EP3C16F256C7 vs EP3C16F256I7N 比較

詳細並排比較 EP3C16F256C7 由 Intel 與 EP3C16F256I7N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3C16F256C7 EP3C16F256I7N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Device Type FPGA (Field Programmable Gate Array) —
Device Family Cyclone III —
Logic Cells / Logic Blocks 15,408 —
Embedded Memory 516,096 bit 56 M9K blocks (504 Kbit)
User I/O 168 —
Total Package Pins 256 —
Package Type 256-LBGA (FBGA-256) —
Package Type Designation Other, LEAD FREE, MS-034, FBGA-256 —
安裝類型 Surface mount —
工作溫度 -40 °C to +125 °C (-40 °F to +257 °F) -40C to +100C (industrial, I7)
Lead-Free Status Lead free —
Minimum Operating Supply Voltage [DATA_NEEDED: minimum operating supply voltage] —
Maximum Operating Supply Voltage [DATA_NEEDED: maximum operating supply voltage] —
Core Performance [DATA_NEEDED: core performance rating or maximum operating frequency] —
Embedded Memory Block Count [DATA_NEEDED: embedded memory block count] —
Internal Block RAM Capacity 516,096 bit —
PLL Count [DATA_NEEDED: PLL count] —
Dedicated Multipliers [DATA_NEEDED: dedicated multiplier count] —
RoHS Compliance [DATA_NEEDED: RoHS compliance statement] Compliant
REACH Compliance [DATA_NEEDED: REACH compliance statement] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Family — Cyclone III
Logic Elements (LEs) — 15408
Logic Array Blocks (LABs) — 963
Total Memory Bits — 516096
Embedded 18x18 Multipliers — 56
PLLs — 4
Maximum User I/O Pins — 168
封裝 — 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch)
Supply Voltage (Core) — 1.2 V typical
Process Technology — TSMC 60 nm low-leakage
Configuration — SRAM-based, requires external config device (EPCS/EPCQ)
Lead-Free / Pb-Free — Yes (N suffix per JEDEC JESD97)

資料表與資源

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