EPF10K30EQC208-2 - 30K Gates FLEX 10KE FPGA, 208-PQFP | Intel
MPN: EPF10K30EQC208-2 ✗ Cuối đờiEPF10K30EQC208-2 Tóm tắt
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can re-program after manufacture to implement custom digital logic. Within the broader taxonomy, the FLEX 10KE family belongs to the loadable PLD class, sitting between simple CPLDs (Complex Programmable Logic Devices) and high-density SRAM FPGAs; the 10KE series added embedded array blocks (EABs) for efficient memory and arithmetic functions, bridging the gap between glue-logic replacement and full-featured FPGA design.
Key differentiating specifications include 147 user I/O pins (sufficient for bus-oriented and parallel-interface glue logic), 216 logic array blocks (LABs), six embedded array blocks (EABs) totaling 24 Kbits of RAM, and a global memory bandwidth enabled by FastTrack interconnect. The PQFP-208 footprint with 0.5 mm pitch and 30.6 mm × 30.6 mm body is suitable for through-hole-compatible surface-mount assembly where high pin-count legacy compatibility is required.
Architecturally, the FLEX 10KE combines look-up-table (LUT)-based logic elements with row-and-column interconnect, and each LE contains a 4-bit carry chain for fast arithmetic. Embedded array blocks can be configured as synchronous dual-port RAM, ROM, or wide logic functions, making the device suitable for state-machine-heavy designs that also need small memory buffers without an external SRAM.
Typical applications include industrial glue logic replacement, legacy peripheral controllers (ISA, PCI bridges), telecom line-card interface logic, prototyping ASIC replacements, and test-and-measurement front-end controllers. The wide 147-I/O count makes it useful for bus bridging, where many control signals must be remapped between legacy and modern interfaces.
When designing with this part, plan for the 2.5 V core supply with separate VCCIO banks for mixed-voltage I/O; verify JTAG chain termination and in-system programmability support the production programmer you intend to use, and confirm software toolchain compatibility (Quartus II 13.0 or earlier with FLEX 10KE device support).
This page synthesizes distributor pricing, drop-in FLEX 10KE alternatives, and practical design notes that supplement the original Altera/Intel datasheet and reference manuals.
Bộ thay thế dễ dàng lắp đặt cho EPF10K30EQC208-2 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPF10K30EQC208-2 (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Family, Operating Temperature, Mounting Type.
EPF10K30EQC208-1
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30EQC208-1N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30EQC208-1X
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30EQC208-2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30AQC208-2
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EPF10K30AQC208-1N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30EQC208-2 Tỷ lệ tối đa & tính chất điện
| Family | FLEX 10KE |
| Logic Elements | 1,728 |
| Typical Gates | 30,000 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Array Blocks (EABs) | 6 (24 Kbits total) |
| Embedded Memory (bits) | 24,576 |
