5CSEBA4U23C8SN - Cyclone V SE SoC FPGA, 40K LE, 672-UBGA | Intel
MPN: 5CSEBA4U23C8SN ✓ Hoạt động5CSEBA4U23C8SN Tóm tắt
A System-on-Chip (SoC) FPGA is a class of programmable logic device that combines a hard processor core (typically ARM Cortex-A or Cortex-M) with FPGA fabric on a single die, allowing deterministic hardware acceleration alongside software-driven control. Within the broader taxonomy, an SoC FPGA sits below an ASSP (Application-Specific Standard Product) and above a microcontroller in design flexibility, bridging CPU+DSP performance with FPGA gate-level parallelism. The hard processor subsystem (HPS) includes its own memory controllers, peripherals, and interconnect, separate from the FPGA fabric.
Key features of the 5CSEBA4U23C8SN include 40K logic elements, 2,240 Kbits of embedded SRAM, variable-precision DSP blocks, integrated PCIe Gen2 hard IP, and a wide range of multi-standard I/O supporting LVDS, LVTTL, and LVCMOS at 1.1V to 3.3V. The device is fabricated on TSMC's 28 nm low-power process, optimized for low static and dynamic power consumption.
The architecture integrates dual-purpose HPS I/Os and FPGA I/Os with flexible configuration through Altera/Intel Quartus Prime design software. The single-core ARM Cortex-A9 MPCore runs at up to 600 MHz, with 32 KB L1 instruction cache, 32 KB L1 data cache, 512 KB L2 cache, and NEON media processing engine. The FPGA fabric contains 4-input ALMs, M20K memory blocks, and DSP blocks supporting 18x19 multipliers.
Typical applications include industrial machine vision, motor control, protocol bridging, video surveillance, automotive driver assistance systems, and embedded vision. The 0-85C commercial temperature grade and 672-UBGA package make it well-suited for space-constrained PCB designs requiring both processing and programmable logic.
When designing with this SoC FPGA, ensure adequate decoupling for the HPS and FPGA core voltage rails. The HPS and FPGA can boot independently, enabling early FPGA configuration from HPS or HPS boot from FPGA-attached flash. Quartus Prime 18.1 or later is recommended for full HPS toolchain support.
This page synthesizes distributor pricing, drop-in alternatives within the same 672-UBGA footprint, and practical design notes not found in the manufacturer datasheet alone.
Bộ thay thế dễ dàng lắp đặt cho 5CSEBA4U23C8SN — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với 5CSEBA4U23C8SN (cùng hình factor và footprint) — khác nhau ở Package, Logic Elements, DSP Blocks, HPS Peripherals, HPS Maximum Frequency.
5CSEBA4U23C8N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →5CSEBA4U23C7SN
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →5CSEBA4U23I7SN
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →5CSEBA4U23C6N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →5CSEBA4U23A7N
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Xem tài liệu →5CSEBA4U23C8SN Tỷ lệ tối đa & tính chất điện
| Series | Cyclone V SE |
| Core Type | Single ARM Cortex-A9 MPCore with CoreSight |
| Logic Elements | 40K |
| Operating Frequency (HPS) | 600 MHz |
| Core Voltage | 1.1 V |
| Embedded Memory (FPGA) | 2,240 Kbits |
| On-chip RAM (HPS) | 64 KB |
| Kích thước bộ nhớ | 2931 KB (per datasheets.com summary) |
| DSP Blocks | Variable-precision, 18x19 multipliers |
| Hộp | 672-UBGA (23x23 mm) |
| Kiểu lắp đặt | Surface Mount |
| Nhiệt độ hoạt động | 0C to +85C (commercial) |
| Process Technology | TSMC 28 nm low-power |
| Trạng thái RoHS | Compliant |
| Cấp MSL | 3 |
Hướng dẫn cấu hình chân 5CSEBA4U23C8SN 672-ubga (23x23 mm)
Cấu hình chân cho 5CSEBA4U23C8SN (672-ubga (23x23 mm) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho 5CSEBA4U23C8SN.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
5CSEBA4U23C8SN phù hợp cho 6 Áp dụngs: Industrial Machine Vision, Motor Control and Drives, Automotive Driver Assistance (ADAS), Industrial IoT Gateway, Video Surveillance Encoder, Medical Imaging Equipment.
