10AS066H2F34E1HG - Arria 10 SX 660K SoC FPGA | Intel | 1152-FBGA
MPN: 10AS066H2F34E1HG ✓ Hoạt động10AS066H2F34E1HG Tóm tắt
What is an SoC FPGA? A System-on-Chip FPGA combines a hard processor subsystem (typically ARM Cortex-A cores) with programmable logic on the same silicon die. The hard CPU subsystem executes an operating system (Linux, VxWorks, RTOS) while the FPGA fabric implements custom accelerators, high-speed I/O protocols, and DSP pipelines. This integration reduces board area, latency between CPU and fabric, and BOM cost compared with a discrete CPU-plus-FPGA two-chip solution. SoC FPGAs sit within the broader taxonomy of: SoC FPGA -> FPGA -> programmable logic -> semiconductor device -> integrated circuit.
Key features include 492 user I/O pins, transceivers up to 17.4 Gbps, embedded hard memory controllers (DDR3/DDR4/LPDDR2), and 1.5 GHz dual-core ARM Cortex-A9 with NEON and floating-point unit. The 1152-FC-FBGA package provides ample signal escape for high-speed serial links and parallel memory interfaces while sustaining the 0.9 V core supply typical of 20 nm Arria 10 silicon. Designers also gain access to Intel Quartus Prime for synthesis, place-and-route, and HPS firmware development.
The Arria 10 SX architecture unifies the HPS-to-Fabric AXI bus with hardened memory controllers and PCIe Gen3 hard IP. The hard CPU cores offload RTOS or Linux tasks, while the FPGA fabric implements latency-critical DSP for radar, baseband, or video pipelines. This partitioning yields lower power than two-chip solutions because HPS-to-Fabric data movement stays on-chip.
Typical applications include 4K/8K video broadcast equipment, wireless baseband and backhaul, radar and electronic warfare signal processing, industrial machine vision, and medical imaging accelerators. Designers value the combination of a deterministic Linux-capable processor with parallel FPGA fabric for sensor fusion and protocol bridging.
When designing with this device, prioritize PCB stack-up and power integrity early. The 1152-FCBGA at 35x35 mm requires HDI PCB fabrication with microvia stack-ups. Decouple each transceiver and HPS power rail with bulk + ceramic capacitance per the Intel Arria 10 pin connection guidelines to meet jitter and power-sequencing requirements.
This page synthesizes distributor pricing from Heisener and Octopart, lists pin-compatible Arria 10 SX family variants from the XAIPART internal MPN list, and provides drop-in guidance not found in the bare manufacturer datasheet.
Bộ thay thế dễ dàng lắp đặt cho 10AS066H2F34E1HG — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với 10AS066H2F34E1HG (cùng hình factor và footprint) — khác nhau ở Package, Temperature Grade, Mounting Type, Family, Series.
10AS066H1F34E1HG
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →10AS066H1F34I1HG
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →10AS066H2F34E1SG
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
10AS066H1F34E2SG
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
10AS066H3F34E1HG
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
10AS066H2F34E1HG Tỷ lệ tối đa & tính chất điện
| Family | Arria 10 SX |
| Logic Elements | 660,000 |
| Process Technology | 20 nm |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| User I/O Count | 492 |
| Hộp | 1152-FBGA, FC (35x35 mm) |
| Core Voltage | 0.9 V |
| Transceiver Data Rate | Up to 17.4 Gbps |
| Memory Interfaces | DDR3, DDR4, LPDDR2 (hard controllers) |
| Kiểu lắp đặt | Surface Mount |
| Nhiệt độ hoạt động | -40C to +100C (Industrial) |
| Cấp MSL | 4 (per JEDEC J-STD-020) |
| Trạng thái RoHS | Compliant |
| Development Tool | Intel Quartus Prime |
Hướng dẫn cấu hình chân 10AS066H2F34E1HG 1152-fbga, fc (35x35 mm)
Cấu hình chân cho 10AS066H2F34E1HG (1152-fbga, fc (35x35 mm) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho 10AS066H2F34E1HG.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
10AS066H2F34E1HG phù hợp cho 6 Áp dụngs: 4K/8K Video Broadcast Processing, Wireless Baseband and Backhaul, Radar and Electronic Warfare DSP, Industrial Machine Vision, Medical Imaging Accelerators, Protocol Bridging and Aggregation.
4K/8K Video Broadcast Processing
The 10AS066H2F34E1HG fits 4K/8K broadcast pipelines because its 660K logic elements can host multi-channel video processing accelerators (scaling, deinterlacing, HDR tone mapping) while the 1.5 GHz dual Cortex-A9 HPS runs a real-time Linux stack for control plane and codec orchestration. The 17.4 Gbps transceivers natively carry SDI, DisplayPort, or 12G-SDI signals without external bridge chips, and 492 user I/O provide ample parallel RGB/YCbCr pixel buses plus timing reference GPIOs. Compared with a discrete CPU+FPGA design, the on-chip HPS-to-Fabric AXI bus cuts latency below 200 ns per frame for closed-loop color grading pipelines.
Được đề xuất
Wireless Baseband and Backhaul
The 10AS066H2F34E1HG suits wireless baseband and backhaul equipment where the dual 1.5 GHz Cortex-A9 HPS runs the PHY control stack and MAC scheduler, while the 660K FPGA fabric implements turbo/LDPC decoders, FFT/iFFT engines, and digital predistortion (DPD) look-up tables. The 17.4 Gbps transceivers handle CPRI or eCPRI links to remote radio heads at 9.8 Gbps line rates with margin. Hard DDR4 controllers feed multi-gigasample processing buffers, and 492 user I/O carry front-panel data, JTAG, and sync signals. Compared with pure DSP-based solutions, the SoC FPGA architecture reduces BOM by eliminating a separate network processor.