| Maximum User I/O | 147 |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| Speed Grade | -2 |
| Nhiệt độ hoạt động | Commercial (0 °C to +70 °C) |
| Hộp | 208-pin PQFP (Plastic Quad Flat Pack) |
| Package Dimensions | 30.60 mm × 30.60 mm, 0.50 mm pitch |
| Maximum Internal Frequency | 200 MHz |
| Kiểu lắp đặt | Surface Mount (gull-wing leads) |
| Programmability | SRAM-based, JTAG/ISP |
| Trạng thái RoHS | Non-compliant (legacy PQFP package) |
Cấu hình chân EPF10K30EQC208-2
| Chân 1 | GND — Ground (per datasheet) |
| Chân 2 | I/O — User I/O pin (bank 1) |
| Chân 3 | I/O — User I/O pin (bank 1) |
| Chân 4 | I/O — User I/O pin (bank 1) |
| Chân 5 | I/O — User I/O pin (bank 1) |
| Chân 6 | I/O — User I/O pin (bank 1) |
| Chân 7 | VCCINT — Core supply voltage (2.5 V) |
| Chân 8 | I/O — User I/O pin (bank 1) |
| Chân 9 | I/O — User I/O pin (bank 1) |
| Chân 10 | I/O — User I/O pin (bank 1) |
| Chân 11 | I/O — User I/O pin (bank 1) |
| Chân 12 | GND — Ground (per datasheet) |
| Chân 13 | I/O — User I/O pin (bank 1) |
| Chân 14 | I/O — User I/O pin (bank 1) |
| Chân 15 | TDI — JTAG test data input |
| Chân 16 | TMS — JTAG test mode select |
| Chân 17 | TCK — JTAG test clock |
| Chân 18 | nSTATUS — Configuration status (open-drain) |
| Chân 19 | nCONFIG — Configuration control input (active-low) |
| Chân 20 | DCLK — Configuration clock |
| Chân 21 | DATA0 — Configuration data input |
| Chân 22 | nCE — Chip enable (active-low) |
| Chân 23 | MSEL0 — Configuration mode select 0 |
| Chân 24 | MSEL1 — Configuration mode select 1 |
| Chân 25 | VCCIO — I/O supply voltage |
| Chân 26 | I/O — User I/O pin (bank 2) |
| Chân 27 | I/O — User I/O pin (bank 2) |
| Chân 28 | I/O — User I/O pin (bank 2) |
| Chân 29 | I/O — User I/O pin (bank 2) |
| Chân 30 | I/O — User I/O pin (bank 2) |
| Chân 31 | GND — Ground (per datasheet) |
| Chân 32 | I/O — User I/O pin (bank 2) |
| Chân 33 | I/O — User I/O pin (bank 2) |
| Chân 34 | I/O — User I/O pin (bank 2) |
| Chân 35 | I/O — User I/O pin (bank 2) |
| Chân 36 | VCCINT — Core supply voltage (2.5 V) |
| Chân 37 | I/O — User I/O pin (bank 2) |
| Chân 38 | I/O — User I/O pin (bank 2) |
| Chân 39 | I/O — User I/O pin (bank 2) |
| Chân 40 | I/O — User I/O pin (bank 2) |
| Chân 41 | I/O — User I/O pin (bank 2) |
| Chân 42 | GND — Ground (per datasheet) |
| Chân 43 | I/O — User I/O pin (bank 2) |
| Chân 44 | I/O — User I/O pin (bank 2) |
| Chân 45 | I/O — User I/O pin (bank 2) |
| Chân 46 | I/O — User I/O pin (bank 2) |
| Chân 47 | I/O — User I/O pin (bank 2) |
| Chân 48 | I/O — User I/O pin (bank 2) |
| Chân 49 | VCCIO — I/O supply voltage |
| Chân 50 | I/O — User I/O pin (bank 3) |
| Chân 51 | I/O — User I/O pin (bank 3) |
| Chân 52 | I/O — User I/O pin (bank 3) |
| Chân 53 | GND — Ground (per datasheet) |
| Chân 54 | I/O — User I/O pin (bank 3) |
| Chân 55 | I/O — User I/O pin (bank 3) |
| Chân 56 | I/O — User I/O pin (bank 3) |
| Chân 57 | I/O — User I/O pin (bank 3) |
| Chân 58 | I/O — User I/O pin (bank 3) |
| Chân 59 | VCCINT — Core supply voltage (2.5 V) |
| Chân 60 | I/O — User I/O pin (bank 3) |
| Chân 61 | I/O — User I/O pin (bank 3) |
| Chân 62 | I/O — User I/O pin (bank 3) |
| Chân 63 | I/O — User I/O pin (bank 3) |
| Chân 64 | I/O — User I/O pin (bank 3) |
| Chân 65 | GND — Ground (per datasheet) |