Industrial Machine Vision
The 5CSEBA4U23C8SN fits industrial machine vision because its single-core ARM Cortex-A9 at 600 MHz handles camera ISP and GigE Vision protocol while the 40K LE FPGA fabric accelerates image preprocessing pipelines (Sobel, threshold, morphology) in parallel. The variable-precision DSP blocks run 18x19 multipliers suitable for FFT-based defect detection, and 2,240 Kbits of embedded SRAM buffer full-HD frame lines at 60 fps. Industrial-grade I/O bank support (LVDS/LVCMOS 1.2-3.3V) interfaces directly to MIPI CSI-2 or LVDS image sensors. The HPS runs Linux with OpenCV, offloading hot-path pixel processing to FPGA fabric.
Được đề xuất
Motor Control and Drives
The 5CSEBA4U23C8SN integrates motor-control logic and a Cortex-A9 control loop on one die, eliminating separate MCU+FPGA partitions in servo drives. The HPS runs FOC (field-oriented control) at 20-50 kHz PWM rates, while the 40K LE fabric implements encoder interfaces (BiSS, EnDat 2.2, Tamagawa) and custom logic-level shifting. Variable-precision DSP blocks accelerate Park/Clarke transforms and SVPWM. The 672-UBGA U23 package exposes enough I/O banks for 3-phase PWM, sigma-delta ADC interfaces, and Ethernet/IP or EtherCAT MII pins.
Được đề xuất
Automotive Driver Assistance (ADAS)
The 5CSEBA4U23C8SN suits ADAS sensor-fusion ECUs by combining a Cortex-A9 host processor with deterministic FPGA accelerators for radar/lidar preprocessing. The 40K LE fabric implements custom DMA, sensor timing, and CAN-FD gating, while the HPS runs AUTOSAR and object-classification algorithms. Note that 5CSEBA4U23C8SN is commercial-grade (0-85C); for AEC-Q100 qualified automotive deployments, the equivalent A7 speed-grade variant 5CSEBA4U23A7N is preferred (same U23 footprint, automotive qualification tier).
Được đề xuất
Industrial IoT Gateway
The 5CSEBA4U23C8SN consolidates protocol-conversion gateways by running Modbus/TCP, OPC-UA, PROFINET, and EtherCAT stacks on the Cortex-A9 HPS while FPGA logic accelerates deterministic packet timestamping, PTP hardware timestamping, and custom fieldbus protocol handling. The 2,240 Kbits embedded SRAM caches protocol buffers, and the wide FPGA I/O bank supports RS-485, RS-232, and isolated digital inputs at 24V industrial levels. 1 Gbit Ethernet MAC in the HPS enables edge-to-cloud connectivity.
Được đề xuất
Video Surveillance Encoder
The 5CSEBA4U23C8SN enables multi-channel H.264/H.265 video encoding by partitioning motion estimation, DCT/IDCT, and deblocking filters into the FPGA fabric, while the Cortex-A9 runs the encoder orchestration and stream management. The variable-precision DSP blocks accelerate motion-estimation ME (sum-of-absolute-differences) at 200+ MHz. Embedded M20K memory blocks buffer macroblock rows, and FPGA I/O banks interface directly to BT.656, BT.1120, or MIPI CSI-2 camera inputs.
