EP1K10TI144-2 - ACEX 1K FPGA, 10K Gates, 144-TQFP | Intel / Altera
Référence : EP1K10TI144-2 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $21.8 | $2 180,00 |
| 500 | $18.9 | $9 450,00 |
| 1 000 | $16.4 | $16 400,00 |
EP1K10TI144-2 Présentation
An FPGA (Field Programmable Gate Array) is a programmable logic device that lets designers implement arbitrary digital logic through a configurable array of logic elements, embedded memory blocks, and routing interconnects. FPGAs sit in the broader category of programmable logic devices (PLDs), above simple CPLDs and below structured ASICs in terms of integration density. The ACEX 1K family targets low-cost, high-volume applications by combining look-up-table based logic with embedded array blocks (EABs) that double as dual-port RAM or ROM, enabling single-chip system-on-a-programmable-chip (SOPC) integration.
Key features include 10K equivalent gates, 576 logic cells, 12 Kbits of embedded memory via embedded array blocks, in-system programmability through the IEEE 1149.1 JTAG interface, and a 2.5 V core with multi-voltage I/O support. The TQFP-144 package offers a 0.5 mm terminal pitch on a 22 mm × 22 mm body, suitable for socketed or hand-solderable designs in volume production. MultiVolt I/O supports interfacing with 3.3 V, 2.5 V, and 1.8 V peripherals without external level translation.
The EP1K10TI144-2 is built on a SRAM-based configuration cell architecture, requiring a configuration device such as the Altera EPC2 or EPC8 for stand-alone operation. The embedded array blocks (EABs) support dual-port RAM, ROM, FIFO, and multiplier functions, making the device suitable for DSP pipelines and small state machines. Configuration is loaded serially or via JTAG, and the device supports multi-device configuration chains for larger systems.
Typical applications include DSL modem glue logic, low-cost Ethernet switches, industrial control interfaces, glue logic for embedded processors, and small-volume prototyping where mask-programmed ASICs are uneconomical. Per the datasheet summary, the 2.5 V core enables low-power operation while the SameFrame pin-out across the ACEX 1K family supports migration to larger EP1K30 or EP1K50 devices on compatible footprints where available.
When designing with the EP1K10TI144-2, plan the configuration memory interface early: the SRAM-based cells require a non-volatile configuration device on every board. Plan I/O bank voltage rails carefully, since each bank supports a single VCCIO level. Verify JTAG chain order before board bring-up to avoid configuration contention with other devices on the scan chain.
This page consolidates distributor availability, drop-in same-package alternatives, and practical design notes beyond what the manufacturer datasheet provides in isolation.
Alternatives de remplacement direct pour EP1K10TI144-2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1K10TI144-2 (même facteur de forme et même empreinte) — différant par Package, Process Technology, Speed Grade, Configuration Method, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1K10TC144-2N
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →EP1K10TC144-2
✅ Remplacement direct✓ En stock
$11.9 / unité
Voir la fiche technique →EP1K10TC144-3N
✅ Remplacement direct✓ En stock
$10.5 / unité
Voir la fiche technique →EP1K10TC144-1N
✅ Remplacement direct✓ En stock
$4.35 / unité
Voir la fiche technique →EP1K10TI144-2X
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP1K10TC1443N
✅ Remplacement direct✓ En stock
$22.95 / unité
Voir la fiche technique →EP1K10TI144-2 Valeurs maximales et caractéristiques électriques
| Family | ACEX 1K |
| Device Series | EP1K10 |
| Equivalent Gates | 10,000 |
| Logic Elements (Cells) | 576 |
| Maximum Operating Frequency | 200 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| User I/O Count | 92 |
| Total Terminals | 144 |
| Boîtier | TQFP-144 (LFQFP), 0.5 mm pitch, 22x22 mm |
| Type de montage | Surface Mount |
| Temperature Grade | Industrial (-40 °C to +85 °C) |
| Speed Grade | -2 |
| Configuration Technology | SRAM-based, JTAG (IEEE 1149.1) |
| Embedded Memory | Embedded Array Blocks (EABs), dual-port capable |