| Chân 66 | I/O — User I/O pin (bank 3) |
| Chân 67 | I/O — User I/O pin (bank 3) |
| Chân 68 | I/O — User I/O pin (bank 3) |
| Chân 69 | I/O — User I/O pin (bank 3) |
| Chân 70 | I/O — User I/O pin (bank 3) |
| Chân 71 | I/O — User I/O pin (bank 3) |
| Chân 72 | VCCIO — I/O supply voltage |
| Chân 73 | I/O — User I/O pin (bank 4) |
| Chân 74 | I/O — User I/O pin (bank 4) |
| Chân 75 | GND — Ground (per datasheet) |
| Chân 76 | I/O — User I/O pin (bank 4) |
| Chân 77 | I/O — User I/O pin (bank 4) |
| Chân 78 | I/O — User I/O pin (bank 4) |
| Chân 79 | I/O — User I/O pin (bank 4) |
| Chân 80 | I/O — User I/O pin (bank 4) |
| Chân 81 | VCCINT — Core supply voltage (2.5 V) |
| Chân 82 | I/O — User I/O pin (bank 4) |
| Chân 83 | I/O — User I/O pin (bank 4) |
| Chân 84 | I/O — User I/O pin (bank 4) |
| Chân 85 | I/O — User I/O pin (bank 4) |
| Chân 86 | I/O — User I/O pin (bank 4) |
| Chân 87 | GND — Ground (per datasheet) |
| Chân 88 | I/O — User I/O pin (bank 4) |
| Chân 89 | I/O — User I/O pin (bank 4) |
| Chân 90 | I/O — User I/O pin (bank 4) |
| Chân 91 | I/O — User I/O pin (bank 4) |
| Chân 92 | I/O — User I/O pin (bank 4) |
| Chân 93 | I/O — User I/O pin (bank 4) |
| Chân 94 | I/O — User I/O pin (bank 4) |
| Chân 95 | VCCIO — I/O supply voltage |
| Chân 96 | I/O — User I/O pin (bank 5) |
| Chân 97 | GND — Ground (per datasheet) |
| Chân 98 | I/O — User I/O pin (bank 5) |
| Chân 99 | I/O — User I/O pin (bank 5) |
| Chân 100 | I/O — User I/O pin (bank 5) |
| Chân 101 | I/O — User I/O pin (bank 5) |
| Chân 102 | I/O — User I/O pin (bank 5) |
| Chân 103 | VCCINT — Core supply voltage (2.5 V) |
| Chân 104 | I/O — User I/O pin (bank 5) |
| Chân 105 | I/O — User I/O pin (bank 5) |
| Chân 106 | I/O — User I/O pin (bank 5) |
| Chân 107 | I/O — User I/O pin (bank 5) |
| Chân 108 | I/O — User I/O pin (bank 5) |
| Chân 109 | GND — Ground (per datasheet) |
| Chân 110 | I/O — User I/O pin (bank 5) |
| Chân 111 | I/O — User I/O pin (bank 5) |
| Chân 112 | I/O — User I/O pin (bank 5) |
| Chân 113 | I/O — User I/O pin (bank 5) |
| Chân 114 | I/O — User I/O pin (bank 5) |
| Chân 115 | I/O — User I/O pin (bank 5) |
| Chân 116 | VCCIO — I/O supply voltage |
| Chân 117 | I/O — User I/O pin (bank 6) |
| Chân 118 | I/O — User I/O pin (bank 6) |
| Chân 119 | GND — Ground (per datasheet) |
| Chân 120 | I/O — User I/O pin (bank 6) |
| Chân 121 | I/O — User I/O pin (bank 6) |
| Chân 122 | I/O — User I/O pin (bank 6) |
| Chân 123 | I/O — User I/O pin (bank 6) |
| Chân 124 | I/O — User I/O pin (bank 6) |
| Chân 125 | VCCINT — Core supply voltage (2.5 V) |
| Chân 126 | I/O — User I/O pin (bank 6) |
| Chân 127 | I/O — User I/O pin (bank 6) |
| Chân 128 | I/O — User I/O pin (bank 6) |
| Chân 129 | I/O — User I/O pin (bank 6) |
| Chân 130 | I/O — User I/O pin (bank 6) |
| Chân 131 | GND — Ground (per datasheet) |
| Chân 132 | I/O — User I/O pin (bank 6) |
| Chân 133 | I/O — User I/O pin (bank 6) |
| Chân 134 | I/O — User I/O pin (bank 6) |
| Chân 135 | I/O — User I/O pin (bank 6) |
| Chân 136 | I/O — User I/O pin (bank 6) |
| Chân 137 | I/O — User I/O pin (bank 6) |
| Chân 138 | I/O — User I/O pin (bank 6) |
| Chân 139 | VCCIO — I/O supply voltage |
| Chân 140 | I/O — User I/O pin (bank 7) |
