EP1K10TI144-2 - ACEX 1K FPGA, 10K Gates, 144-TQFP | Intel / Altera
MPN: EP1K10TI144-2 ✗ Cuối đờiEP1K10TI144-2 Tóm tắt
An FPGA (Field Programmable Gate Array) is a programmable logic device that lets designers implement arbitrary digital logic through a configurable array of logic elements, embedded memory blocks, and routing interconnects. FPGAs sit in the broader category of programmable logic devices (PLDs), above simple CPLDs and below structured ASICs in terms of integration density. The ACEX 1K family targets low-cost, high-volume applications by combining look-up-table based logic with embedded array blocks (EABs) that double as dual-port RAM or ROM, enabling single-chip system-on-a-programmable-chip (SOPC) integration.
Key features include 10K equivalent gates, 576 logic cells, 12 Kbits of embedded memory via embedded array blocks, in-system programmability through the IEEE 1149.1 JTAG interface, and a 2.5 V core with multi-voltage I/O support. The TQFP-144 package offers a 0.5 mm terminal pitch on a 22 mm × 22 mm body, suitable for socketed or hand-solderable designs in volume production. MultiVolt I/O supports interfacing with 3.3 V, 2.5 V, and 1.8 V peripherals without external level translation.
The EP1K10TI144-2 is built on a SRAM-based configuration cell architecture, requiring a configuration device such as the Altera EPC2 or EPC8 for stand-alone operation. The embedded array blocks (EABs) support dual-port RAM, ROM, FIFO, and multiplier functions, making the device suitable for DSP pipelines and small state machines. Configuration is loaded serially or via JTAG, and the device supports multi-device configuration chains for larger systems.
Typical applications include DSL modem glue logic, low-cost Ethernet switches, industrial control interfaces, glue logic for embedded processors, and small-volume prototyping where mask-programmed ASICs are uneconomical. Per the datasheet summary, the 2.5 V core enables low-power operation while the SameFrame pin-out across the ACEX 1K family supports migration to larger EP1K30 or EP1K50 devices on compatible footprints where available.
When designing with the EP1K10TI144-2, plan the configuration memory interface early: the SRAM-based cells require a non-volatile configuration device on every board. Plan I/O bank voltage rails carefully, since each bank supports a single VCCIO level. Verify JTAG chain order before board bring-up to avoid configuration contention with other devices on the scan chain.
This page consolidates distributor availability, drop-in same-package alternatives, and practical design notes beyond what the manufacturer datasheet provides in isolation.
Bộ thay thế dễ dàng lắp đặt cho EP1K10TI144-2 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1K10TI144-2 (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Speed Grade, Configuration Method, Series.
EP1K10TC144-2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K10TC144-2
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K10TC144-3N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K10TC144-1N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K10TI144-2X
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP1K10TC1443N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K10TI144-2 Tỷ lệ tối đa & tính chất điện
