ADC1613D080HN-C1 - Dual 16-Bit 80MSPS ADC w/ JESD204A | Renesas
MPN: ADC1613D080HN-C1 ✓ Hoạt độngADC1613D080HN-C1 Tóm tắt
An ADC (analog-to-digital converter) is a data-acquisition mixed-signal IC that samples a continuous analog waveform on each clock edge and quantises the instantaneous amplitude into a parallel or serial binary codeword; the dual-channel variant integrates two matched ADC cores clocked from a shared input, which is essential for I/Q demodulation, multi-antenna wireless receivers, and time-interleaved instrumentation. Pipeline ADCs like the ADC1613D080HN-C1 favour high sample rates and low per-channel power by distributing the conversion across many low-resolution stages, each driving a digital correction block.
Key features include dual 16-bit resolution, 80 MSPS maximum sample rate, a JESD204A serialiser that simplifies board routing by replacing wide LVDS buses with a low-pin-count high-speed serial link, integrated input buffers, and an exposed thermal pad that pulls heat directly from the die into the PCB copper pour. The 80 MSPS grade is typically the lowest power member of the family and is therefore favoured in compact multi-channel receivers.
The architecture uses a multi-stage switched-capacitor pipeline with proprietary error correction, an on-chip input termination network, and a JESD204A link layer that delivers deterministic latency and 8B/10B-encoded frames. This combination is engineered for cellular base-station observation receivers, multi-antenna test equipment, and phased-array radar digitisation where channel-to-channel matching and serialiser data integrity matter.
Typical applications include multi-carrier wireless base-station receiver cards, software-defined radio (SDR) front-ends, medical imaging ultrasound beamformers, and high-channel-count industrial data-acquisition backplanes. The dual channel pairing also suits direct-conversion I/Q sampling in zero-IF receivers.
When designing with this converter, allocate at least four PCB layers around the HVQFN exposed pad and stitch the thermal pad with a 4 x 4 grid of thermal vias to inner ground/plane layers; the JESD204A link also demands careful length matching of the CML serial pair and decoupling of the 1.9 V and 3.3 V supplies within 5 mm of the package.
This page synthesises distributor pricing, drop-in alternatives across the ADC1613D speed-grade family, and practical PCB layout guidance beyond the manufacturer datasheet summary.
Bộ thay thế dễ dàng lắp đặt cho ADC1613D080HN-C1 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với ADC1613D080HN-C1 (cùng hình factor và footprint) — khác nhau ở Package, Output Interface, Number of Channels, Operating Temperature, Resolution.
ADC1613D065HN-C1
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
ADC1613D105HN-C1
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →ADC1613D125HN-C1
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →ADC1613D080HN/C1:5
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
ADC1012D080HN/C1:5
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →ADC1112D125HN-C18
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →ADC1613D080HN-C1 Tỷ lệ tối đa & tính chất điện
| Độ phân giải | 16 bit |
| Number of Channels | 2 (dual) |
| Architecture | Pipelined |
| Sample Rate (max) | 80 MSPS |
| Sample Rate Family | 65 / 80 / 105 / 125 MSPS grades |
| Output Interface | JESD204A (serial) |
| Hộp | 56-VFQFN exposed pad (HVQFN-56, MO-220 / SOT684-7) |
| Package Body Size | 8 mm x 8 mm |
| Package Height | 0.85 mm |
| Số chân | 56 |
| Screening Level | Industrial |
| Nhiệt độ hoạt động | -40 C to +85 C |
| Kiểu lắp đặt | Surface Mount |
| Manufacturer | Renesas Electronics (formerly IDT) |
Cấu hình chân ADC1613D080HN-C1
| Chân 1 | GND — Ground (analog/digital common) |
| Chân 2 | VA1P2 — 1.2 V analog supply, channel 1 |
| Chân 3 | VIN1A — Analog input, channel 1 (positive) |
| Chân 4 | VIN1B — Analog input, channel 1 (negative / complement) |
| Chân 5 | VCM1 — Common-mode voltage reference, channel 1 |
| Chân 6 | CLKINP — Differential clock input (positive) |
| Chân 7 | CLKINN — Differential clock input (negative) |
| Chân 8 | VA3P3 — 3.3 V analog supply |
| Chân 9 | GND — Ground |
| Chân 10 | VA1P2 — 1.2 V analog supply |
| Chân 11 | VCM2 — Common-mode voltage reference, channel 2 |
| Chân 12 | VIN2B — Analog input, channel 2 (negative / complement) |
| Chân 13 | VIN2A — Analog input, channel 2 (positive) |
| Chân 14 | VA1P2 — 1.2 V analog supply, channel 2 |
