W9751G6KB-25 - 512Mb DDR2-800 SDRAM, x16, 84-WBGA | Winbond
MPN: W9751G6KB-25 ✓ Hoạt độngW9751G6KB-25 Tóm tắt
A DDR2 SDRAM is a volatile random-access memory that transfers data on both the rising and falling edges of the clock, doubling the effective data rate of the underlying SDR bus. DDR2 sits in the SDRAM family hierarchy alongside DDR, DDR3, DDR4, and DDR5, and uses a 4-bit prefetch architecture (vs DDR's 2-bit prefetch) to achieve higher throughput at lower clock frequencies. DDR2 devices remain common in cost-sensitive industrial, automotive infotainment, set-top box, networking, and printer applications where the memory controller already supports the JEDEC DDR2 standard and high-density LPDDR alternatives are unnecessary.
Key features of the W9751G6KB-25 include the x16 organization, programmable CAS latency (typically 3 to 6), programmable burst length of 4 or 8, on-die termination (ODT), and a self-refresh mode for low standby power. The 8K refresh cycles specification (per JEDEC DDR2) supports standard commercial operating profiles, and the 84-ball WBGA package provides short, controlled-impedance signal paths for reliable 800 MT/s operation.
The device is built on a CMOS process and conforms to the JEDEC DDR2 SDRAM standard, enabling drop-in compatibility with other DDR2-compliant memory controllers. Common use cases include frame buffers for displays, working memory for industrial PCs, scratch RAM for Linux/WinCE SoCs, and buffer memory in networking switches.
When designing with the W9751G6KB-25, route the 16-bit data bus (DQ0-DQ15), differential clock pair (CK, /CK), command/address bus, and data strobes (DQS, /DQS) with matched lengths and 50 ohm controlled impedance. Place VTT termination, decoupling capacitors, and VREF generation per JEDEC recommendations to achieve a clean 800 MT/s eye at the receiver.
This page synthesizes distributor pricing for the W9751G6KB-25, drop-in compatible DDR2 alternatives from Winbond and competitors, and practical PCB layout and termination guidance that augments the manufacturer datasheet.
Bộ thay thế dễ dàng lắp đặt cho W9751G6KB-25 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với W9751G6KB-25 (cùng hình factor và footprint) — khác nhau ở Memory Type, Organization, Package, Data Rate, Access Time.
W9751G6KB-18
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
W9751G6KB-25 TR
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MT47H64M16HR-25
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
IS43DR16640B-25
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
NT5CB256M16CP-DI
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →K4T51163QT-BCF8
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
W9751G6KB-25 Tỷ lệ tối đa & tính chất điện
| Kiểu bộ nhớ | Volatile DRAM (DDR2 SDRAM) |
| Kích thước bộ nhớ | 512 Mbit (32M x 16) |
| Tổ chức | 32M words x 16 bits |
| Speed Grade | -25 (DDR2-800) |
| Clock Frequency | 400 MHz |
| Tốc độ dữ liệu | 800 MT/s |
| Access Time | 57.5 ns (CAS latency timing window) |
| Điện áp cung cấp | 1.8 V typical |
| Loại giao diện | Parallel DDR2 (SSTL_18) |
| Hộp | 84-ball WBGA / TFBGA, 8 x 12.5 mm |
| Refresh Cycles | 8K (per JEDEC DDR2 standard) |
| Burst Length | 4 or 8 (programmable) |
| Latency CAS | Programmable (typically 3 to 6) |
| On-Die Termination | Yes (ODT) |
| Self Refresh | Yes |
| Kiểu lắp đặt | Surface Mount |
| Trạng thái RoHS | Compliant |
Cấu hình chân W9751G6KB-25
| Chân A1 | VSS — Ground reference |
| Chân A2 | DQ15 — Data I/O bit 15 |
| Chân A3 | DQ13 — Data I/O bit 13 |
| Chân A4 | DQ11 — Data I/O bit 11 |
| Chân A5 | DQ9 — Data I/O bit 9 |
| Chân A6 | DQ7 — Data I/O bit 7 |
| Chân A7 | DQ4 — Data I/O bit 4 |
| Chân A8 | DQ2 — Data I/O bit 2 |