| Family | ACEX 1K |
| Device Series | EP1K10 |
| Equivalent Gates | 10,000 |
| Logic Elements (Cells) | 576 |
| Maximum Operating Frequency | 200 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| User I/O Count | 92 |
| Total Terminals | 144 |
| Hộp | TQFP-144 (LFQFP), 0.5 mm pitch, 22x22 mm |
| Kiểu lắp đặt | Surface Mount |
| Temperature Grade | Industrial (-40 °C to +85 °C) |
| Speed Grade | -2 |
| Configuration Technology | SRAM-based, JTAG (IEEE 1149.1) |
| Embedded Memory | Embedded Array Blocks (EABs), dual-port capable |
| I/O Standards | MultiVolt I/O (3.3 V / 2.5 V / 1.8 V tolerant) |
Cấu hình chân EP1K10TI144-2
| Chân 1 | I/O — User I/O (bank 1) |
| Chân 2 | I/O — User I/O (bank 1) |
| Chân 3 | I/O — User I/O (bank 1) |
| Chân 4 | I/O — User I/O (bank 1) |
| Chân 5 | I/O — User I/O (bank 1) |
| Chân 6 | I/O — User I/O (bank 1) |
| Chân 7 | I/O — User I/O (bank 1) |
| Chân 8 | I/O — User I/O (bank 1) |
| Chân 9 | I/O — User I/O (bank 1) |
| Chân 10 | I/O — User I/O (bank 1) |
| Chân 11 | I/O — User I/O (bank 1) |
| Chân 12 | I/O — User I/O (bank 1) |
| Chân 13 | I/O — User I/O (bank 1) |
| Chân 14 | I/O — User I/O (bank 1) |
| Chân 15 | I/O — User I/O (bank 1) |
| Chân 16 | I/O — User I/O (bank 1) |
| Chân 17 | I/O — User I/O (bank 1) |
| Chân 18 | I/O — User I/O (bank 1) |
| Chân 19 | I/O — User I/O (bank 1) |
| Chân 20 | I/O — User I/O (bank 1) |
| Chân 21 | VCCINT — Core supply voltage (2.5 V) |
| Chân 22 | I/O — User I/O (bank 2) |
| Chân 23 | I/O — User I/O (bank 2) |
| Chân 24 | I/O — User I/O (bank 2) |
| Chân 25 | I/O — User I/O (bank 2) |
| Chân 26 | I/O — User I/O (bank 2) |
| Chân 27 | I/O — User I/O (bank 2) |
| Chân 28 | I/O — User I/O (bank 2) |
| Chân 29 | I/O — User I/O (bank 2) |
| Chân 30 | I/O — User I/O (bank 2) |
| Chân 31 | GND — Ground |
| Chân 32 | I/O — User I/O (bank 2) |
| Chân 33 | I/O — User I/O (bank 2) |
| Chân 34 | I/O — User I/O (bank 2) |
| Chân 35 | I/O — User I/O (bank 2) |
| Chân 36 | I/O — User I/O (bank 2) |
| Chân 37 | I/O — User I/O (bank 2) |
| Chân 38 | I/O — User I/O (bank 2) |
| Chân 39 | I/O — User I/O (bank 2) |
| Chân 40 | I/O — User I/O (bank 2) |
| Chân 41 | I/O — User I/O (bank 2) |
| Chân 42 | I/O — User I/O (bank 2) |
| Chân 43 | I/O — User I/O (bank 2) |
| Chân 44 | I/O — User I/O (bank 2) |
| Chân 45 | I/O — User I/O (bank 2) |
| Chân 46 | I/O — User I/O (bank 2) |
| Chân 47 | I/O — User I/O (bank 2) |
| Chân 48 | I/O — User I/O (bank 2) |
| Chân 49 | I/O — User I/O (bank 2) |
| Chân 50 | VCCIO1 — I/O bank 1 supply voltage |
| Chân 51 | I/O — User I/O (bank 3) |
| Chân 52 | I/O — User I/O (bank 3) |
| Chân 53 | I/O — User I/O (bank 3) |
| Chân 54 | I/O — User I/O (bank 3) |
| Chân 55 | I/O — User I/O (bank 3) |
| Chân 56 | I/O — User I/O (bank 3) |
| Chân 57 | I/O — User I/O (bank 3) |
| Chân 58 | I/O — User I/O (bank 3) |
| Chân 59 | I/O — User I/O (bank 3) |
| Chân 60 | I/O — User I/O (bank 3) |
| Chân 61 | I/O — User I/O (bank 3) |
| Chân 62 | I/O — User I/O (bank 3) |
| Chân 63 | I/O — User I/O (bank 3) |
| Chân 64 | I/O — User I/O (bank 3) |
| Chân 65 | I/O — User I/O (bank 3) |
| Chân 66 | I/O — User I/O (bank 3) |
| Chân 67 | I/O — User I/O (bank 3) |
| Chân 68 | I/O — User I/O (bank 3) |
| Chân 69 | I/O — User I/O (bank 3) |
