10M50DAF484I7G vs 10M50DAF484I7P 比較
詳細並排比較 10M50DAF484I7G 由 Intel 與 10M50DAF484I7P 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | 10M50DAF484I7G | 10M50DAF484I7P |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | MAX 10 | — |
| Logic Elements (LE) | 50,000 | 50,000 |
| Embedded Memory (bits) | 1,677,312 | 1,677,312 |
| Embedded User Flash (bits) | 1,677,312 (dual configuration) | — |
| User I/O Count | 360 | — |
| 封裝 | 484-ball FBGA (F484) | 484-ball FineLine BGA (F484) |
| Package Pitch | 1.0 mm | — |
| Package Body Size | 23 x 23 mm | — |
| Process Technology | TSMC 55 nm | — |
| Supply Voltage - Core | 1.2 V | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| On-die Configuration Flash | Yes (dual-boot) | Yes (non-volatile, instant-on) |
| Integrated ADC | 12-bit, 1 MSPS, up to 18 channels | — |
| DSP Blocks | 144 (18x18 multipliers) | — |
| PLLs | 4 | 8 (general-purpose, fractional on selected devices) |
| Configuration Mode | Single-chip (no external boot device required) | — |
| 安裝類型 | Surface Mount (FBGA) | — |
| MSL 等級 | 3 (per JEDEC J-STD-020) | — |
| RoHS 狀態 | Compliant | Compliant |
| Lead-free / Halogen-free | Yes / Yes | — |
| Product Family | — | MAX 10 |
| Embedded Memory Blocks | — | M9K (and M144K) |
| 18x18 Multipliers | — | 312 |
| User I/O Pins (max) | — | 360 |
| Pitch | — | 1.0 mm |
| Process Node | — | 55 nm embedded flash (TSMC) |
| On-die ADC | — | Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs |
| Global Clock Networks | — | 20 |
| Speed Grade | — | 7 (slowest industrial bin, highest margin) |
| 工作溫度 | — | -40C to +100C (Tj, industrial) |
| Configuration Modes | — | Internal flash, JTAG, dual-boot image support |