| Chân A9 | DQ0 — Data I/O bit 0 |
| Chân A10 | VSS — Ground reference |
| Chân B1 | VDDQ — DQ supply voltage |
| Chân B2 | VSSQ — DQ ground reference |
| Chân B3 | DQ14 — Data I/O bit 14 |
| Chân B4 | DQ12 — Data I/O bit 12 |
| Chân B5 | DQ10 — Data I/O bit 10 |
| Chân B6 | DQ6 — Data I/O bit 6 |
| Chân B7 | DQ5 — Data I/O bit 5 |
| Chân B8 | DQ3 — Data I/O bit 3 |
| Chân B9 | DQ1 — Data I/O bit 1 |
| Chân B10 | VDDQ — DQ supply voltage |
| Chân C1 | VSS — Ground reference |
| Chân C2 | UDQS — Upper byte data strobe |
| Chân C3 | UDQS# — Upper byte complementary data strobe |
| Chân C4 | DMU (UDM) — Upper byte data mask |
| Chân C5 | NC — Not connected |
| Chân C6 | VSS — Ground reference |
| Chân C7 | VSS — Ground reference |
| Chân C8 | LDQS — Lower byte data strobe |
| Chân C9 | LDQS# — Lower byte complementary data strobe |
| Chân C10 | VSS — Ground reference |
| Chân D1 | VDD — Core supply voltage |
| Chân D2 | CKE — Clock enable |
| Chân D3 | CK — Differential clock positive |
| Chân D4 | CK# — Differential clock negative |
| Chân D5 | CS# — Chip select (active low) |
| Chân D6 | RAS# — Row address strobe (active low) |
| Chân D7 | CAS# — Column address strobe (active low) |
| Chân D8 | WE# — Write enable (active low) |
| Chân D9 | ODT — On-die termination control |
| Chân D10 | VDD — Core supply voltage |
| Chân E1 | VSS — Ground reference |
| Chân E2 | BA0 — Bank address 0 |
| Chân E3 | BA1 — Bank address 1 |
| Chân E4 | A10 — Address bit 10 / auto-precharge |
| Chân E5 | A3 — Address bit 3 |
| Chân E6 | A2 — Address bit 2 |
| Chân E7 | A1 — Address bit 1 |
| Chân E8 | A0 — Address bit 0 |
| Chân E9 | BA2 — Bank address 2 |
| Chân E10 | VSS — Ground reference |
| Chân F1 | VDDQ — DQ supply voltage |
| Chân F2 | A12 — Address bit 12 |
| Chân F3 | A11 — Address bit 11 |
| Chân F4 | A9 — Address bit 9 |
| Chân F5 | A8 — Address bit 8 |
| Chân F6 | A7 — Address bit 7 |
| Chân F7 | A6 — Address bit 6 |
| Chân F8 | A5 — Address bit 5 |
| Chân F9 | A4 — Address bit 4 |
| Chân F10 | VDDQ — DQ supply voltage |
| Chân G1 | VSS — Ground reference |
| Chân G2 | NC — Not connected (per datasheet) |
| Chân G3 | NC — Not connected (per datasheet) |
| Chân G4 | NC — Not connected (per datasheet) |
| Chân G5 | NC — Not connected (per datasheet) |
| Chân G6 | NC — Not connected (per datasheet) |
| Chân G7 | NC — Not connected (per datasheet) |
| Chân G8 | NC — Not connected (per datasheet) |
| Chân G9 | NC — Not connected (per datasheet) |
| Chân G10 | VSS — Ground reference |
| Chân H1 | VDDQ — DQ supply voltage |
| Chân H2 | NC — Not connected (per datasheet) |
| Chân H3 | NC — Not connected (per datasheet) |
| Chân H4 | NC — Not connected (per datasheet) |
| Chân H5 | NC — Not connected (per datasheet) |
| Chân H6 | NC — Not connected (per datasheet) |
| Chân H7 | NC — Not connected (per datasheet) |
| Chân H8 | NC — Not connected (per datasheet) |
| Chân H9 | NC — Not connected (per datasheet) |
| Chân H10 | VDDQ — DQ supply voltage |
| Chân J1 | VSS — Ground reference |
| Chân J2 | VREF — Reference voltage for SSTL_18 inputs |
| Chân J3 | NC — Not connected (per datasheet) |
| Chân J4 | DML (LDM) — Lower byte data mask |
| Chân J5 | NC — Not connected (per datasheet) |
| Chân J6 | VSS — Ground reference |
| Chân J7 | NC — Not connected (per datasheet) |
| Chân J8 | ZQS0 — Output impedance calibration reference 0 |
| Chân J9 | VTT — Termination voltage |
| Chân J10 | VSS — Ground reference |
Ứng dụng tiêu biểu
W9751G6KB-25 phù hợp cho 7 Áp dụngs: Industrial Embedded PC Working Memory, Set-Top Box and IPTV Frame Buffer, Networking Switch and Router Memory, Automotive Infotainment Working Memory, Printer and MFP Image Buffer, Display Controller Frame Buffer, Point-of-Sale Terminal Memory.