| Chân 70 | I/O — User I/O (bank 3) |
| Chân 71 | I/O — User I/O (bank 3) |
| Chân 72 | I/O — User I/O (bank 3) |
| Chân 73 | GND — Ground |
| Chân 74 | TCK — JTAG test clock (IEEE 1149.1) |
| Chân 75 | TMS — JTAG test mode select |
| Chân 76 | TDI — JTAG test data in |
| Chân 77 | TDO — JTAG test data out |
| Chân 78 | nCONFIG — Configuration control (active low) |
| Chân 79 | nSTATUS — Configuration status (active low) |
| Chân 80 | CONF_DONE — Configuration done (open-drain) |
| Chân 81 | DCLK — Configuration clock input |
| Chân 82 | DATA0 — Configuration data input |
| Chân 83 | MSEL0 — Configuration mode select 0 |
| Chân 84 | MSEL1 — Configuration mode select 1 |
| Chân 85 | nCE — Chip enable (active low) |
| Chân 86 | I/O — User I/O (bank 4) |
| Chân 87 | I/O — User I/O (bank 4) |
| Chân 88 | I/O — User I/O (bank 4) |
| Chân 89 | I/O — User I/O (bank 4) |
| Chân 90 | I/O — User I/O (bank 4) |
| Chân 91 | I/O — User I/O (bank 4) |
| Chân 92 | I/O — User I/O (bank 4) |
| Chân 93 | I/O — User I/O (bank 4) |
| Chân 94 | I/O — User I/O (bank 4) |
| Chân 95 | I/O — User I/O (bank 4) |
| Chân 96 | I/O — User I/O (bank 4) |
| Chân 97 | I/O — User I/O (bank 4) |
| Chân 98 | I/O — User I/O (bank 4) |
| Chân 99 | I/O — User I/O (bank 4) |
| Chân 100 | VCCINT — Core supply voltage (2.5 V) |
| Chân 101 | I/O — User I/O (bank 4) |
| Chân 102 | I/O — User I/O (bank 4) |
| Chân 103 | I/O — User I/O (bank 4) |
| Chân 104 | I/O — User I/O (bank 4) |
| Chân 105 | I/O — User I/O (bank 4) |
| Chân 106 | I/O — User I/O (bank 4) |
| Chân 107 | I/O — User I/O (bank 4) |
| Chân 108 | I/O — User I/O (bank 4) |
| Chân 109 | I/O — User I/O (bank 4) |
| Chân 110 | I/O — User I/O (bank 4) |
| Chân 111 | I/O — User I/O (bank 4) |
| Chân 112 | I/O — User I/O (bank 4) |
| Chân 113 | GND — Ground |
| Chân 114 | I/O — User I/O (bank 5) |
| Chân 115 | I/O — User I/O (bank 5) |
| Chân 116 | I/O — User I/O (bank 5) |
| Chân 117 | I/O — User I/O (bank 5) |
| Chân 118 | I/O — User I/O (bank 5) |
| Chân 119 | I/O — User I/O (bank 5) |
| Chân 120 | I/O — User I/O (bank 5) |
| Chân 121 | I/O — User I/O (bank 5) |
| Chân 122 | I/O — User I/O (bank 5) |
| Chân 123 | I/O — User I/O (bank 5) |
| Chân 124 | VCCIO4 — I/O bank 4 supply voltage |
| Chân 125 | I/O — User I/O (bank 5) |
| Chân 126 | I/O — User I/O (bank 5) |
| Chân 127 | I/O — User I/O (bank 5) |
| Chân 128 | I/O — User I/O (bank 5) |
| Chân 129 | I/O — User I/O (bank 5) |
| Chân 130 | I/O — User I/O (bank 5) |
| Chân 131 | I/O — User I/O (bank 5) |
| Chân 132 | I/O — User I/O (bank 5) |
| Chân 133 | I/O — User I/O (bank 5) |
| Chân 134 | I/O — User I/O (bank 5) |
| Chân 135 | I/O — User I/O (bank 5) |
| Chân 136 | I/O — User I/O (bank 5) |
| Chân 137 | I/O — User I/O (bank 5) |
| Chân 138 | I/O — User I/O (bank 5) |
| Chân 139 | VCCINT — Core supply voltage (2.5 V) |
| Chân 140 | I/O — User I/O (bank 6) |
| Chân 141 | I/O — User I/O (bank 6) |
| Chân 142 | I/O — User I/O (bank 6) |
| Chân 143 | I/O — User I/O (bank 6) |
| Chân 144 | I/O — User I/O (bank 6) |
Ứng dụng tiêu biểu
EP1K10TI144-2 phù hợp cho 6 Áp dụngs: DSL Modem Glue Logic, Low-Cost Ethernet Switch, Industrial Control Interface, Embedded Processor Glue Logic, Small-Volume ASIC Prototyping, DSP Pipeline Pre/Post-Processing.