Được đề xuất
Radar and Electronic Warfare DSP
The 10AS066H2F34E1HG is well matched to radar and electronic-warfare digital signal processing because its 660K logic elements host hundreds of hardened-floating-point DSP blocks for pulse compression, MTI filtering, and beamforming. The 1.5 GHz Cortex-A9 HPS executes classification, tracking, and threat-priority logic under a hard-real-time Linux/RTOS scheduler. Transceivers at 17.4 Gbps carry digitized antenna streams directly into the FPGA, eliminating external deserializer ASICs. With 492 user I/O plus DDR4 hard controllers, the SoC FPGA can sustain sustained multi-GSPS processing for phased-array radar front-ends while keeping the bill of materials low.
Được đề xuất
Industrial Machine Vision
The 10AS066H2F34E1HG supports high-frame-rate machine vision systems because its 660K logic elements can implement parallel image pre-processing pipelines (debayer, gamma, defect detection) while the dual 1.5 GHz Cortex-A9 HPS runs inference and TCP/IP or EtherCAT communication. The 17.4 Gbps transceivers ingest CoaXPress, Camera Link, or 10GigE Vision streams with low protocol overhead. With 492 user I/O plus MIPI and LVDS hard IP, designers can attach multiple 4K sensors concurrently. The 0C-to-+100C E1 industrial temperature range suits factory-floor deployments.
Được đề xuất
Medical Imaging Accelerators
The 10AS066H2F34E1HG accelerates CT, MRI, and ultrasound image reconstruction by parallelizing back-projection and beamforming in 660K logic elements while the 1.5 GHz Cortex-A9 HPS manages DICOM transfer, patient metadata, and the GUI. Hard DDR4 controllers sustain multi-GB image buffers at line rate, and 492 user I/O provide connectivity to front-end ADCs and high-speed serial links to image acquisition boards. The integrated SoC FPGA architecture reduces patient-scanner bill-of-materials by combining CPU, FPGA, and memory controller on one die, with FDA-relevant traceability provided per medical device quality systems.
Được đề xuất
Protocol Bridging and Aggregation
The 10AS066H2F34E1HG acts as a flexible protocol bridge, mapping PCIe Gen3, 10GbE, SATA, and legacy industrial buses through the FPGA fabric while the 1.5 GHz Cortex-A9 HPS runs a Linux-based protocol stack for upper-layer services. The 17.4 Gbps transceivers handle multiple 10G links concurrently, and 492 user I/O accommodate parallel GPIO, I2C, SPI, and UART sidebands. Compared with ASIC bridges, the SoC FPGA approach lets designers re-target the bridge via firmware updates as protocols evolve, future-proofing industrial gateways and telecom edge nodes.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho 10AS066H2F34E1HG — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | 10AS066H1F34E1HG | 10AS066H1F34I1HG | 10AS066H2F34E1SG | 10AS066H3F34E1HG |
|---|---|---|---|---|---|
| Package | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 |
| Speed Grade | H2 | H1 (lower Fmax) | H1 (lower Fmax) | H2 (same) | H3 (highest Fmax) |
| Temperature Grade | E1 (0C to +100C) | E1 (0C to +100C) | I1 (-40C to +100C) | S-grade screening | E1 (0C to +100C) |
| User I/O | 492 | 492 | 492 | 492 | 492 |
| HPS Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Transceiver Rate | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps |
| Process | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Bảo phân biệt quan trọng
- Mid-tier speed grade with optimal balance of Fmax and power (vs10AS066H1F34E1HG)
- Fastest speed grade option for tight timing margins (vs10AS066H3F34E1HG)
- Industrial E1 vs I1 temperature coverage (vs10AS066H1F34I1HG)
Ghi chú thiết kế
The 1152-FCBGA at 35x35 mm requires an HDI PCB stack-up with laser-drilled microvias. Estimated: for a 1.0 mm BGA pitch, plan at least a 1+N+1 or 2+N+2 stack-up with 0.4 mm via pitch and 4-6 mil traces. Escape the inner-row balls through microvia-in-pad to keep breakout under 12 mm. Reference the Altera/Intel Arria 10 SX pin connection guidelines for recommended layer counts, decoupling, and via-in-pad plating. Do not attempt to route this package on a 4-layer standard FR-4 stack - signal integrity on 17.4 Gbps transceivers will fail.
Decouple every HPS, transceiver, fabric, and PLL rail with the capacitor mix specified in the Arria 10 pin connection guidelines. Estimated: expect peak currents above 30 A on the 0.9 V core rail at full utilization, so use a 12-layer PCB with multiple inner-plane power pours and stitching vias near BGA balls. Sequence the rails through the Intel power management IC (such as the EN63A0QI or compatible Intel/Altera sequencer) per the recommended ramp order: 1.0 V transceiver -> 0.9 V core -> 1.8 V I/O -> 3.3 V HPS. Failure to observe sequencing can cause latch-up.
At full fabric utilization with 17.4 Gbps transceivers active, the 10AS066H2F34E1HG can dissipate 15-20 W. Estimated: with the 1152-FCBGA package's typical theta_JA around 10 C/W on a JEDEC 4-layer test board (no heatsink), the junction temperature can approach +150 C at +100 C ambient. Attach a heat-spreader or low-profile heatsink with thermal interface material rated for at least 5 W/mK. Use the Arria 10 FPGA's on-die temperature diode with the Intel Ethernet temperature sensor for closed-loop thermal management in the Linux HPS.
Thông tin tuân thủ
RoHS compliant per Intel/Altera product page. AEC-Q100 not applicable - this is a logic device, not an automotive-grade IC. Conflict-minerals compliance per Intel corporate policy.