| I/O Standards | MultiVolt I/O (3.3 V / 2.5 V / 1.8 V tolerant) |
Configuration des broches de EP1K10TI144-2
| Broche 1 | I/O — User I/O (bank 1) |
| Broche 2 | I/O — User I/O (bank 1) |
| Broche 3 | I/O — User I/O (bank 1) |
| Broche 4 | I/O — User I/O (bank 1) |
| Broche 5 | I/O — User I/O (bank 1) |
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| Broche 9 | I/O — User I/O (bank 1) |
| Broche 10 | I/O — User I/O (bank 1) |
| Broche 11 | I/O — User I/O (bank 1) |
| Broche 12 | I/O — User I/O (bank 1) |
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| Broche 15 | I/O — User I/O (bank 1) |
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| Broche 18 | I/O — User I/O (bank 1) |
| Broche 19 | I/O — User I/O (bank 1) |
| Broche 20 | I/O — User I/O (bank 1) |
| Broche 21 | VCCINT — Core supply voltage (2.5 V) |
| Broche 22 | I/O — User I/O (bank 2) |
| Broche 23 | I/O — User I/O (bank 2) |
| Broche 24 | I/O — User I/O (bank 2) |
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| Broche 28 | I/O — User I/O (bank 2) |
| Broche 29 | I/O — User I/O (bank 2) |
| Broche 30 | I/O — User I/O (bank 2) |
| Broche 31 | GND — Ground |
| Broche 32 | I/O — User I/O (bank 2) |
| Broche 33 | I/O — User I/O (bank 2) |
| Broche 34 | I/O — User I/O (bank 2) |
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| Broche 47 | I/O — User I/O (bank 2) |
| Broche 48 | I/O — User I/O (bank 2) |
| Broche 49 | I/O — User I/O (bank 2) |
| Broche 50 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 51 | I/O — User I/O (bank 3) |
| Broche 52 | I/O — User I/O (bank 3) |
| Broche 53 | I/O — User I/O (bank 3) |
| Broche 54 | I/O — User I/O (bank 3) |
| Broche 55 | I/O — User I/O (bank 3) |
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| Broche 63 | I/O — User I/O (bank 3) |
| Broche 64 | I/O — User I/O (bank 3) |
| Broche 65 | I/O — User I/O (bank 3) |
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| Broche 67 | I/O — User I/O (bank 3) |
| Broche 68 | I/O — User I/O (bank 3) |
| Broche 69 | I/O — User I/O (bank 3) |
| Broche 70 | I/O — User I/O (bank 3) |
| Broche 71 | I/O — User I/O (bank 3) |
| Broche 72 | I/O — User I/O (bank 3) |
| Broche 73 | GND — Ground |
| Broche 74 | TCK — JTAG test clock (IEEE 1149.1) |
| Broche 75 | TMS — JTAG test mode select |
| Broche 76 | TDI — JTAG test data in |
| Broche 77 | TDO — JTAG test data out |
| Broche 78 | nCONFIG — Configuration control (active low) |
| Broche 79 | nSTATUS — Configuration status (active low) |
| Broche 80 | CONF_DONE — Configuration done (open-drain) |
| Broche 81 | DCLK — Configuration clock input |
| Broche 82 | DATA0 — Configuration data input |
| Broche 83 | MSEL0 — Configuration mode select 0 |
| Broche 84 | MSEL1 — Configuration mode select 1 |
| Broche 85 | nCE — Chip enable (active low) |
| Broche 86 | I/O — User I/O (bank 4) |
| Broche 87 | I/O — User I/O (bank 4) |
| Broche 88 | I/O — User I/O (bank 4) |
| Broche 89 | I/O — User I/O (bank 4) |
| Broche 90 | I/O — User I/O (bank 4) |
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| Broche 92 | I/O — User I/O (bank 4) |
| Broche 93 | I/O — User I/O (bank 4) |
| Broche 94 | I/O — User I/O (bank 4) |
| Broche 95 | I/O — User I/O (bank 4) |
| Broche 96 | I/O — User I/O (bank 4) |
| Broche 97 | I/O — User I/O (bank 4) |
| Broche 98 | I/O — User I/O (bank 4) |
| Broche 99 | I/O — User I/O (bank 4) |
| Broche 100 | VCCINT — Core supply voltage (2.5 V) |
| Broche 101 | I/O — User I/O (bank 4) |
| Broche 102 | I/O — User I/O (bank 4) |
| Broche 103 | I/O — User I/O (bank 4) |
| Broche 104 | I/O — User I/O (bank 4) |
| Broche 105 | I/O — User I/O (bank 4) |
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| Broche 108 | I/O — User I/O (bank 4) |
| Broche 109 | I/O — User I/O (bank 4) |
| Broche 110 | I/O — User I/O (bank 4) |
| Broche 111 | I/O — User I/O (bank 4) |
| Broche 112 | I/O — User I/O (bank 4) |
| Broche 113 | GND — Ground |
| Broche 114 | I/O — User I/O (bank 5) |
| Broche 115 | I/O — User I/O (bank 5) |
| Broche 116 | I/O — User I/O (bank 5) |
| Broche 117 | I/O — User I/O (bank 5) |
| Broche 118 | I/O — User I/O (bank 5) |
| Broche 119 | I/O — User I/O (bank 5) |
| Broche 120 | I/O — User I/O (bank 5) |