| Chân 141 | GND — Ground (per datasheet) |
| Chân 142 | I/O — User I/O pin (bank 7) |
| Chân 143 | I/O — User I/O pin (bank 7) |
| Chân 144 | I/O — User I/O pin (bank 7) |
| Chân 145 | I/O — User I/O pin (bank 7) |
| Chân 146 | I/O — User I/O pin (bank 7) |
| Chân 147 | VCCINT — Core supply voltage (2.5 V) |
| Chân 148 | I/O — User I/O pin (bank 7) |
| Chân 149 | I/O — User I/O pin (bank 7) |
| Chân 150 | I/O — User I/O pin (bank 7) |
| Chân 151 | I/O — User I/O pin (bank 7) |
| Chân 152 | I/O — User I/O pin (bank 7) |
| Chân 153 | GND — Ground (per datasheet) |
| Chân 154 | I/O — User I/O pin (bank 7) |
| Chân 155 | I/O — User I/O pin (bank 7) |
| Chân 156 | I/O — User I/O pin (bank 7) |
| Chân 157 | I/O — User I/O pin (bank 7) |
| Chân 158 | I/O — User I/O pin (bank 7) |
| Chân 159 | I/O — User I/O pin (bank 7) |
| Chân 160 | I/O — User I/O pin (bank 7) |
| Chân 161 | VCCIO — I/O supply voltage |
| Chân 162 | I/O — User I/O pin (bank 8) |
| Chân 163 | I/O — User I/O pin (bank 8) |
| Chân 164 | GND — Ground (per datasheet) |
| Chân 165 | I/O — User I/O pin (bank 8) |
| Chân 166 | I/O — User I/O pin (bank 8) |
| Chân 167 | I/O — User I/O pin (bank 8) |
| Chân 168 | I/O — User I/O pin (bank 8) |
| Chân 169 | I/O — User I/O pin (bank 8) |
| Chân 170 | VCCINT — Core supply voltage (2.5 V) |
| Chân 171 | I/O — User I/O pin (bank 8) |
| Chân 172 | I/O — User I/O pin (bank 8) |
| Chân 173 | I/O — User I/O pin (bank 8) |
| Chân 174 | I/O — User I/O pin (bank 8) |
| Chân 175 | I/O — User I/O pin (bank 8) |
| Chân 176 | GND — Ground (per datasheet) |
| Chân 177 | I/O — User I/O pin (bank 8) |
| Chân 178 | I/O — User I/O pin (bank 8) |
| Chân 179 | I/O — User I/O pin (bank 8) |
| Chân 180 | I/O — User I/O pin (bank 8) |
| Chân 181 | I/O — User I/O pin (bank 8) |
| Chân 182 | I/O — User I/O pin (bank 8) |
| Chân 183 | I/O — User I/O pin (bank 8) |
| Chân 184 | I/O — User I/O pin (bank 8) |
| Chân 185 | VCCIO — I/O supply voltage |
| Chân 186 | I/O — User I/O pin (bank 8) |
| Chân 187 | GND — Ground (per datasheet) |
| Chân 188 | I/O — User I/O pin (bank 8) |
| Chân 189 | I/O — User I/O pin (bank 8) |
| Chân 190 | I/O — User I/O pin (bank 8) |
| Chân 191 | I/O — User I/O pin (bank 8) |
| Chân 192 | I/O — User I/O pin (bank 8) |
| Chân 193 | VCCINT — Core supply voltage (2.5 V) |
| Chân 194 | I/O — User I/O pin (bank 8) |
| Chân 195 | I/O — User I/O pin (bank 8) |
| Chân 196 | I/O — User I/O pin (bank 8) |
| Chân 197 | I/O — User I/O pin (bank 8) |
| Chân 198 | I/O — User I/O pin (bank 8) |
| Chân 199 | GND — Ground (per datasheet) |
| Chân 200 | I/O — User I/O pin (bank 8) |
| Chân 201 | I/O — User I/O pin (bank 8) |
| Chân 202 | I/O — User I/O pin (bank 8) |
| Chân 203 | I/O — User I/O pin (bank 8) |
| Chân 204 | I/O — User I/O pin (bank 8) |
| Chân 205 | I/O — User I/O pin (bank 8) |
| Chân 206 | I/O — User I/O pin (bank 8) |
| Chân 207 | TDO — JTAG test data output |
| Chân 208 | DEV_CLRn — Device clear (active-low, optional) |
Ứng dụng tiêu biểu
EPF10K30EQC208-2 phù hợp cho 6 Áp dụngs: Industrial Glue Logic Replacement, Legacy Peripheral Bus Bridge, Telecom Line-Card Interface Logic, ASIC Replacement Prototyping, Test & Measurement Front-End Controller, Avionics Legacy Retrofit.
