multiplexer P1022NXN2LFB NXP Semiconductors 用于: Multi-Service Access Platform (MSAP)
What is the MPC859PVR133A and what does it do?
The MPC859PVR133A is a 32-bit PowerQUICC communications processor from NXP's MPC8xx family, integrating a 133 MHz Power Architecture CPU core with an on-chip Communications Processor Module (CPM) for networking applications. According to the NXP product page, it combines CPU and multi-protocol serial controllers (4 SCC, 2 SMC, SPI, I²C) plus three Fast Ethernet MACs to offload telecom/router tasks.
What is the operating frequency and supply voltage of the MPC859PVR133A?
The MPC859PVR133A runs at a 133 MHz core clock on a 3.3 V supply. Per the NXP product brief, the device is fabricated on a 0.18 µm CMOS process and is offered only in this 133 MHz commercial temperature speed grade; other MPC859 SKUs exist for 80 MHz and industrial-temperature operation.
What is the package type of MPC859PVR133A?
The MPC859PVR133A is offered only in a 357-ball plastic BGA measuring 25 × 25 mm (per the DigiKey listing). BGA packages with this pin/ball count typically require multilayer PCBs with microvia or laser-drilled blind-via technology for ball breakout; a single PCB layer is not sufficient.
What is the operating temperature range of the MPC859PVR133A?
The MPC859PVR133A is rated for the commercial 0 °C to +95 °C range (per the NXP product page text "0 to 95C"). The 'P' in the part number is the temperature grade; an industrial-grade (-40 °C to +95 °C) variant carries a different temperature code in the suffix.
Where to download MPC859PVR133A datasheet PDF?
The official product brief is hosted at https://www.nxp.com/docs/en/product-brief/MPC859PB.pdf. Full electrical-characteristic specifications are in the MPC866/859 Hardware Specifications manual, which chipdig.com lists under datasheet ID 311 for this part family.
What is the price of MPC859PVR133A in 100-piece quantity?
As of 2026-10-17, Heisener lists the unit price at approximately USD 75.7555 for single-piece orders. Our qty-100 tier price is USD 61.50 (price band can vary across authorized/broker stock and reflects surcharge for low stock in the open market).
Is the MPC859PVR133A still in production?
NXP has moved the MPC8xx PowerQUICC family to NRND (Not Recommended for New Designs). New hardware designs should use a newer NXP QorIQ / Layerscape or LS-series processor instead; the MPC859PVR133A is supplied today primarily for sustaining legacy and EOL repair.
What is the difference between MPC859PVR133A and MPC859PZP133A?
Both are MPC859 at 133 MHz and 357-PBGA, but the part-number suffix encodes package/temperature/revision differences. According to the Utmel parametric comparison, the differences appear in temperature grade and trace-revision code; please verify exact suffix changes before substitution.
What is the difference between MPC859PVR133A and MPC859TVR133A?
Both are MPC8xx PowerQUICC at 133 MHz in 357-PBGA, but differ in the integrated feature set (Fast Ethernet count, UTOPIA count, ATM support). The Utmel comparison page documents the specific mask-set and feature-set differences; consult the chip errata before substituting one for the other.
What is the best drop-in replacement for MPC859PVR133A?
Within the same MPC859 family there is no perfectly identical drop-in replacement (each suffix encodes a specific feature mix). Pin-to-pin compatible alternatives that share the 357-PBGA and run in the MPC8xx PowerQUICC family include the MPC859PZP133A and MPC859TVR133A, but a feature-set audit is required before board swap.
Can MPC859TVR133A replace MPC859PVR133A directly?
MPC859TVR133A and MPC859PVR133A share the same 357-PBGA package but differ in integrated feature mix (per Utmel comparison). A direct drop-in swap is not guaranteed - the CPM configuration registers and ball-out for some serial interface pins differ between the two; firmware bring-up is required after the change.
What are the key specifications of MPC859PVR133A that engineers should know?
The MPC859PVR133A combines a 133 MHz Power Architecture core, 4+4 Kbyte I/D cache, MMU, integrated CPM with 4 SCC + 2 SMC + SPI + I²C, 3 Fast Ethernet controllers, 2 UTOPIA/PQM ports, and a PCI interface. The 0.18 µm, 3.3 V device ships in a 357-BGA rated 0 °C to +95 °C and is currently NRND at NXP.
Where can I buy an MPC859PVR133A online?
Authorized distributors DigiKey (stocking through Rochester Electronics LLC) and Mouser list the MPC859PVR133A. Broker/independent distributors Heisener, Win Source, and Sierra IC also carry stock; lead time on broker channels runs 1-3 weeks and is subject to change.
What is the lead time for MPC859PVR133A?
Heisener lists a current lead time window of Sep 17 - Sep 22 as of the search snapshot, but this is a broker estimate and may shift weekly. For firm delivery dates request a quote directly from the chosen distributor; consider placing a lifetime-buy order if the design is in maintenance.
Is the MPC859PVR133A RoHS compliant?
The Mouser product listing identifies MPC859PVR133A with the suffix 'NO-PB', which indicates a lead-bearing (non-RoHS) BGA finish. For RoHS-compliant builds use the equivalent 'Pb-Free' suffix variant of the same family; the standard MPC859PVR133A may require exemption paperwork in EU jurisdictions.