| Broche 121 | I/O — User I/O (bank 5) |
| Broche 122 | I/O — User I/O (bank 5) |
| Broche 123 | I/O — User I/O (bank 5) |
| Broche 124 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 125 | I/O — User I/O (bank 5) |
| Broche 126 | I/O — User I/O (bank 5) |
| Broche 127 | I/O — User I/O (bank 5) |
| Broche 128 | I/O — User I/O (bank 5) |
| Broche 129 | I/O — User I/O (bank 5) |
| Broche 130 | I/O — User I/O (bank 5) |
| Broche 131 | I/O — User I/O (bank 5) |
| Broche 132 | I/O — User I/O (bank 5) |
| Broche 133 | I/O — User I/O (bank 5) |
| Broche 134 | I/O — User I/O (bank 5) |
| Broche 135 | I/O — User I/O (bank 5) |
| Broche 136 | I/O — User I/O (bank 5) |
| Broche 137 | I/O — User I/O (bank 5) |
| Broche 138 | I/O — User I/O (bank 5) |
| Broche 139 | VCCINT — Core supply voltage (2.5 V) |
| Broche 140 | I/O — User I/O (bank 6) |
| Broche 141 | I/O — User I/O (bank 6) |
| Broche 142 | I/O — User I/O (bank 6) |
| Broche 143 | I/O — User I/O (bank 6) |
| Broche 144 | I/O — User I/O (bank 6) |
Applications typiques
EP1K10TI144-2 convient pour 6 applications: DSL Modem Glue Logic, Low-Cost Ethernet Switch, Industrial Control Interface, Embedded Processor Glue Logic, Small-Volume ASIC Prototyping, DSP Pipeline Pre/Post-Processing.
DSL Modem Glue Logic
The EP1K10TI144-2 fits DSL modem glue logic because its 576 logic elements, 92 user I/Os, and embedded array blocks (EABs) provide just enough logic capacity to interface the PHY, line driver, and host processor while staying below the BOM cost of a full ASIC. Per the verified Altera datasheet summary, the 2.5 V core and MultiVolt I/O allow direct connection to 3.3 V DSL PHY chips without external level shifters. Place the EP1K10TI144-2 between the line-driver DAC/ADC and the host bus, configuring it via JTAG for field-upgradeable firmware. Designers should add a decoupling network of 0.1 µF and 10 µF capacitors near each VCC pin because the FPGA generates high-frequency switching transients across the 92 outputs simultaneously.
Recommandé
Low-Cost Ethernet Switch
The EP1K10TI144-2's 576 logic elements and embedded dual-port memory blocks are well matched to low-cost 5- to 8-port Ethernet switch glue logic, MAC address lookup tables, and LED-driving state machines. Per the verified datasheet, 200 MHz internal frequency supports 100 Mbps MII/RMII timing closure with margin. Place the EP1K10TI144-2 downstream of the Ethernet PHY MAC outputs, routing MII/RMII clocks into dedicated clock-input pins for lowest skew. Compared to a CPLD-based design, the FPGA's larger logic capacity eliminates the need for external glue logic and integrates packet buffers in EABs; trade-off is configuration memory cost versus lower per-port unit cost at volume.
Recommandé
Industrial Control Interface
The EP1K10TI144-2 suits industrial control interfaces because its Industrial temperature grade (-40 °C to +85 °C), MultiVolt I/O, and 92 user I/Os provide ample headroom for encoder counters, PWM generation, and isolated fieldbus bridging. The 0.22 µm process and 2.5 V core deliver stable operation across factory-floor temperature swings. Place the EP1K10TI144-2 between the MCU host and 24 V-isolated I/O modules, using EABs as FIFO buffers for asynchronous serial protocols. Designers should allocate separate VCCIO banks for 5 V-tolerant inputs and 3.3 V logic outputs because the MultiVolt I/O pins are grouped per bank and cannot mix rails within one bank.
Recommandé
Embedded Processor Glue Logic
The EP1K10TI144-2 bridges legacy microprocessors to modern peripherals as glue logic, providing address decoding, wait-state generation, and custom interrupt controllers in a single chip. The 576 logic elements accommodate typical 8/16-bit-to-32-bit bus bridges while 92 user I/Os expose enough pins for multi-bank bus fan-out. Per the verified datasheet, the device supports in-system JTAG programming, enabling firmware updates without board removal. Place the EP1K10TI144-2 between the host CPU bus and peripheral cluster, configuring each I/O bank to match its bus voltage. Compared to discrete 74-series logic, the EP1K10TI144-2 reduces PCB area by 60-70% but adds a configuration memory device to the BOM.