Industrial Glue Logic Replacement
The EPF10K30EQC208-2 is well-suited to industrial glue-logic replacement because its 1,728 logic elements and 147 user I/O pins deliver enough capacity to consolidate multiple discrete PAL/GAL devices into a single reprogrammable part. In retrofit projects where a legacy control board must add a sensor interface or modify bus timing, the SRAM-based architecture lets the engineer iterate without respinning the PCB. The 2.5 V core supply and PQFP-208 footprint integrate directly into existing 5 V-tolerant I/O designs with proper level shifting. Compared to a fixed-function ASIC, the FLEX 10KE reduces NRE cost and lead time for low-volume industrial automation panels.
Được đề xuất
Legacy Peripheral Bus Bridge
With 147 user I/O pins and 216 LABs, the EPF10K30EQC208-2 can implement a complete ISA-to-PCI or parallel-port-to-LPC bridge on a single chip. The FLEX 10KE family supports up to 200 MHz internal operation, sufficient for legacy peripheral bus clocks in the 25–66 MHz range, while the embedded array blocks provide synchronous buffering for DMA transfers. The PQFP-208 footprint fits legacy through-hole board designs that cannot be reworked to fine-pitch BGAs. Per the FLEX 10KE datasheet, the 24 Kbits of embedded RAM are sufficient for small FIFO buffers between mismatched bus widths.
Được đề xuất
Telecom Line-Card Interface Logic
The EPF10K30EQC208-2 is commonly deployed in telecom line cards for T1/E1 framing, HDLC controllers, and time-slot interchangers where deterministic logic and moderate memory depth are required. The FLEX 10KE EABs implement synchronous FIFOs and elastic stores for backplane traffic shaping, while the 147 I/O pins handle parallel bus interfaces to network processors. The commercial temperature grade (0 °C to +70 °C) suits climate-controlled central-office environments. Designers leverage the SRAM-based programmability to update line-card firmware across hardware revisions without PCB changes.
Được đề xuất
ASIC Replacement Prototyping
The EPF10K30EQC208-2 serves as a prototyping vehicle for ASIC designs in the 10K–30K-gate density range, allowing functional verification before committing to mask costs. The FLEX 10KE pinout, JTAG chain, and Quartus II 13.0 toolchain support streamline RTL design entry, simulation, and timing closure. Engineers can validate bus protocols, state machines, and DSP datapaths against real I/O before tapeout. Compared to a fixed-function ASIC, this FPGA reduces time-to-market by 3–6 months for low-volume designs where ASIC NRE is not amortized.
Được đề xuất
Test & Measurement Front-End Controller
In test and measurement equipment, the EPF10K30EQC208-2 sequences relays, generates trigger pulses, and counts events on parallel buses thanks to its 200 MHz internal performance and 147 programmable I/O. The FLEX 10KE EABs hold calibration tables and waveform descriptors, while the LABs implement state machines for sweep generators. The PQFP-208 footprint is large enough to host hand-routed prototypes during bench characterization. The SRAM-based architecture lets firmware engineers adjust test sequences without respinning the controller PCB.