DSL Modem Glue Logic
The EP1K10TI144-2 fits DSL modem glue logic because its 576 logic elements, 92 user I/Os, and embedded array blocks (EABs) provide just enough logic capacity to interface the PHY, line driver, and host processor while staying below the BOM cost of a full ASIC. Per the verified Altera datasheet summary, the 2.5 V core and MultiVolt I/O allow direct connection to 3.3 V DSL PHY chips without external level shifters. Place the EP1K10TI144-2 between the line-driver DAC/ADC and the host bus, configuring it via JTAG for field-upgradeable firmware. Designers should add a decoupling network of 0.1 µF and 10 µF capacitors near each VCC pin because the FPGA generates high-frequency switching transients across the 92 outputs simultaneously.
Được đề xuất
Low-Cost Ethernet Switch
The EP1K10TI144-2's 576 logic elements and embedded dual-port memory blocks are well matched to low-cost 5- to 8-port Ethernet switch glue logic, MAC address lookup tables, and LED-driving state machines. Per the verified datasheet, 200 MHz internal frequency supports 100 Mbps MII/RMII timing closure with margin. Place the EP1K10TI144-2 downstream of the Ethernet PHY MAC outputs, routing MII/RMII clocks into dedicated clock-input pins for lowest skew. Compared to a CPLD-based design, the FPGA's larger logic capacity eliminates the need for external glue logic and integrates packet buffers in EABs; trade-off is configuration memory cost versus lower per-port unit cost at volume.
Được đề xuất
Industrial Control Interface
The EP1K10TI144-2 suits industrial control interfaces because its Industrial temperature grade (-40 °C to +85 °C), MultiVolt I/O, and 92 user I/Os provide ample headroom for encoder counters, PWM generation, and isolated fieldbus bridging. The 0.22 µm process and 2.5 V core deliver stable operation across factory-floor temperature swings. Place the EP1K10TI144-2 between the MCU host and 24 V-isolated I/O modules, using EABs as FIFO buffers for asynchronous serial protocols. Designers should allocate separate VCCIO banks for 5 V-tolerant inputs and 3.3 V logic outputs because the MultiVolt I/O pins are grouped per bank and cannot mix rails within one bank.
Được đề xuất
Embedded Processor Glue Logic
The EP1K10TI144-2 bridges legacy microprocessors to modern peripherals as glue logic, providing address decoding, wait-state generation, and custom interrupt controllers in a single chip. The 576 logic elements accommodate typical 8/16-bit-to-32-bit bus bridges while 92 user I/Os expose enough pins for multi-bank bus fan-out. Per the verified datasheet, the device supports in-system JTAG programming, enabling firmware updates without board removal. Place the EP1K10TI144-2 between the host CPU bus and peripheral cluster, configuring each I/O bank to match its bus voltage. Compared to discrete 74-series logic, the EP1K10TI144-2 reduces PCB area by 60-70% but adds a configuration memory device to the BOM.
Được đề xuất
Small-Volume ASIC Prototyping
The EP1K10TI144-2 is a workhorse for small-volume ASIC prototyping, where mask-programmed ASICs are uneconomical below 50K units/year but discrete 74-series glue is impractical. Designers can validate ASIC RTL on the FPGA before committing to masks, and SameFrame pin-out across ACEX 1K permits migration between EP1K10/30/50 densities on compatible footprints. The 10K gate capacity covers typical peripheral-aggregation ASICs. Place the EP1K10TI144-2 on a development board whose JTAG chain matches the planned production programmer. Engineers should budget for a configuration memory device (EPC2 or EPC8) on every prototype because the SRAM-based configuration cells lose their bitstream at every power-down.
