EP3SE260H780C4LN vs EP3SE260H780C4L 比較
詳細並排比較 EP3SE260H780C4LN 由 Intel 與 EP3SE260H780C4L 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260H780C4LN | EP3SE260H780C4L |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Embedded Multipliers (18x18) | 384 | — |
| User I/O Count | 488 | 488 |
| 封裝 | 780-ball FCBGA (FineLine BGA) | 780-ball FCBGA (HBGA 33x33 mm) |
| Speed Grade | C4 (commercial, moderate speed) | C4 (middle/slow tier) |
| 工作溫度 | 0C to +85C (commercial) | — |
| Core Voltage (VCC) | 1.0 V | — |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Auxiliary Voltage (VCCPD/VCCPT) | 2.5 V / 3.0 V | — |
| PLLs | 8 | — |
| Global Clock Networks | 16 | — |
| Process Node | 40 nm TSMC | — |
| Configuration Modes | FPP, AS, PS, JTAG | — |
| RoHS 狀態 | Compliant | Compliant (lead-free per datasheet) |
| MSL 等級 | 3 (168 hours) | [DATA_NEEDED: MSL level] |
| LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 (16.7 Mbit) |
| Core Voltage | — | 0.9 V (nominal) |
| 工作接面溫度 | — | 0C to +85C (commercial) |
| 安裝類型 | — | Surface Mount (flip-chip BGA) |
| Transceivers | — | Up to 24 multi-gigabit transceivers |
| Memory Interface | — | DDR3, DDR2, QDRII+, RLDRAM II controllers |
| Configuration Mode | — | PS, FPP, JTAG with EPCS/EPCQ |