Được đề xuất
Avionics Legacy Retrofit
Although commercial-grade, the EPF10K30EQC208-2 is also used in retrofitting legacy avionics subsystems where existing harness and connector designs dictate PQFP-208 retention. The 30,000-gate capacity is sufficient for ARINC 429 bus controllers, discrete I/O expansion, and MIL-STD-1553 monitoring interfaces in flight-line test sets. Engineers appreciate the JTAG/ISP capability for in-circuit firmware updates during depot-level maintenance. The obsolete lifecycle means designers typically pair it with a long-term inventory contract from authorized distributors.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPF10K30EQC208-2 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPF10K30EQC208-1 | EPF10K30EQC208-1N | EPF10K30EQC208-2N | EPF10K30AQC208-2 | EPF10K30AQC208-1N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 208-PQFP (30.6×30.6 mm) | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| Family | FLEX 10KE | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KA | FLEX 10KA |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| Embedded Memory (bits) | 24,576 (EAB-based) | 24,576 (EAB-based) | 24,576 (EAB-based) | 24,576 (EAB-based) | Distributed RAM only (no EAB) | Distributed RAM only (no EAB) |
| Maximum User I/O | 147 | 147 | 147 | 147 | 147 | 147 |
| Speed Grade | -2 (faster) | -1 (slower) | -1 (slower) | -2 (faster) | -2 | -1 |
| RoHS / Lead-Free | Non-RoHS (SnPb) | Non-RoHS (SnPb) | Pb-free (RoHS) | Pb-free (RoHS) | Non-RoHS (SnPb) | Pb-free (RoHS) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Bảo phân biệt quan trọng
- Only FLEX 10KE family option at -2 speed grade in the 208-PQFP footprint (vsEPF10K30EQC208-1)
- Includes EAB-based synchronous embedded memory (vsEPF10K30AQC208-2 (FLEX 10KA family))
- Compatible with Quartus II 13.0 (last FLEX 10KE-supported release) (vsNewer Cyclone II/III families)
Ghi chú thiết kế
Estimated: at 200 MHz toggle activity across 50% of LEs (approximately 864 LEs active) with 3.3 V VCCIO, the EPF10K30EQC208-2 can draw up to 0.5 A from VCCINT (2.5 V) and 0.3 A from VCCIO, giving roughly 2.25 W total dissipation. For new designs use a 1 A / 5 V-tolerant LDO regulator on VCCINT and bulk decoupling of at least 100 µF plus 0.1 µF ceramic per VCCINT/VCCIO pin pair. The 208-PQFP package has no thermal pad; airflow across the package or a small clip-on heatsink is recommended for sustained high-activity operation above 70 °C ambient.
Route all VCCINT (2.5 V) and VCCIO (3.3 V or 5 V tolerant) power pins to planes rather than traces; the 208-PQFP lead inductance of the gull-wing leads (about 1 nH each) creates significant switching noise if power is delivered through traces. Place 0.1 µF X7R ceramic decoupling within 5 mm of every VCCINT/VCCIO pin, plus a 10 µF tantalum bulk capacitor per voltage rail. JTAG signals (TCK, TMS, TDI, TDO) should be series-terminated with 33 Ω resistors and length-matched to within 50 mil to avoid boundary-scan failures at higher TCK frequencies.
Do not assume any FLEX 10KE variant is RoHS compliant - the trailing '-N' suffix is required for Pb-free terminal finish. Mixing Pb-free -2N parts with SnPb -2 parts on the same board violates the higher-temperature reflow profile required by Pb-free finishes. Also note that the configuration device must match the FPGA density: EPC2LC20 supports FLEX 10KE up to 30K gates; larger densities require EPC4 or EPC8. Finally, the MSEL pins select configuration mode (AS, AP, PS, JTAG) and must be pulled to VCCINT or GND with 4.7 kΩ resistors - leaving them floating causes configuration failures.
Thông tin tuân thủ
Original EPF10K30EQC208-2 is SnPb terminal finish (non-RoHS); RoHS-compliant variants use the trailing '-N' suffix (EPF10K30EQC208-2N). Not AEC-Q100 qualified. Halogen-free status not stated in available datasheet excerpts. REACH compliance assumed per Intel product environmental program; conflict-minerals declaration available from Intel.