Industrial Embedded PC Working Memory
The W9751G6KB-25 supplies 512 Mbit of DDR2 working memory for industrial motherboards built around x86 SoCs with JEDEC DDR2 controllers. The 800 MT/s data rate and 32Mx16 organization provide sufficient bandwidth for Linux/WinCE OS boot, application loading, and data buffering. Industrial-grade temperature variants of this Winbond part operate from -40C to +85C, suiting factory automation and outdoor kiosks. The 84-ball WBGA keeps the PCB footprint compact, while JEDEC DDR2 conformance ensures the part initializes cleanly with standard DDR2 firmware sequences.
Được đề xuất
Set-Top Box and IPTV Frame Buffer
Set-top boxes use 512 Mbit of DDR2 memory for video frame buffering, codec working memory, and OS tasks. The W9751G6KB-25's 16-bit wide data bus (x16 organization) and 800 MT/s data rate comfortably decode standard-definition and 720p video streams without bus-bottlenecking. The on-die termination (ODT) simplifies PCB routing by eliminating external resistors, reducing BOM cost. The 1.8 V typical supply keeps set-top box power consumption low for energy-efficiency regulations. Designers route CK/CK, DQS/DQS, and command/address with matched lengths for a clean DDR2 eye.
Được đề xuất
Networking Switch and Router Memory
Low-port-count managed switches and SOHO routers require working memory for the switch SoC, packet buffers, and routing tables. The W9751G6KB-25 supplies 64 MB of DDR2 memory in a single chip, sufficient for forwarding tables and firmware scratch space. The 84-ball WBGA package enables compact router designs where PCB area is constrained. The 1.8 V supply and self-refresh mode support low standby power for Energy Star-rated products. Designers should follow JEDEC DDR2 PCB guidelines: 50 ohm controlled-impedance routing, VTT termination, and matched clock/data strobe lengths.
Được đề xuất
Automotive Infotainment Working Memory
The W9751G6KB-25 in industrial temperature grade serves as working memory in automotive infotainment head units and rear-seat entertainment systems. The 32Mx16 DDR2 architecture provides enough bandwidth for navigation map rendering, Bluetooth audio buffering, and OS operations. The 84-ball WBGA withstands automotive thermal cycling and vibration when properly soldered. Automotive OEMs often require dual-source qualification, so designers verify compatibility with Micron MT47H64M16HR-25 or ISSI IS43DR16640B-25 as alternates. DDR2 remains standard in this segment for cost-sensitive platforms with mature DDR2-capable SoCs.
Được đề xuất
Printer and MFP Image Buffer
Multifunction printers (MFPs) use DDR2 SDRAM as an image buffer between the scanner/copier pipeline and the print engine. The W9751G6KB-25's 64 MB capacity holds full-page raster images at 600 dpi and supports duplex scanning with simultaneous image processing. The 1.8 V supply reduces total printer power consumption, an important metric for Energy Star certification. The compact 84-ball WBGA package suits the dense controller board layout inside printers. JEDEC DDR2 conformance means the part initializes with standard DDR2 firmware across multiple printer-controller SoCs.
Được đề xuất
Display Controller Frame Buffer
Industrial HMI panels, medical displays, and digital signage controllers use 512 Mbit DDR2 SDRAM as a frame buffer for driving TFT-LCD panels at 720p to 1080p resolutions. The W9751G6KB-25's x16 data bus and 800 MT/s bandwidth comfortably drive pixel throughput for 60 fps refresh at 1080p. The on-die termination simplifies board layout for the densely-routed data/address/strobe buses typical of display-controller boards. Designers generate V_REF and V_TT from a low-noise LDO and place decoupling capacitors within 5 mm of each supply ball.