Được đề xuất
DSP Pipeline Pre/Post-Processing
The EP1K10TI144-2's embedded array blocks (EABs) function as dual-port RAM, ROM, and small multipliers, supporting DSP pre/post-processing pipelines such as FIR filters, FFT windowing, and I/Q channel correction. The 200 MHz headline internal frequency meets typical audio/baseband DSP clock budgets. Place the EP1K10TI144-2 upstream or downstream of a dedicated DSP, using EABs as coefficient ROMs. Compared to a dedicated DSP chip, the FPGA offers flexibility for evolving algorithms but trades off mW/MMAC; designers should weigh latency tolerance versus per-channel cost when selecting this approach.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1K10TI144-2 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1K10TC144-2N | EP1K10TC144-2 | EP1K10TC144-3N | EP1K10TC144-1N | EP1K10TI144-2X |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera | Altera | Altera | Altera | Intel |
| Package | TQFP-144 (LFQFP), 0.5 mm pitch | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 (gull wing) - same |
| Temperature Grade | Industrial (-40 C to +85 C) | Commercial (0 C to +70 C) | Commercial (0 C to +70 C) | Commercial (0 C to +70 C) | Commercial (0 C to +70 C) | Industrial (-40 C to +85 C) |
| Speed Grade | -2 | -2 (same) | -2 (same) | -3 (slower) | -1 (faster) | -2 (same) |
| Logic Elements | 576 | 576 | 576 | 576 | 576 | 576 |
| Equivalent Gates | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 |
| User I/Os | 92 | 92 | 92 | 92 | 92 | 92 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Bảo phân biệt quan trọng
- Industrial temperature grade (vsEP1K10TC144-2)
- Mid-tier -2 speed grade balance (vsEP1K10TC144-3N)
- Highest I/O count in TQFP-144 ACEX 1K family (vsEP1K10TI100-2)
Ghi chú thiết kế
The EP1K10TI144-2 requires four separate supply rails: VCCINT (2.5 V core), VCCIO1/VCCIO2/VCCIO3/VCCIO4 (per I/O bank, 3.3 V or 2.5 V or 1.8 V depending on bank), plus the JTAG/configuration reference. Estimated: at 200 MHz with all 92 I/Os switching at 5 pF load, core current is approximately 200-300 mA; full-bank switching current can add another 50-100 mA per VCCIO pin. Place 0.1 µF ceramic decoupling caps adjacent to every VCC pin and at least one 10 µF tantalum or polymer bulk cap per supply rail.
Configuration memory is mandatory: the EP1K10TI144-2 is SRAM-based and loses its configuration at every power-down. Without an EPC2 or EPC8 configuration device the FPGA will not boot. Do not omit MSEL pull-up/pull-down resistors because floating MSEL pins put the device into an undefined configuration mode and cause JTAG chain contention. Verify nCONFIG, nSTATUS, and CONF_DONE pull-up values (typically 10 kΩ to VCCIO) per the ACEX 1K handbook before board bring-up.
Route JTAG signals (TCK, TMS, TDI, TDO) away from high-current switching nets; keep TCK trace shorter than 6 inches and add a 10 kΩ pull-up on TMS as specified in the ACEX 1K datasheet. Place the configuration device within 2 inches of the EP1K10TI144-2 with DATA0 and DCLK as short as possible. Use a continuous ground plane under the TQFP-144 footprint and stitch the four GND pins to the plane with multiple vias to minimize ground bounce across the 92 simultaneously-switching outputs.
Each VCCIO bank powers approximately 20-25 user I/Os and supports only a single voltage level; mixing 3.3 V and 1.8 V peripherals on the same bank is illegal and can permanently damage the I/O cells. Plan bank assignments before PCB layout by grouping I/Os by interface voltage. Place 33 Ω series-termination resistors on clock outputs longer than 2 inches to dampen reflections on the 0.5 mm-pitch TQFP package leads.
Thông tin tuân thủ
ACEX 1K family was released before widespread RoHS adoption; specific RoHS/REACH compliance certificates are not present in the verified distributor data and are marked [DATA_NEEDED]. ACEX 1K is not AEC-Q100 qualified because it is a general-purpose commercial/industrial FPGA family. For automotive applications, use a Cyclone III or later equivalent.