Được đề xuất
Medical Imaging Equipment
The 5CSEBA4U23C8SN fits portable ultrasound or endoscopy image processors where the HPS runs the application UI, patient data, and DICOM stack while the FPGA fabric accelerates beamforming, FIR filtering, and envelope detection in the ultrasound pipeline. The 40K LE and 2240 Kbits embedded SRAM support 32-channel beamformer implementations. Industrial temp grade suits hospital environments; for IEC 60601 medical safety certification, pair with appropriate isolation. The 672-UBGA U23 footprint enables compact handheld form factors.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho 5CSEBA4U23C8SN — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | 5CSEBA4U23C8N | 5CSEBA4U23C7SN | 5CSEBA4U23I7SN | 5CSEBA4U23C6N |
|---|---|---|---|---|---|
| Package | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 40K | 40K | 40K | 40K | 40K |
| Speed Grade | 8 (C8) | 8 (C8) | 7 (C7) | 7 (I7) | 6 (C6) |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| HPS Cortex-A9 Cores | 1 | 1 | 1 | 1 | 1 |
| Embedded Memory | 2,240 Kbits | 2,240 Kbits | 2,240 Kbits | 2,240 Kbits | 2,240 Kbits |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes |
Bảo phân biệt quan trọng
- Pin-and-function compatible with full U23 672-UBGA Cyclone V SE family (vs5CSEBA4U23C7SN)
- Industrial-temp variant available for harsh environments (vs5CSEBA4U23I7SN)
- Single-core HPS vs dual-core options - cost optimization (vs5CSEBA5U23C8SN (dual-core variant))
Ghi chú thiết kế
The 5CSEBA4U23C8SN requires multiple supply rails: VCC (1.1V core), VCCPLL (1.1V PLL analog), VCCIO for HPS and FPGA I/O banks (1.2V-3.3V depending on I/O standard), VCCPD (2.5V/3.0V/3.3V pre-driver), and VCCRSTCLK (2.5V for HPS reset/clock). Decouple each rail with 0.1 uF ceramic and 10 uF bulk capacitors placed within 5 mm of the corresponding pins. Use a sequenced power supply (e.g., LTC3612 or Intel EN5339) to ensure VCC ramps before VCCIO/VCCPD to avoid latch-up. Estimated: at 600 MHz HPS with 40K LE at typical toggle rates, total power consumption is approximately 3-5W depending on utilization.
The 672-UBGA U23 package has 1.0 mm ball pitch. PCB layout requires microvia (HDI) stackup with at least 4-6 layers, blind/buried vias for inner-row BGA breakouts, and a 0.4-0.5 mm via-in-pad design with planar filling to escape the center balls. Use 50 ohm controlled impedance for high-speed HPS interfaces (DDR3, RGMII) and 90 ohm differential for LVDS channels. Ground plane directly under the BGA must be continuous to provide return path and thermal dissipation.
The 672-UBGA U23 package has theta-JA of approximately 12-15 C/W on a 4-layer JEDEC test board. At full HPS load (600 MHz) plus 50% FPGA utilization, the device can dissipate 3-5W, yielding 36-75 C junction temperature rise above ambient. For commercial-grade (0-85C) operation in enclosed housings, attach a heatsink or thermal pad to the top of the package, and ensure at least 4 thermal vias in the BGA center array to the inner ground plane.
Do not confuse 5CSEBA4U23C8SN (single-core HPS, 40K LE) with 5CSEMA4U23C8SN or 5CSEBA6U23C8SN variants - the SE suffix denotes the SoC tier with hard ARM core, the second digit (4 vs 6) indicates logic element count, and missing 'A' vs 'AE' indicates HPS core count. The 'SN' suffix means lead-free (Pb-free) while bare 'N' also indicates lead-free but with different MSL handling. The package letter U23 vs U19 vs U15 is critical - it identifies the BGA ball count and PCB footprint, and these are NOT pin-compatible.
Thông tin tuân thủ
RoHS compliant per Cyclone V Device Overview datasheet and Intel product page. SN suffix denotes Pb-free lead finish. Standard commercial variant is not AEC-Q100 qualified; choose 5CSEBA4U23A7N for automotive-grade applications.