Được đề xuất
Point-of-Sale Terminal Memory
Point-of-sale (POS) terminals and kiosks use DDR2 SDRAM as the main working memory for transaction processing, payment applications, and receipt printing. The W9751G6KB-25's 64 MB capacity handles standard POS software stacks with headroom for receipt graphics and customer-facing displays. The 84-ball WBGA package keeps the POS mainboard compact, and the JEDEC DDR2 conformance means the part works with legacy POS SoCs that still rely on DDR2 controllers. Industrial temperature variants support outdoor kiosks and refrigerated retail environments.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho W9751G6KB-25 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | W9751G6KB-18 | MT47H64M16HR-25 | IS43DR16640B-25 | NT5CB256M16CP-DI | K4T51163QT-BCF8 |
|---|---|---|---|---|---|---|
| Package | 84-ball WBGA (8x12.5 mm) | 84-ball WBGA (8x12.5 mm) - same | 84-ball FBGA (8x12.5 mm) - same | 84-ball BGA (8x12.5 mm) - same | 84-ball FBGA (8x12.5 mm) - same | 84-ball FBGA (8x12.5 mm) - same |
| Brand | Winbond Electronics | Winbond Electronics | Micron Technology | ISSI | Nanya Technology | Samsung Electronics |
| Memory Type | DDR2 SDRAM | DDR2 SDRAM | DDR2 SDRAM | DDR2 SDRAM | DDR2 SDRAM | DDR2 SDRAM |
| Memory Size | 512 Mbit (32Mx16) | 512 Mbit (32Mx16) | 512 Mbit (32Mx16) | 512 Mbit (32Mx16) | 512 Mbit (32Mx16) | 512 Mbit (32Mx16) |
| Speed Grade | -25 (DDR2-800) | -18 (DDR2-1066) | -25 (DDR2-800) | -25 (DDR2-800) | DI (DDR2-800) | BCF8 (DDR2-800) |
| Clock Frequency | 400 MHz | 533 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| Data Rate | 800 MT/s | 1066 MT/s | 800 MT/s | 800 MT/s | 800 MT/s | 800 MT/s |
| Supply Voltage | 1.8 V typical | 1.8 V typical | 1.8 V typical | 1.8 V typical | 1.8 V typical | 1.8 V typical |
| On-Die Termination | Yes (ODT) | Yes (ODT) | Yes (ODT) | Yes (ODT) | Yes (ODT) | Yes (ODT) |
| Refresh Cycles | 8K | 8K | 8K | 8K | 8K | 8K |
Bảo phân biệt quan trọng
- Wide multi-source qualification in the same footprint (vsMT47H64M16HR-25)
- Pin-compatible upgrade path to DDR2-1066 (vsW9751G6KB-18)
- JEDEC DDR2 standard conformance with ODT (vsK4T51163QT-BCF8)
Ghi chú thiết kế
Route the 16-bit DQ bus (DQ0-DQ15), differential clock pair (CK, /CK), data strobes (UDQS, UDQS#, LDQS, LDQS#), and command/address bus as 50 ohm controlled-impedance traces on a reference plane. Match clock-to-DQS lengths within +/-25 mils and DQ-to-DQS within +/-50 mils to maintain the DDR2 write/read timing window. Place VTT termination at the far end of the bus with bulk decoupling (>=10 uF) close to the SDRAM, plus 0.1 uF ceramics within 5 mm of each VDD/VDDQ ball.
Generate VDD (1.8 V), VDDQ (1.8 V), VTT (VDDQ/2 = 0.9 V), and VREF (VDDQ/2 = 0.9 V) from low-noise LDOs or synchronous buck converters. VTT must source and sink current during active reads and writes; a tracking regulator that follows VDDQ/2 is recommended. VREF noise must be held under +/-1% to maintain the SSTL_18 input thresholds. Decoupling: 1x 10 uF bulk + 4-6x 0.1 uF ceramics per supply ball group, plus 1x 1 uF on VTT.
Do not exceed the JEDEC DDR2 absolute maximum VDDQ of 2.3 V or minimum of 1.7 V - operation outside this window corrupts the refresh cycle and may damage the device. Do not drive CK without CKE tied high through a valid initialization sequence (NOP -> DESEL -> MRS -> ZQCL) before normal operation. Verify the controller firmware's DDR2 mode register settings match the chosen CAS latency and burst length; mismatches cause subtle read/write errors that are difficult to debug.
DDR2 buses benefit from matched trace lengths and proper termination. Use fly-by VTT routing for point-to-point topologies or T-branch for multi-drop command/address buses. Avoid series resistors on DQ/DQS lines (use ODT instead). For 800 MT/s operation, simulate the channel with IBIS models from Winbond to verify eye margin; typical eye-opening targets are >=250 mV at the receiver pins. Place VREF decoupling (0.1 uF) within 200 mils of the SDRAM VREF pin.
Thông tin tuân thủ
RoHS compliant per Winbond product page and distributor listings (ROHS COMPLIANT noted on Findic listing). Not AEC-Q100 qualified; industrial temperature variants exist but are not AEC-Q100 automotive-grade. Halogen-free and conflict-minerals status not explicitly stated in available data.