| Chân 15 | GND — Ground |
| Chân 16 | VA1P2 — 1.2 V digital supply |
| Chân 17 | VD1P2 — 1.2 V digital core supply |
| Chân 18 | GND — Ground |
| Chân 19 | SDO — SPI serial data output for register access |
| Chân 20 | SDI — SPI serial data input for register access |
| Chân 21 | SCLK — SPI serial clock |
| Chân 22 | CSN — SPI chip select (active low) |
| Chân 23 | RESETN — Hardware reset (active low) |
| Chân 24 | PDN — Power-down (active high) |
| Chân 25 | GND — Ground |
| Chân 26 | VD3P3 — 3.3 V digital I/O supply |
| Chân 27 | SYSREF — JESD204A system reference signal |
| Chân 28 | SYNCBN — JESD204A sync request (active low) |
| Chân 29 | GND — Ground |
| Chân 30 | DOUTP — JESD204A CML serial data output (positive) |
| Chân 31 | DOUTN — JESD204A CML serial data output (negative) |
| Chân 32 | GND — Ground |
| Chân 33 | NC — Not connected (per datasheet) |
| Chân 34 | NC — Not connected (per datasheet) |
| Chân 35 | GND — Ground |
| Chân 36 | NC — Not connected (per datasheet) |
| Chân 37 | NC — Not connected (per datasheet) |
| Chân 38 | VA1P2 — 1.2 V analog supply |
| Chân 39 | VA1P2 — 1.2 V analog supply |
| Chân 40 | GND — Ground |
| Chân 41 | VA1P2 — 1.2 V analog supply |
| Chân 42 | NC — Not connected (per datasheet) |
| Chân 43 | NC — Not connected (per datasheet) |
| Chân 44 | NC — Not connected (per datasheet) |
| Chân 45 | NC — Not connected (per datasheet) |
| Chân 46 | VD3P3 — 3.3 V digital I/O supply |
| Chân 47 | GND — Ground |
| Chân 48 | VD1P2 — 1.2 V digital core supply |
| Chân 49 | GND — Ground |
| Chân 50 | VA3P3 — 3.3 V analog supply |
| Chân 51 | NC — Not connected (per datasheet) |
| Chân 52 | NC — Not connected (per datasheet) |
| Chân 53 | VA1P2 — 1.2 V analog supply |
| Chân 54 | GND — Ground |
| Chân 55 | NC — Not connected (per datasheet) |
| Chân 56 | NC — Not connected (per datasheet) |
Ứng dụng tiêu biểu
ADC1613D080HN-C1 phù hợp cho 6 Áp dụngs: Wireless Base-Station Receiver Cards, Software-Defined Radio (SDR) Front-Ends, Medical Imaging Ultrasound Beamformers, Phased-Array Radar Digitisation, High-Channel-Count Industrial Data Acquisition, Direct-Conversion Zero-IF Receivers.
Wireless Base-Station Receiver Cards
The ADC1613D080HN-C1's dual 16-bit channels and 80 MSPS throughput make it well suited to multi-carrier cellular base-station observation receivers where two antenna streams must be digitised simultaneously. The JESD204A serialiser consolidates the data lanes into a single high-speed CML pair, simplifying PCB routing on densely populated receiver cards. Compared with two parallel-LVDS ADCs, the JESD204A interface eliminates wide bus matching and slashes FPGA pin count, while 80 MSPS comfortably handles several LTE carriers of baseband bandwidth per channel.
Được đề xuất
Software-Defined Radio (SDR) Front-Ends
Software-defined radio platforms benefit from the ADC1613D080HN-C1 because the 80 MSPS sample rate covers most narrowband and many wideband waveforms up to roughly 30 MHz of alias-protected bandwidth per Nyquist zone. The dual channel pairing supports direct-conversion I/Q sampling without an external analog quadrature splitter, eliminating I/Q amplitude and phase mismatch that degrades image rejection. The JESD204A interface streams the I/Q data directly into the FPGA's JESD204A IP core, removing LVDS bus skeW issues that plague wide parallel interfaces in SDR hardware.
Được đề xuất
Medical Imaging Ultrasound Beamformers
In multi-channel ultrasound beamformer front-ends, the ADC1613D080HN-C1 serves as a per-channel digitiser with enough speed (80 MSPS) to satisfy 2x oversampling of 30 MHz piezo transducer bandwidth while keeping noise and power low per channel. The dual channels can digitise two adjacent transducer elements with sample-aligned clocks, simplifying the FPGA's beamforming math. Industrial -40 C to +85 C operation also supports portable cart-based ultrasound systems used outside clinical environments.
Được đề xuất
Phased-Array Radar Digitisation
Phased-array radar modules need many tightly synchronised ADC channels, and the ADC1613D080HN-C1 fits as a two-element digitiser block with the JESD204A deterministic latency that radar beam steering requires. 80 MSPS comfortably digitises S-band baseband radar returns after analog down-conversion, and the HVQFN-56 exposed-pad package allows dense tiling of many converter ICs behind each antenna sub-array. Multi-channel sample coherence is maintained because all ADCs in the array can share the same device clock and frame clock.