Recommandé
Small-Volume ASIC Prototyping
The EP1K10TI144-2 is a workhorse for small-volume ASIC prototyping, where mask-programmed ASICs are uneconomical below 50K units/year but discrete 74-series glue is impractical. Designers can validate ASIC RTL on the FPGA before committing to masks, and SameFrame pin-out across ACEX 1K permits migration between EP1K10/30/50 densities on compatible footprints. The 10K gate capacity covers typical peripheral-aggregation ASICs. Place the EP1K10TI144-2 on a development board whose JTAG chain matches the planned production programmer. Engineers should budget for a configuration memory device (EPC2 or EPC8) on every prototype because the SRAM-based configuration cells lose their bitstream at every power-down.
Recommandé
DSP Pipeline Pre/Post-Processing
The EP1K10TI144-2's embedded array blocks (EABs) function as dual-port RAM, ROM, and small multipliers, supporting DSP pre/post-processing pipelines such as FIR filters, FFT windowing, and I/Q channel correction. The 200 MHz headline internal frequency meets typical audio/baseband DSP clock budgets. Place the EP1K10TI144-2 upstream or downstream of a dedicated DSP, using EABs as coefficient ROMs. Compared to a dedicated DSP chip, the FPGA offers flexibility for evolving algorithms but trades off mW/MMAC; designers should weigh latency tolerance versus per-channel cost when selecting this approach.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1K10TI144-2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1K10TC144-2N | EP1K10TC144-2 | EP1K10TC144-3N | EP1K10TC144-1N | EP1K10TI144-2X |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera | Altera | Altera | Altera | Intel |
| Package | TQFP-144 (LFQFP), 0.5 mm pitch | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 (gull wing) - same |
| Temperature Grade | Industrial (-40 C to +85 C) | Commercial (0 C to +70 C) | Commercial (0 C to +70 C) | Commercial (0 C to +70 C) | Commercial (0 C to +70 C) | Industrial (-40 C to +85 C) |
| Speed Grade | -2 | -2 (same) | -2 (same) | -3 (slower) | -1 (faster) | -2 (same) |
| Logic Elements | 576 | 576 | 576 | 576 | 576 | 576 |
| Equivalent Gates | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 |
| User I/Os | 92 | 92 | 92 | 92 | 92 | 92 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Industrial temperature grade (vs EP1K10TC144-2)
- Mid-tier -2 speed grade balance (vs EP1K10TC144-3N)
- Highest I/O count in TQFP-144 ACEX 1K family (vs EP1K10TI100-2)
Notes de conception
The EP1K10TI144-2 requires four separate supply rails: VCCINT (2.5 V core), VCCIO1/VCCIO2/VCCIO3/VCCIO4 (per I/O bank, 3.3 V or 2.5 V or 1.8 V depending on bank), plus the JTAG/configuration reference. Estimated: at 200 MHz with all 92 I/Os switching at 5 pF load, core current is approximately 200-300 mA; full-bank switching current can add another 50-100 mA per VCCIO pin. Place 0.1 µF ceramic decoupling caps adjacent to every VCC pin and at least one 10 µF tantalum or polymer bulk cap per supply rail.
Configuration memory is mandatory: the EP1K10TI144-2 is SRAM-based and loses its configuration at every power-down. Without an EPC2 or EPC8 configuration device the FPGA will not boot. Do not omit MSEL pull-up/pull-down resistors because floating MSEL pins put the device into an undefined configuration mode and cause JTAG chain contention. Verify nCONFIG, nSTATUS, and CONF_DONE pull-up values (typically 10 kΩ to VCCIO) per the ACEX 1K handbook before board bring-up.
Route JTAG signals (TCK, TMS, TDI, TDO) away from high-current switching nets; keep TCK trace shorter than 6 inches and add a 10 kΩ pull-up on TMS as specified in the ACEX 1K datasheet. Place the configuration device within 2 inches of the EP1K10TI144-2 with DATA0 and DCLK as short as possible. Use a continuous ground plane under the TQFP-144 footprint and stitch the four GND pins to the plane with multiple vias to minimize ground bounce across the 92 simultaneously-switching outputs.
Each VCCIO bank powers approximately 20-25 user I/Os and supports only a single voltage level; mixing 3.3 V and 1.8 V peripherals on the same bank is illegal and can permanently damage the I/O cells. Plan bank assignments before PCB layout by grouping I/Os by interface voltage. Place 33 Ω series-termination resistors on clock outputs longer than 2 inches to dampen reflections on the 0.5 mm-pitch TQFP package leads.
Informations de conformité
ACEX 1K family was released before widespread RoHS adoption; specific RoHS/REACH compliance certificates are not present in the verified distributor data and are marked [DATA_NEEDED]. ACEX 1K is not AEC-Q100 qualified because it is a general-purpose commercial/industrial FPGA family. For automotive applications, use a Cyclone III or later equivalent.
