EP2AGZ300FF35I3G vs EP2AGZ300FF35C4N 比較

詳細並排比較 EP2AGZ300FF35I3G 由 Intel 與 EP2AGZ300FF35C4N 由 Altera. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2AGZ300FF35I3G EP2AGZ300FF35C4N
品牌 Intel Altera
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 Obsolete
Family Arria II GZ —
Logic Elements (LE) 300000 —
Number of User I/O 554 (maximum) —
Number of Transceivers 8 —
Transceiver Data Rate Up to 6.375 Gbps —
Process Node 40 nm —
工作溫度 -40C to +100 C (I3 industrial) —
封裝 1152-ball FBGA (FF35) —
安裝類型 Surface Mount Surface Mount
供應電壓 [DATA_NEEDED: core and I/O supply voltage values] —
Embedded Memory (Mbits) 16.4 —
DSP Blocks [DATA_NEEDED: number of DSP blocks] [DATA_NEEDED: number of DSP blocks]
PLLs [DATA_NEEDED: number of PLLs] [DATA_NEEDED: PLL count]
Memory Interfaces DDR3, QDRII+, RLDRAM II —
Configuration Method Serial, Parallel, JTAG —
RoHS 狀態 Compliant Compliant (per Besenchips / DigiKey listing)
MSL 等級 3 (168 hours) —
Lead-Free Yes —
Series — Arria II GZ
Logic Elements — 298,000
Logic Array Blocks (LABs) — 11,920
Embedded Memory (bits) — 18,854,912 (~17.9 Mbit)
User I/O Count — 554
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Process Technology — 40 nm
Core Voltage — 0.9 V
Package Type — 1152-BBGA, FCBGA (flip-chip)
Terminal Form — Ball
Package Code (JEDEC) — HBGA
Operating Temperature Grade — Commercial (C4 = 0C to +85C)
Configuration Memory — SRAM-based (volatile, requires boot device)
Transceivers — Multi-gigabit transceivers integrated
Lead-Free Status — Lead free (per Besenchips listing)
Maximum Operating Frequency — 500 MHz

資料表與資源

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