Được đề xuất
High-Channel-Count Industrial Data Acquisition
Industrial data-acquisition backplanes digitising vibration, acoustic emission, or power-quality signals can deploy the ADC1613D080HN-C1 as a per-slot dual-channel front end. The 80 MSPS throughput oversamples most sensor bandwidths sufficiently for anti-aliasing, while the industrial -40 C to +85 C rating suits factory-floor enclosures. JESD204A serialisation concentrates the data onto a single backplane serialiser, allowing more ADC channels per slot than legacy parallel-LVDS designs could achieve.
Được đề xuất
Direct-Conversion Zero-IF Receivers
Zero-IF receivers downconvert RF signals directly to baseband I and Q streams, and the ADC1613D080HN-C1 digitises both I and Q channels simultaneously using its dual 16-bit cores. 80 MSPS oversamples typical 20 MHz-wide zero-IF baseband signals by 2x, easing analog filter roll-off requirements. The JESD204A serial output streams the I/Q samples deterministically into the demodulator FPGA, preserving the channel-matched timing essential for accurate I/Q demodulation.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho ADC1613D080HN-C1 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | ADC1613D065HN-C1 | ADC1613D105HN-C1 | ADC1613D125HN-C1 | ADC1613D080HN/C1:5 | ADC1012D080HN/C1:5 |
|---|---|---|---|---|---|---|
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Package | 56-VFQFN exposed pad (HVQFN-56, 8x8 mm) | 56-VFQFN exposed pad (HVQFN-56, 8x8 mm) - same | 56-VFQFN exposed pad (HVQFN-56, 8x8 mm) - same | 56-VFQFN exposed pad (HVQFN-56, 8x8 mm) - same | 56-VFQFN exposed pad (HVQFN-56, 8x8 mm) - same | 56-VFQFN exposed pad (HVQFN-56, 8x8 mm) - same |
| Resolution | 16 bit | 16 bit | 16 bit | 16 bit | 16 bit | 10 bit (lower) |
| Max Sample Rate | 80 MSPS | 65 MSPS (-18.75%) | 105 MSPS (+31%) | 125 MSPS (+56%) | 80 MSPS (same) | 80 MSPS (same) |
| Number of Channels | 2 (dual) | 2 (dual) | 2 (dual) | 2 (dual) | 2 (dual) | 2 (dual) |
| Output Interface | JESD204A | JESD204A | JESD204A | JESD204A | JESD204A | JESD204A |
| Approximate Unit Price (qty 100) | USD 38.10 | USD ~30-33 (lower throughput discount) | USD ~42-45 (higher throughput premium) | USD ~50-55 (highest throughput premium) | USD ~38 (same die) | USD ~25 (lower resolution) |
Bảo phân biệt quan trọng
- Pin-compatible speed grade across the ADC1613D family (vsADC1613D065HN-C1)
- Lower power than the 125 MSPS grade at identical footprint (vsADC1613D125HN-C1)
- Higher resolution than the 10-bit ADC1012D080HN at the same speed (vsADC1012D080HN/C1:5)
Ghi chú thiết kế
The HVQFN-56 exposed thermal pad must be soldered to a PCB copper pour that occupies at least 1 square cm of continuous copper on the top layer and is stitched with a 4 x 4 grid of 0.3 mm thermal vias to inner ground planes. Estimated: at 80 MSPS, full-clock dual-channel operation, the ADC1613D080HN-C1 dissipates roughly 200-300 mW (typical analog supply current is 1.9 V times <150 mA per datasheet estimates); without the thermal pad stitched, the junction temperature can exceed the 125 C absolute maximum at ambient >85 C. Designers should leave the factory land pattern unchanged and not route signal traces under the thermal pad.
Place all 1.2 V and 3.3 V decoupling capacitors within 5 mm of their respective pins, using a 100 nF X7R bypass for every supply pin and a 10 uF X5R bulk capacitor on each supply rail near the package. The differential clock pair (CLKINP / CLKINN) and the JESD204A CML output pair (DOUTP / DOUTN) must be routed as 100 ohm differential transmission lines with length matching within 0.5 mm; route these on a stripline layer referenced to a solid ground plane for clean 80 MHz and 5 GHz spectra. Avoid crossing the analog input traces under the digital outputs to prevent digital coupling into the ADC front end.
Estimated: the JESD204A subclass 1 deterministic latency requires a SYSREF signal that is phase-aligned to CLKIN; if SYSREF skew exceeds one CLKIN period, the link will intermittently lose synchronisation and produce corrupted output frames. Do not insert a non-zero-length clock buffer between the FPGA and the ADC's CLKIN pins unless the buffer delay is also compensated in the SYSREF path. Also, the part's hardware RESETN assertion of at least 100 ns is required after power supply rails are stable; pulsing RESETN too early leaves SPI registers in an indeterminate state and causes apparent link training failures.
Thông tin tuân thủ
RoHS compliance inferred from package datasheet summary; explicit REACH statement, halogen-free status, and conflict-minerals declaration not present in the verified source data - explicitly verify with Renesas product compliance letter for production builds.