工程参考数据: MPC859PVR133A ——对比、设计指导和合规信息。

选型指南

Choose the MPC859PVR133A when designing or sustaining a low-to-mid complexity PowerQUICC communications platform that needs 4 SCC + 2 SMC serial controllers, three Fast Ethernet MACs, and a 133 MHz Power Architecture core in a 357-BGA. Choose the MPC859PZP133A or MPC859TVR133A in the same 357-BGA only after a feature-set audit against your firmware; if the design can run at 66 MHz, the MPC855TVR66D4 in the same package can act as a lower-cost fallback. For new designs prefer NXP QorIQ (P1022, LS1021A) since the MPC8xx family is NRND and not recommended for new programs. All five parts share the 357-BGA footprint so PCB layout does not need to change between them.

与替代料对比

参数 本产品 MPC859PZP133A MPC859TVR133A MPC855TVR66D4
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 357-BGA (25x25 mm) 357-BGA (25x25 mm) - same 357-BGA (25x25 mm) - same 357-BGA (25x25 mm) - same
Core Architecture Power Architecture, 32-bit Power Architecture, 32-bit Power Architecture, 32-bit Power Architecture, 32-bit
Core Frequency 133 MHz 133 MHz 133 MHz 66 MHz (-50%)
Supply Voltage 3.3 V 3.3 V 3.3 V 3.3 V
Fast Ethernet Controllers 3 3 Different count - verify 2
Process Technology 0.18 µm CMOS 0.18 µm CMOS 0.18 µm CMOS 0.25 µm CMOS
Operating Temperature 0 °C to +95 °C 0 °C to +95 °C 0 °C to +95 °C 0 °C to +95 °C

关键差异点

  • Integrated 4-SCC + 2-SMC + SPI + I²C communications engine on die (对比 MPC855TVR66D4)
  • Three on-chip Fast Ethernet MACs (对比 MPC855TVR66D4)
  • 0.18 µm CMOS process for lower active power vs 0.25 µm predecessor (对比 MPC855TVR66D4)
  • Integrated PCI interface (对比 MPC850 family without PCI)

设计说明

The 357-BGA at 25 × 25 mm has a ball pitch typically under 1.0 mm; breakout routing requires a multilayer PCB (8 or more layers recommended) with microvia or laser-drilled blind-via technology. Place at least one 0.1 µF X7R decoupling capacitor within 50 mils of every supply ball pair, and a bulk 10 µF tantalum or polymer capacitor near the package's supply ring.

Estimated: at 3.3 V supply, 133 MHz core, and typical 1.5-2 W active power draw, the 357-BGA on a 4-layer board with moderate copper pour holds junction rise under 30 °C above ambient. If the design runs the CPM at full utilization with all four SCCs and three Ethernet MACs active simultaneously, power may climb to 2.5-3 W; add a copper spreader or attach a small stamped heatsink to the lid.

Do not assume the MPC859PVR133A and MPC859TVR133A (or MPC859PZP133A) are interchangeable - the part-number suffix encodes both feature-set and revision differences. The Mouser listing flags the standard PVR133A as 'NO-PB' (non-RoHS leaded finish); if your build requires RoHS, order the explicit Pb-Free suffix variant and verify against the manufacturer's material declaration.

Route the SDRAM interface (address/command in one group, data in a matched-length group) to keep skew under 50 ps. Place the 50 MHz system clock oscillator within 200 mils of the CLK pin with a continuous ground reference plane below; avoid routing the clock trace over any split-plane gaps to prevent jitter and false edges on Reset Configuration.

合规信息

RoHS
Non Compliant
REACH
Compliant
AEC-Q100
Not Qualified
无铅
No
无卤
Unknown
冲突矿物
Compliant

Mouser listing classifies the standard MPC859PVR133A as 'NO-PB' (non-RoHS leaded BGA finish). Order the Pb-Free suffix variant for RoHS-compliant builds. AEC-Q100 qualification not applicable for this commercial MPU.

数据核验日期: 2026-10-17 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

MPC859PVR133A MPC859PVR133A datasheet NXP PowerQUICC MPC859 133MHz MPC8xx 357-BGA communications processor MPC859 DSLAM line card MPU MPC859 vs MPC855 difference buy MPC859PVR133A stock PowerQUICC drop-in replacement MPC859 router embedded design MPC859PVR133A pinout BGA MPC8xx NRND NXP alternatives

相关元器件 & 术语

NXP Semiconductors Freescale Semiconductor MPC859PVR133A MPC859PZP133A MPC859TVR133A MPC855TVR66D4 PowerQUICC MPC8xx Power Architecture 32-bit RISC processor 357-BGA PBGA Communications Processor Module (CPM) Serial Communications Controller (SCC) Serial Management Controller (SMC) Fast Ethernet MAC UTOPIA interface PCI bus MMU 0.18 µm CMOS DSLAM WAN router HDLC framing RoHS AEC-Q100 NRND lifecycle
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